KR101781220B1 - 디프레션형 mos 트랜지스터를 갖는 반도체 장치 - Google Patents
디프레션형 mos 트랜지스터를 갖는 반도체 장치 Download PDFInfo
- Publication number
- KR101781220B1 KR101781220B1 KR1020110027639A KR20110027639A KR101781220B1 KR 101781220 B1 KR101781220 B1 KR 101781220B1 KR 1020110027639 A KR1020110027639 A KR 1020110027639A KR 20110027639 A KR20110027639 A KR 20110027639A KR 101781220 B1 KR101781220 B1 KR 101781220B1
- Authority
- KR
- South Korea
- Prior art keywords
- type
- impurity region
- region
- mos transistor
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
- H10D30/0227—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/637—Lateral IGFETs having no inversion channels, e.g. buried channel lateral IGFETs, normally-on lateral IGFETs or depletion-mode lateral IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/221—Channel regions of field-effect devices of FETs
- H10D62/235—Channel regions of field-effect devices of FETs of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/351—Substrate regions of field-effect devices
- H10D62/357—Substrate regions of field-effect devices of FETs
- H10D62/364—Substrate regions of field-effect devices of FETs of IGFETs
- H10D62/371—Inactive supplementary semiconductor regions, e.g. for preventing punch-through, improving capacity effect or leakage current
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010076366A JP2011210901A (ja) | 2010-03-29 | 2010-03-29 | デプレッション型mosトランジスタ |
| JPJP-P-2010-076366 | 2010-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110109948A KR20110109948A (ko) | 2011-10-06 |
| KR101781220B1 true KR101781220B1 (ko) | 2017-09-22 |
Family
ID=44655390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020110027639A Expired - Fee Related KR101781220B1 (ko) | 2010-03-29 | 2011-03-28 | 디프레션형 mos 트랜지스터를 갖는 반도체 장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9013007B2 (enExample) |
| JP (1) | JP2011210901A (enExample) |
| KR (1) | KR101781220B1 (enExample) |
| CN (1) | CN102208445B (enExample) |
| TW (1) | TWI521702B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6095927B2 (ja) * | 2012-09-27 | 2017-03-15 | エスアイアイ・セミコンダクタ株式会社 | 半導体集積回路装置 |
| US9478571B1 (en) * | 2013-05-24 | 2016-10-25 | Mie Fujitsu Semiconductor Limited | Buried channel deeply depleted channel transistor |
| JP6326487B2 (ja) * | 2013-06-20 | 2018-05-16 | ストレイティオ, インコーポレイテッドStratio, Inc. | Cmos画像センサ用のゲート制御型電荷変調デバイス |
| US9559203B2 (en) * | 2013-07-15 | 2017-01-31 | Analog Devices, Inc. | Modular approach for reducing flicker noise of MOSFETs |
| CN114551595B (zh) * | 2020-11-20 | 2023-10-31 | 苏州华太电子技术股份有限公司 | 应用于射频放大的沟道掺杂调制rfldmos器件及制法 |
| JP2022108157A (ja) * | 2021-01-12 | 2022-07-25 | キオクシア株式会社 | 半導体装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4951879A (enExample) * | 1972-09-20 | 1974-05-20 | ||
| US4212683A (en) * | 1978-03-27 | 1980-07-15 | Ncr Corporation | Method for making narrow channel FET |
| US4575746A (en) * | 1983-11-28 | 1986-03-11 | Rca Corporation | Crossunders for high density SOS integrated circuits |
| JPH0369167A (ja) * | 1989-08-08 | 1991-03-25 | Nec Corp | 埋め込み型pチャネルmosトランジスタ及びその製造方法 |
| KR960008735B1 (en) * | 1993-04-29 | 1996-06-29 | Samsung Electronics Co Ltd | Mos transistor and the manufacturing method thereof |
| KR100189964B1 (ko) * | 1994-05-16 | 1999-06-01 | 윤종용 | 고전압 트랜지스터 및 그 제조방법 |
| US5712501A (en) * | 1995-10-10 | 1998-01-27 | Motorola, Inc. | Graded-channel semiconductor device |
| JPH10135349A (ja) * | 1996-10-25 | 1998-05-22 | Ricoh Co Ltd | Cmos型半導体装置及びその製造方法 |
| JP2001352057A (ja) * | 2000-06-09 | 2001-12-21 | Mitsubishi Electric Corp | 半導体装置、およびその製造方法 |
| KR100343472B1 (ko) * | 2000-08-31 | 2002-07-18 | 박종섭 | 모스 트랜지스터의 제조방법 |
| JP3865233B2 (ja) * | 2002-08-19 | 2007-01-10 | 富士通株式会社 | Cmos集積回路装置 |
| US6887758B2 (en) * | 2002-10-09 | 2005-05-03 | Freescale Semiconductor, Inc. | Non-volatile memory device and method for forming |
| KR100540341B1 (ko) * | 2003-12-31 | 2006-01-11 | 동부아남반도체 주식회사 | 반도체 소자 제조방법 |
-
2010
- 2010-03-29 JP JP2010076366A patent/JP2011210901A/ja not_active Withdrawn
-
2011
- 2011-03-18 TW TW100109362A patent/TWI521702B/zh not_active IP Right Cessation
- 2011-03-28 KR KR1020110027639A patent/KR101781220B1/ko not_active Expired - Fee Related
- 2011-03-28 US US13/065,674 patent/US9013007B2/en not_active Expired - Fee Related
- 2011-03-29 CN CN201110086411.3A patent/CN102208445B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWI521702B (zh) | 2016-02-11 |
| US9013007B2 (en) | 2015-04-21 |
| TW201203548A (en) | 2012-01-16 |
| JP2011210901A (ja) | 2011-10-20 |
| CN102208445A (zh) | 2011-10-05 |
| KR20110109948A (ko) | 2011-10-06 |
| CN102208445B (zh) | 2016-03-30 |
| US20110233669A1 (en) | 2011-09-29 |
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