KR101793337B1 - 절단 장치 및 절단 방법 - Google Patents

절단 장치 및 절단 방법 Download PDF

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Publication number
KR101793337B1
KR101793337B1 KR1020150145374A KR20150145374A KR101793337B1 KR 101793337 B1 KR101793337 B1 KR 101793337B1 KR 1020150145374 A KR1020150145374 A KR 1020150145374A KR 20150145374 A KR20150145374 A KR 20150145374A KR 101793337 B1 KR101793337 B1 KR 101793337B1
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KR
South Korea
Prior art keywords
cleaning
cleaning mechanism
cut
cutting
substrate
Prior art date
Application number
KR1020150145374A
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English (en)
Korean (ko)
Other versions
KR20160047397A (ko
Inventor
하지메 와타나베
유다이 다카모리
간지 이시바시
Original Assignee
토와 가부시기가이샤
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Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20160047397A publication Critical patent/KR20160047397A/ko
Application granted granted Critical
Publication of KR101793337B1 publication Critical patent/KR101793337B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
KR1020150145374A 2014-10-22 2015-10-19 절단 장치 및 절단 방법 KR101793337B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-215266 2014-10-22
JP2014215266A JP2016082195A (ja) 2014-10-22 2014-10-22 切断装置及び切断方法

Publications (2)

Publication Number Publication Date
KR20160047397A KR20160047397A (ko) 2016-05-02
KR101793337B1 true KR101793337B1 (ko) 2017-11-20

Family

ID=55831103

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150145374A KR101793337B1 (ko) 2014-10-22 2015-10-19 절단 장치 및 절단 방법

Country Status (4)

Country Link
JP (1) JP2016082195A (zh)
KR (1) KR101793337B1 (zh)
CN (1) CN105551996B (zh)
TW (1) TWI593002B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018164964A (ja) * 2017-03-28 2018-10-25 Ｔｏｗａ株式会社 レジノイド砥石、レジノイド砥石の製造方法、及び、加工装置
JP6866217B2 (ja) * 2017-04-21 2021-04-28 株式会社ディスコ 切削装置
JP6973922B2 (ja) * 2017-09-08 2021-12-01 株式会社ディスコ ウェーハの加工方法
JP6990588B2 (ja) * 2018-01-05 2022-01-12 株式会社ディスコ 切削装置
JP7161411B2 (ja) * 2019-01-15 2022-10-26 株式会社ディスコ 乾燥機構
JP7154195B2 (ja) * 2019-07-26 2022-10-17 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
WO2021132133A1 (ja) * 2019-12-26 2021-07-01 ヤマハロボティクスホールディングス株式会社 半導体チップ洗浄方法及び半導体チップ洗浄装置
JP7394712B2 (ja) * 2020-06-24 2023-12-08 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
JPWO2022091451A1 (zh) * 2020-10-26 2022-05-05
KR102617780B1 (ko) * 2020-11-19 2023-12-26 세메스 주식회사 반도체 스트립 절단 및 분류 설비에서 공기 분사 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007194367A (ja) * 2006-01-18 2007-08-02 Tokyo Seimitsu Co Ltd 洗浄装置及び該洗浄装置を備えるダイシング装置
JP2009218397A (ja) * 2008-03-11 2009-09-24 Towa Corp 基板の切断方法及び装置
JP2009253160A (ja) * 2008-04-09 2009-10-29 Towa Corp 基板の切断方法及び装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5487168A (en) * 1977-12-23 1979-07-11 Hitachi Ltd Manufacture for semiconductor device and its unit
TW353784B (en) * 1996-11-19 1999-03-01 Tokyo Electron Ltd Apparatus and method for washing substrate
JP2000288490A (ja) * 1999-04-01 2000-10-17 Furontekku:Kk ウェット処理装置
JP3990073B2 (ja) * 1999-06-17 2007-10-10 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP2001077057A (ja) * 1999-09-06 2001-03-23 Disco Abrasive Syst Ltd Ｃｓｐ基板分割装置
JP2002043267A (ja) * 2000-07-21 2002-02-08 Ebara Corp 基板洗浄装置、基板洗浄方法及び基板処理装置
JP4079205B2 (ja) * 2000-08-29 2008-04-23 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
JP2003209089A (ja) * 2002-01-17 2003-07-25 Sony Corp ウェハの洗浄方法、洗浄装置およびダイシング装置
US7766566B2 (en) * 2005-08-03 2010-08-03 Tokyo Electron Limited Developing treatment apparatus and developing treatment method
JP5325003B2 (ja) * 2009-04-16 2013-10-23 株式会社ディスコ 研削装置
JP5866227B2 (ja) * 2012-02-23 2016-02-17 株式会社荏原製作所 基板洗浄方法
JP6265702B2 (ja) * 2012-12-06 2018-01-24 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP6172957B2 (ja) * 2013-02-04 2017-08-02 株式会社ディスコ 洗浄装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007194367A (ja) * 2006-01-18 2007-08-02 Tokyo Seimitsu Co Ltd 洗浄装置及び該洗浄装置を備えるダイシング装置
JP2009218397A (ja) * 2008-03-11 2009-09-24 Towa Corp 基板の切断方法及び装置
JP2009253160A (ja) * 2008-04-09 2009-10-29 Towa Corp 基板の切断方法及び装置

Also Published As

Publication number Publication date
TWI593002B (zh) 2017-07-21
TW201615347A (zh) 2016-05-01
KR20160047397A (ko) 2016-05-02
CN105551996B (zh) 2019-01-25
CN105551996A (zh) 2016-05-04
JP2016082195A (ja) 2016-05-16

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