KR101779622B1 - 피가공물의 연삭 방법 - Google Patents

피가공물의 연삭 방법 Download PDF

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Publication number
KR101779622B1
KR101779622B1 KR1020120061314A KR20120061314A KR101779622B1 KR 101779622 B1 KR101779622 B1 KR 101779622B1 KR 1020120061314 A KR1020120061314 A KR 1020120061314A KR 20120061314 A KR20120061314 A KR 20120061314A KR 101779622 B1 KR101779622 B1 KR 101779622B1
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KR
South Korea
Prior art keywords
support substrate
workpiece
wafer
adhesive sheet
grinding
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Application number
KR1020120061314A
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English (en)
Korean (ko)
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KR20130007424A (ko
Inventor
데츠카즈 스기야
Original Assignee
가부시기가이샤 디스코
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Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20130007424A publication Critical patent/KR20130007424A/ko
Application granted granted Critical
Publication of KR101779622B1 publication Critical patent/KR101779622B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
KR1020120061314A 2011-06-30 2012-06-08 피가공물의 연삭 방법 KR101779622B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011145524A JP5912311B2 (ja) 2011-06-30 2011-06-30 被加工物の研削方法
JPJP-P-2011-145524 2011-06-30

Publications (2)

Publication Number Publication Date
KR20130007424A KR20130007424A (ko) 2013-01-18
KR101779622B1 true KR101779622B1 (ko) 2017-09-18

Family

ID=47395491

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120061314A KR101779622B1 (ko) 2011-06-30 2012-06-08 피가공물의 연삭 방법

Country Status (4)

Country Link
JP (1) JP5912311B2 (zh)
KR (1) KR101779622B1 (zh)
CN (1) CN102848305B (zh)
TW (1) TWI546854B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102259959B1 (ko) 2013-12-05 2021-06-04 삼성전자주식회사 캐리어 및 이를 이용하는 반도체 장치의 제조 방법
CN106165074B (zh) 2014-03-19 2020-05-12 三星电子株式会社 制造半导体装置的方法
JP2016092281A (ja) * 2014-11-07 2016-05-23 株式会社ディスコ 表面加工装置
JP6910723B2 (ja) * 2017-08-22 2021-07-28 株式会社ディスコ 研削方法
US11817337B2 (en) * 2018-08-23 2023-11-14 Tokyo Electron Limited Substrate processing system and substrate processing method
JP7405563B2 (ja) * 2019-11-01 2023-12-26 株式会社ディスコ クリープフィード研削方法及び研削装置
CN111136570B (zh) * 2020-02-11 2021-04-27 常州我信光学有限公司 一种光学镜片加工机构
WO2022196132A1 (ja) * 2021-03-17 2022-09-22 富士電機株式会社 半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009043931A (ja) 2007-08-08 2009-02-26 Disco Abrasive Syst Ltd ウェーハの裏面研削方法
JP2011023393A (ja) 2009-07-13 2011-02-03 Renesas Electronics Corp 半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000087004A (ja) * 1998-09-17 2000-03-28 Nitta Ind Corp 被加工物用保持剤およびそれを用いた被加工物の脱着方法
JP2008229807A (ja) * 2007-03-23 2008-10-02 Toray Ind Inc 研磨パッド
JP5096556B2 (ja) * 2007-04-17 2012-12-12 アイメック 基板の薄層化方法
JP5215773B2 (ja) * 2008-08-18 2013-06-19 株式会社ディスコ 加工方法
JP2010183014A (ja) * 2009-02-09 2010-08-19 Disco Abrasive Syst Ltd ウエーハの加工方法
JP2011108746A (ja) * 2009-11-13 2011-06-02 Disco Abrasive Syst Ltd ウエーハの加工方法
CN101972981A (zh) * 2010-10-15 2011-02-16 北京石晶光电科技股份有限公司济源分公司 大直径水晶圆片倒角工装及其倒角方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009043931A (ja) 2007-08-08 2009-02-26 Disco Abrasive Syst Ltd ウェーハの裏面研削方法
JP2011023393A (ja) 2009-07-13 2011-02-03 Renesas Electronics Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
TWI546854B (zh) 2016-08-21
JP2013012654A (ja) 2013-01-17
KR20130007424A (ko) 2013-01-18
JP5912311B2 (ja) 2016-04-27
TW201308414A (zh) 2013-02-16
CN102848305A (zh) 2013-01-02
CN102848305B (zh) 2016-04-27

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