JP4721968B2 - スピンナ洗浄装置 - Google Patents
スピンナ洗浄装置 Download PDFInfo
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- JP4721968B2 JP4721968B2 JP2006187009A JP2006187009A JP4721968B2 JP 4721968 B2 JP4721968 B2 JP 4721968B2 JP 2006187009 A JP2006187009 A JP 2006187009A JP 2006187009 A JP2006187009 A JP 2006187009A JP 4721968 B2 JP4721968 B2 JP 4721968B2
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- Prior art keywords
- cleaning fluid
- wafer
- spinner
- cleaning
- cleaned
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- 238000004140 cleaning Methods 0.000 title claims description 125
- 239000012530 fluid Substances 0.000 claims description 88
- 241000189524 Baccharis halimifolia Species 0.000 claims description 31
- 238000005520 cutting process Methods 0.000 description 45
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 238000011109 contamination Methods 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 10
- 238000012545 processing Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
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- 238000011068 loading method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002352 surface water Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
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- Cleaning Or Drying Semiconductors (AREA)
Description
61 洗浄流体
63 洗浄流体
211 スピンナテーブル
211a 保持面
411 ノズルアーム
412 洗浄流体噴出部
413 揺動手段
414 ウォータブラシ
Claims (1)
- 被洗浄物を保持する保持面を有し回転可能なスピンナテーブルと、前記保持面上に保持された被洗浄物に洗浄流体を供給する洗浄流体供給手段とを備えるスピンナ洗浄装置であって、
前記洗浄流体供給手段は、
ノズルアームと、
該ノズルアームの先端に配設されて洗浄流体が前記保持面に向かって鉛直方向に噴射される洗浄流体噴出部と、
前記保持面に保持されて前記スピンナテーブルの所要速度の回転に伴って回転する被洗浄物に対して前記洗浄流体噴出部が前記スピンナテーブルの回転中心を通るように前記ノズルアームを揺動させる揺動手段と、
前記スピンナテーブルの半径相当の長さを有して前記ノズルアームの両側部に配設されて洗浄流体が複数の噴出口から前記保持面に向かって噴射される2本のウォータブラシと、
を備え、
前記2本のウォータブラシからは、同時にまたは一方を選択して洗浄流体が噴射されることを特徴とするスピンナ洗浄装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006187009A JP4721968B2 (ja) | 2006-07-06 | 2006-07-06 | スピンナ洗浄装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006187009A JP4721968B2 (ja) | 2006-07-06 | 2006-07-06 | スピンナ洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008016673A JP2008016673A (ja) | 2008-01-24 |
JP4721968B2 true JP4721968B2 (ja) | 2011-07-13 |
Family
ID=39073403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006187009A Active JP4721968B2 (ja) | 2006-07-06 | 2006-07-06 | スピンナ洗浄装置 |
Country Status (1)
Country | Link |
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JP (1) | JP4721968B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5180661B2 (ja) * | 2008-04-18 | 2013-04-10 | 株式会社ディスコ | スピンナ洗浄装置および加工装置 |
US9368404B2 (en) * | 2012-09-28 | 2016-06-14 | Plasma-Therm Llc | Method for dicing a substrate with back metal |
JP2015050402A (ja) * | 2013-09-04 | 2015-03-16 | 株式会社ディスコ | 洗浄手段を備えた切削装置 |
JP7023575B2 (ja) * | 2018-03-02 | 2022-02-22 | 株式会社ディスコ | 洗浄方法 |
WO2021235242A1 (ja) * | 2020-05-19 | 2021-11-25 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000033346A (ja) * | 1998-07-21 | 2000-02-02 | Disco Abrasive Syst Ltd | スピンナー洗浄装置及びダイシング装置 |
JP2005349291A (ja) * | 2004-06-10 | 2005-12-22 | Sharp Corp | スピン洗浄装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3323384B2 (ja) * | 1995-12-21 | 2002-09-09 | 大日本スクリーン製造株式会社 | 基板洗浄装置および基板洗浄方法 |
-
2006
- 2006-07-06 JP JP2006187009A patent/JP4721968B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000033346A (ja) * | 1998-07-21 | 2000-02-02 | Disco Abrasive Syst Ltd | スピンナー洗浄装置及びダイシング装置 |
JP2005349291A (ja) * | 2004-06-10 | 2005-12-22 | Sharp Corp | スピン洗浄装置 |
Also Published As
Publication number | Publication date |
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JP2008016673A (ja) | 2008-01-24 |
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