KR101799845B1 - 감광성 수지 조성물, 드라이 필름, 프린트 배선판 - Google Patents

감광성 수지 조성물, 드라이 필름, 프린트 배선판 Download PDF

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KR101799845B1
KR101799845B1 KR1020167030261A KR20167030261A KR101799845B1 KR 101799845 B1 KR101799845 B1 KR 101799845B1 KR 1020167030261 A KR1020167030261 A KR 1020167030261A KR 20167030261 A KR20167030261 A KR 20167030261A KR 101799845 B1 KR101799845 B1 KR 101799845B1
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South Korea
Prior art keywords
epoxy
carboxyl group
resin composition
photosensitive resin
group
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KR1020167030261A
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English (en)
Korean (ko)
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KR20170065463A (ko
Inventor
미치야 히구치
소이치 하시모토
다카시 아라이
히로노부 가와사토
신지 이나바
Original Assignee
고오 가가쿠고교 가부시키가이샤
신닛테츠 수미킨 가가쿠 가부시키가이샤
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Priority claimed from JP2015215709A external-priority patent/JP6140246B2/ja
Priority claimed from JP2015215706A external-priority patent/JP6082083B1/ja
Priority claimed from JP2015215708A external-priority patent/JP6172816B2/ja
Application filed by 고오 가가쿠고교 가부시키가이샤, 신닛테츠 수미킨 가가쿠 가부시키가이샤 filed Critical 고오 가가쿠고교 가부시키가이샤
Publication of KR20170065463A publication Critical patent/KR20170065463A/ko
Application granted granted Critical
Publication of KR101799845B1 publication Critical patent/KR101799845B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
KR1020167030261A 2015-11-02 2016-01-28 감광성 수지 조성물, 드라이 필름, 프린트 배선판 KR101799845B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JPJP-P-2015-215706 2015-11-02
JPJP-P-2015-215709 2015-11-02
JP2015215709A JP6140246B2 (ja) 2015-11-02 2015-11-02 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法
JP2015215706A JP6082083B1 (ja) 2015-11-02 2015-11-02 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法
JPJP-P-2015-215708 2015-11-02
JP2015215708A JP6172816B2 (ja) 2015-11-02 2015-11-02 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法
PCT/JP2016/000429 WO2017077662A1 (ja) 2015-11-02 2016-01-28 感光性樹脂組成物、ドライフィルム、プリント配線板

Publications (2)

Publication Number Publication Date
KR20170065463A KR20170065463A (ko) 2017-06-13
KR101799845B1 true KR101799845B1 (ko) 2017-11-22

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KR1020167030261A KR101799845B1 (ko) 2015-11-02 2016-01-28 감광성 수지 조성물, 드라이 필름, 프린트 배선판

Country Status (4)

Country Link
KR (1) KR101799845B1 (zh)
CN (1) CN106796396B (zh)
TW (1) TWI620012B (zh)
WO (1) WO2017077662A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102208828B1 (ko) * 2017-06-09 2021-01-27 고오 가가쿠고교 가부시키가이샤 감광성 수지 조성물, 드라이 필름, 및 프린트 배선판
KR102312785B1 (ko) * 2017-08-10 2021-10-14 동우 화인켐 주식회사 광중합성 불포화 수지, 이를 포함하는 감광성 수지 조성물 및 이로부터 형성되는 차광성 스페이서와 액정 디스플레이 장치
JP7091463B2 (ja) * 2018-09-28 2022-06-27 富士フイルム株式会社 転写材料、積層体、及び、積層体の製造方法
JP7202282B2 (ja) * 2019-12-16 2023-01-11 株式会社タムラ製作所 感光性樹脂組成物及び感光性樹脂組成物を有するドライフィルム
CN116568717A (zh) * 2020-12-10 2023-08-08 三菱化学株式会社 感光性树脂组合物、固化物、黑色矩阵及图像显示装置
CN112940560B (zh) * 2021-02-01 2022-11-29 深圳市容大感光科技股份有限公司 感光阻焊油墨组合物、其用途以及含有其的线路板
CN114437359B (zh) * 2022-03-09 2023-04-18 广州亦盛环保科技有限公司 一种透明光刻胶用感光性树脂组合物

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JP2002169285A (ja) 2000-11-30 2002-06-14 Nippon Steel Chem Co Ltd 光又は熱硬化性樹脂組成物及びプリント配線基板
JP2002226529A (ja) 2001-01-30 2002-08-14 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2006096962A (ja) 2004-09-28 2006-04-13 Sanei Kagaku Kk 感光性熱硬化性樹脂組成物、並びにレジスト被覆プリント配線板及びその製造法

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JPH0570528A (ja) * 1991-09-11 1993-03-23 Nippon Steel Corp アルカリ可溶型感光性樹脂及びそれを用いたアルカリ現像型感光性樹脂組成物
JP5027357B2 (ja) * 2001-03-30 2012-09-19 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物及びプリント配線板
JP2003076009A (ja) * 2001-08-27 2003-03-14 Nan Ya Plast Corp 感光性熱硬化性樹脂組成物
US20080268374A1 (en) * 2004-07-14 2008-10-30 Fujifilm Corporation Photosensitive Composition, Pattern Forming Material, Photosensitive Laminate, Pattern Forming Apparatus, and Pattern Forming Process
CN101044433A (zh) * 2004-10-20 2007-09-26 三菱化学株式会社 感光性组合物、成像材料、成像件以及成像方法
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KR101337283B1 (ko) * 2006-12-20 2013-12-06 미쓰비시 가가꾸 가부시키가이샤 옥심에스테르계 화합물, 광중합 개시제, 광중합성 조성물, 컬러 필터 및 액정 표시 장치
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JP6204734B2 (ja) * 2013-07-16 2017-09-27 互応化学工業株式会社 ソルダーレジスト用樹脂組成物
JP5643416B1 (ja) * 2013-12-24 2014-12-17 互応化学工業株式会社 被覆配線板の製造方法

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Publication number Priority date Publication date Assignee Title
JP2002169285A (ja) 2000-11-30 2002-06-14 Nippon Steel Chem Co Ltd 光又は熱硬化性樹脂組成物及びプリント配線基板
JP2002226529A (ja) 2001-01-30 2002-08-14 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2006096962A (ja) 2004-09-28 2006-04-13 Sanei Kagaku Kk 感光性熱硬化性樹脂組成物、並びにレジスト被覆プリント配線板及びその製造法

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TW201716856A (zh) 2017-05-16
KR20170065463A (ko) 2017-06-13
CN106796396B (zh) 2018-12-11
CN106796396A (zh) 2017-05-31
TWI620012B (zh) 2018-04-01
WO2017077662A1 (ja) 2017-05-11

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