KR101794147B1 - 도전성 접착제 층, 도전성 접착 시트, 프린트 배선판 및 전자 기기 - Google Patents

도전성 접착제 층, 도전성 접착 시트, 프린트 배선판 및 전자 기기 Download PDF

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Publication number
KR101794147B1
KR101794147B1 KR1020177005137A KR20177005137A KR101794147B1 KR 101794147 B1 KR101794147 B1 KR 101794147B1 KR 1020177005137 A KR1020177005137 A KR 1020177005137A KR 20177005137 A KR20177005137 A KR 20177005137A KR 101794147 B1 KR101794147 B1 KR 101794147B1
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KR
South Korea
Prior art keywords
conductive adhesive
adhesive layer
resin
conductive
wiring board
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KR1020177005137A
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English (en)
Korean (ko)
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KR20170036034A (ko
Inventor
츠토무 하야사카
사토시 니시노하라
카즈노리 마츠도
Original Assignee
토요잉크Sc홀딩스주식회사
토요켐주식회사
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Publication of KR20170036034A publication Critical patent/KR20170036034A/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J7/0225—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C09J2201/622—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Insulated Conductors (AREA)
  • Structure Of Printed Boards (AREA)
  • Conductive Materials (AREA)
KR1020177005137A 2015-07-16 2016-07-14 도전성 접착제 층, 도전성 접착 시트, 프린트 배선판 및 전자 기기 KR101794147B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015142038 2015-07-16
JPJP-P-2015-142038 2015-07-16
JPJP-P-2015-188423 2015-09-25
JP2015188423A JP5871098B1 (ja) 2015-07-16 2015-09-25 導電性接着剤層、導電性接着シートおよびプリント配線板
PCT/JP2016/003323 WO2017010101A1 (ja) 2015-07-16 2016-07-14 導電性接着剤層、導電性接着シート、プリント配線板および電子機器

Publications (2)

Publication Number Publication Date
KR20170036034A KR20170036034A (ko) 2017-03-31
KR101794147B1 true KR101794147B1 (ko) 2017-11-07

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Application Number Title Priority Date Filing Date
KR1020177005137A KR101794147B1 (ko) 2015-07-16 2016-07-14 도전성 접착제 층, 도전성 접착 시트, 프린트 배선판 및 전자 기기

Country Status (5)

Country Link
JP (2) JP5871098B1 (zh)
KR (1) KR101794147B1 (zh)
CN (2) CN205874290U (zh)
TW (1) TWI703199B (zh)
WO (1) WO2017010101A1 (zh)

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JP5871098B1 (ja) * 2015-07-16 2016-03-01 東洋インキＳｃホールディングス株式会社 導電性接着剤層、導電性接着シートおよびプリント配線板
KR20170116624A (ko) * 2016-04-11 2017-10-20 주식회사 잉크테크 전도성 접착제 조성물 및 이를 이용한 구조물의 접착 방법
JP6893084B2 (ja) * 2016-10-19 2021-06-23 日東シンコー株式会社 熱硬化性接着シート
CN108990261A (zh) * 2017-06-05 2018-12-11 昆山雅森电子材料科技有限公司 纳米金属基板及制备方法及含该基板的线路板的制备方法
JP7054998B2 (ja) * 2017-09-11 2022-04-15 Ａｇｃコーテック株式会社 塗膜および塗膜付き基材
JP6329314B1 (ja) * 2017-09-28 2018-05-23 タツタ電線株式会社 導電性接着剤シート
JP6546975B2 (ja) * 2017-10-16 2019-07-17 タツタ電線株式会社 導電性接着剤
JP6371460B1 (ja) * 2017-12-06 2018-08-08 タツタ電線株式会社 配線基板用補強板
JP2019125529A (ja) * 2018-01-18 2019-07-25 タツタ電線株式会社 導電性接着フィルム及びそれを用いた電磁波シールドフィルム
JP6431998B1 (ja) 2018-03-20 2018-11-28 タツタ電線株式会社 導電性接着剤層
TWI796476B (zh) * 2018-10-22 2023-03-21 日商拓自達電線股份有限公司 導電性接著片
TWI771595B (zh) * 2018-10-29 2022-07-21 日商拓自達電線股份有限公司 電磁波屏蔽膜、屏蔽印刷配線板之製造方法、及屏蔽印刷配線板
TWI782213B (zh) * 2018-10-29 2022-11-01 日商拓自達電線股份有限公司 電磁波屏蔽膜、屏蔽印刷配線板之製造方法、及屏蔽印刷配線板
US11457527B2 (en) 2018-12-12 2022-09-27 Tatsuta Electric Wire & Cable Co., Ltd. Shield printed wiring board and method of manufacturing shield printed wiring board
JP6904464B2 (ja) * 2019-06-12 2021-07-14 東洋インキＳｃホールディングス株式会社 プリント配線板
TWI703197B (zh) * 2019-07-16 2020-09-01 東莞爵士先進電子應用材料有限公司 自粘複合型導電膠帶製備方法
CN112592668B (zh) * 2020-12-15 2024-05-28 珠海冠宇电池股份有限公司 单层热熔胶和软包电池及其制备方法
CN114336112B (zh) * 2021-12-10 2023-10-03 中国科学院深圳先进技术研究院 一种柔性导电材料与硬质导电材料间软硬界面的衔接方法
CN114591694B (zh) * 2022-03-05 2023-12-01 安徽强达电子有限公司 一种耐高温胶带及其制备工艺
JP7231124B1 (ja) * 2022-03-30 2023-03-01 東洋インキＳｃホールディングス株式会社 金属板用接合剤、プリント配線板用補強部材及びその製造方法、並びに、配線板及びその製造方法

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Publication number Publication date
CN105969242B (zh) 2018-06-08
JP2017025284A (ja) 2017-02-02
CN105969242A (zh) 2016-09-28
JP5871098B1 (ja) 2016-03-01
TWI703199B (zh) 2020-09-01
WO2017010101A1 (ja) 2017-01-19
KR20170036034A (ko) 2017-03-31
CN205874290U (zh) 2017-01-11
TW201704412A (zh) 2017-02-01
JP2017025280A (ja) 2017-02-02

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