KR101810773B1 - 첩합 디바이스의 제조 방법 및 첩합 디바이스의 제조 장치 - Google Patents

첩합 디바이스의 제조 방법 및 첩합 디바이스의 제조 장치 Download PDF

Info

Publication number
KR101810773B1
KR101810773B1 KR1020160055511A KR20160055511A KR101810773B1 KR 101810773 B1 KR101810773 B1 KR 101810773B1 KR 1020160055511 A KR1020160055511 A KR 1020160055511A KR 20160055511 A KR20160055511 A KR 20160055511A KR 101810773 B1 KR101810773 B1 KR 101810773B1
Authority
KR
South Korea
Prior art keywords
adhesive
work
curing
bonding
convex portion
Prior art date
Application number
KR1020160055511A
Other languages
English (en)
Korean (ko)
Other versions
KR20160131941A (ko
Inventor
요시카즈 오타니
Original Assignee
신에츠 엔지니어링 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에츠 엔지니어링 가부시키가이샤 filed Critical 신에츠 엔지니어링 가부시키가이샤
Publication of KR20160131941A publication Critical patent/KR20160131941A/ko
Application granted granted Critical
Publication of KR101810773B1 publication Critical patent/KR101810773B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Liquid Crystal (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020160055511A 2015-05-07 2016-05-04 첩합 디바이스의 제조 방법 및 첩합 디바이스의 제조 장치 KR101810773B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015095106A JP5816388B1 (ja) 2015-05-07 2015-05-07 貼合デバイスの製造方法及び貼合デバイスの製造装置
JPJP-P-2015-095106 2015-05-07

Publications (2)

Publication Number Publication Date
KR20160131941A KR20160131941A (ko) 2016-11-16
KR101810773B1 true KR101810773B1 (ko) 2017-12-19

Family

ID=54602101

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160055511A KR101810773B1 (ko) 2015-05-07 2016-05-04 첩합 디바이스의 제조 방법 및 첩합 디바이스의 제조 장치

Country Status (4)

Country Link
JP (1) JP5816388B1 (zh)
KR (1) KR101810773B1 (zh)
CN (1) CN106125352B (zh)
TW (1) TWI592720B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018146953A1 (ja) * 2017-02-07 2018-08-16 デクセリアルズ株式会社 画像表示装置の製造方法
KR102303805B1 (ko) 2017-06-07 2021-09-16 엘지전자 주식회사 디스플레이 어셈블리
JP2019186265A (ja) * 2018-04-03 2019-10-24 東京エレクトロン株式会社 基板処理システム、基板処理方法、プログラム及びコンピュータ記憶媒体
TWI660221B (zh) 2018-04-11 2019-05-21 和碩聯合科技股份有限公司 曲面顯示裝置及其製造方法
JP6696036B1 (ja) * 2019-08-01 2020-05-20 信越エンジニアリング株式会社 ワーク転写装置及びワーク転写チャック並びにワーク転写方法
JP7031830B2 (ja) * 2020-03-31 2022-03-08 株式会社オリジン 貼合部材の製造方法及び貼合部材製造装置
CN113905114A (zh) * 2021-09-03 2022-01-07 Oppo广东移动通信有限公司 电子设备、显示屏组件及其贴合方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412249Y2 (zh) * 1987-04-24 1992-03-25
JP3484553B2 (ja) * 1995-02-21 2004-01-06 大日本印刷株式会社 フィルムシートの貼り合わせ方法及び貼合フィルムシート
JP5657979B2 (ja) 2010-09-29 2015-01-21 芝浦メカトロニクス株式会社 貼合装置及び貼合方法
WO2012105658A1 (ja) * 2011-02-04 2012-08-09 日立化成工業株式会社 接着物の製造方法、接着剤パターン付き基板の製造方法及び接着剤パターン付き基板
JP5464608B2 (ja) 2011-12-22 2014-04-09 日本写真印刷株式会社 装飾付きタッチセンサ及びその製造方法
CN103317816B (zh) * 2012-03-23 2017-07-21 芝浦机械电子装置股份有限公司 粘合装置以及粘合基板的制造方法
JP5346116B1 (ja) * 2012-12-19 2013-11-20 信越エンジニアリング株式会社 ワーク貼合方法及びワーク貼合装置
KR20160026908A (ko) * 2013-06-27 2016-03-09 신에츠 엔지니어링 가부시키가이샤 접합 디바이스의 제조 방법
JP6466845B2 (ja) * 2013-08-30 2019-02-06 武蔵エンジニアリング株式会社 板状積層体の製造方法および装置

Also Published As

Publication number Publication date
JP5816388B1 (ja) 2015-11-18
TW201642000A (zh) 2016-12-01
TWI592720B (zh) 2017-07-21
CN106125352B (zh) 2019-04-19
CN106125352A (zh) 2016-11-16
KR20160131941A (ko) 2016-11-16
JP2016210075A (ja) 2016-12-15

Similar Documents

Publication Publication Date Title
KR101810773B1 (ko) 첩합 디바이스의 제조 방법 및 첩합 디바이스의 제조 장치
JP5527650B2 (ja) 表示装置
KR101969597B1 (ko) 접합 디바이스의 제조방법
JP5550357B2 (ja) フロントウインドウ付き表示装置
JP4657387B1 (ja) 表示パネルの製造方法及びその製造システム
TWI486680B (zh) Liquid crystal display device and manufacturing method thereof
JP5346116B1 (ja) ワーク貼合方法及びワーク貼合装置
TWI613083B (zh) 積層體之製造裝置及積層體之製造方法
KR20150020310A (ko) 접합 디바이스의 제조 장치 및 접합 디바이스의 제조 방법
TWI603848B (zh) Bonding device manufacturing method
TW201627166A (zh) 光學膠、面板以及基板貼合方法
TWI764162B (zh) 接合構件的製造裝置及製造方法
KR20050108317A (ko) 표시 디바이스의 제조 방법 및 표시 디바이스의 제조 장치
KR20130032626A (ko) 자외선 라미네이션용 지그 및 그 지그를 이용한 자외선 라미네이션 방법
KR102363624B1 (ko) 기판 라미네이션 방법
KR20170091439A (ko) 패턴 구조체 및 그 제조 방법
JP4449853B2 (ja) マイクロチップ基板貼り合わせ装置
JP2023000535A (ja) 曲面ワーク貼合装置及び曲面ワーク貼合方法
JP2016063109A (ja) 光センサー及びその製造方法
JP2020177191A (ja) 貼合デバイスの貼り合わせ装置及び貼り合わせ方法並びに貼合デバイス
JP2014074935A (ja) 表示装置
JP2006039371A (ja) 液晶装置の製造方法、液晶装置の製造装置
JP2014092570A (ja) 表示素子の製造装置及び製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant