JP2017157838A - 発光素子パッケージ - Google Patents
発光素子パッケージ Download PDFInfo
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- JP2017157838A JP2017157838A JP2017055268A JP2017055268A JP2017157838A JP 2017157838 A JP2017157838 A JP 2017157838A JP 2017055268 A JP2017055268 A JP 2017055268A JP 2017055268 A JP2017055268 A JP 2017055268A JP 2017157838 A JP2017157838 A JP 2017157838A
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 10
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- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
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- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
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- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
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- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 description 2
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
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- 229910019897 RuOx Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- DZLPZFLXRVRDAE-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[Al+3].[Zn++].[In+3] Chemical compound [O--].[O--].[O--].[O--].[Al+3].[Zn++].[In+3] DZLPZFLXRVRDAE-UHFFFAOYSA-N 0.000 description 1
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- YZZNJYQZJKSEER-UHFFFAOYSA-N gallium tin Chemical compound [Ga].[Sn] YZZNJYQZJKSEER-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 description 1
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- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- VRIVJOXICYMTAG-IYEMJOQQSA-L iron(ii) gluconate Chemical compound [Fe+2].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O VRIVJOXICYMTAG-IYEMJOQQSA-L 0.000 description 1
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- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
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- 239000010937 tungsten Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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Abstract
Description
Claims (10)
- 上部が開放されたリセスを有する胴体と、
前記胴体に埋設されている第1リードフレーム及び第2リードフレームと、
前記リセス内で前記第1リードフレームの上に配置されている第1発光素子と、
前記リセス内で前記第2リードフレームの上に配置されている第2発光素子と、
前記第1及び第2リードフレームの少なくとも一つの上に配置されている保護素子と、
を含み、
前記胴体は、第1方向に延在する第1長側壁及び第2長側壁、前記第1方向と直交する第2方向に延在する第1短側壁及び第2短側壁、及び底部を有し、
前記第1リードフレームは、前記第1発光素子が配置され、前記胴体の前記底部に露出した第1部分と、前記第1部分から前記第1方向に突出した第2部分とを含み、
前記第2リードフレームは、前記第2発光素子が配置され、前記胴体の前記底部に露出した第3部分と、前記第3部分から前記第1方向に突出した第4部分とを含み、
前記第1部分は、前記胴体の前記第1短側壁に露出し、
前記第3部分は、前記胴体の前記第2短側壁に露出し、
前記第2部分は、前記第1部分から前記第2短側壁方向に行くほど幅が減少する部分を有し、
前記第4部分は、前記第3部分から前記第1短側壁方向に行くほど幅が減少する部分を有し、
前記第2部分及び前記第4部分の幅は、前記第2方向への長さであり、
前記保護素子は、前記第2部分または前記第4部分の上に配置されることを特徴とする、発光素子パッケージ。 - 前記第1リードフレームの前記第2部分及び前記第2リードフレームの前記第4部分は、前記胴体の前記底部に露出し、
前記第2部分及び前記第4部分の下面は、前記胴体の前記底部と同一平面に配置されることを特徴とする、請求項1に記載の発光素子パッケージ。 - 前記第1リードフレームの前記第1部分は、前記胴体の前記第1短側壁に隣接した前記胴体の前記底部に露出し、
前記第2リードフレームの前記第3部分は、前記胴体の前記第2短側壁に隣接した前記胴体の前記底部に露出することを特徴とする、請求項1に記載の発光素子パッケージ。 - 前記第1及び第2リードフレームの間に第3リードフレームを含み、
前記第3リードフレームは、前記第2長側壁と前記第1リードフレームの前記第2部分との間に配置され、
前記第3リードフレームは、前記第1発光素子と電気的に連結されることを特徴とする、請求項1または3に記載の発光素子パッケージ。 - 前記第1及び第2リードフレームの間に第3リードフレームを含み、
前記第3リードフレームは、前記第2長側壁と前記第2リードフレームの前記第4部分との間に配置され、
前記第3リードフレームは、前記第2発光素子と電気的に連結されることを特徴とする、請求項1または3に記載の発光素子パッケージ。 - 前記第3リードフレームの一部は、前記胴体の前記第2長側壁に露出することを特徴とする、請求項4または5に記載の発光素子パッケージ。
- 前記胴体の一部は、前記リセスの底部に露出し、
前記リセスの前記底部に露出した前記胴体の一部は、前記第1リードフレームの前記第1部分と前記第3リードフレームとの間に配置された第1領域と、前記第1リードフレームの前記第2部分と前記第3リードフレームとの間に配置された第2領域と、前記第1リードフレームと前記第2リードフレームとの間に配置された第3領域とを含むことを特徴とする、請求項4〜6のいずれか一項に記載の発光素子。 - 前記胴体の一部の前記第1領域は、前記第2方向に配置され、前記第2領域は、前記第1方向に配置されることを特徴とする、請求項7に記載の発光素子パッケージ。
- 前記第1及び第2リードフレームは、前記胴体が結合された孔を有し、
前記第1リードフレームの少なくとも一部は、前記胴体の前記第1短側壁を貫通し、
前記第2リードフレームの少なくとも一部は、前記胴体の前記第2短側壁を貫通することを特徴とする、請求項1〜8のいずれか一項に記載の発光素子パッケージ。 - 前記第1リードフレーム及び前記第2リードフレームのそれぞれは、中央が凹んだ部分を備えることを特徴とする、請求項1〜9のいずれか一項に記載の発光素子パッケージ。
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