KR101758799B1 - 열전도성 실리콘 고무 조성물 - Google Patents

열전도성 실리콘 고무 조성물 Download PDF

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KR101758799B1
KR101758799B1 KR1020127022420A KR20127022420A KR101758799B1 KR 101758799 B1 KR101758799 B1 KR 101758799B1 KR 1020127022420 A KR1020127022420 A KR 1020127022420A KR 20127022420 A KR20127022420 A KR 20127022420A KR 101758799 B1 KR101758799 B1 KR 101758799B1
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silicon
component
bonded
mass
silicone rubber
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Korean (ko)
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KR20120116007A (ko
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하루미 코다마
마사유키 오니시
료 사카구치
카즈미 나카요시
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다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020127022420A 2010-01-28 2011-01-20 열전도성 실리콘 고무 조성물 Active KR101758799B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010016719A JP5534837B2 (ja) 2010-01-28 2010-01-28 熱伝導性シリコーンゴム組成物
JPJP-P-2010-016719 2010-01-28
PCT/JP2011/051538 WO2011093353A2 (en) 2010-01-28 2011-01-20 Thermally conductive silicone rubber composition

Publications (2)

Publication Number Publication Date
KR20120116007A KR20120116007A (ko) 2012-10-19
KR101758799B1 true KR101758799B1 (ko) 2017-07-18

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Country Link
US (1) US20120292558A1 (enExample)
EP (1) EP2528974B1 (enExample)
JP (1) JP5534837B2 (enExample)
KR (1) KR101758799B1 (enExample)
CN (1) CN102725355B (enExample)
TW (1) TWI513770B (enExample)
WO (1) WO2011093353A2 (enExample)

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TWI480335B (zh) * 2011-11-25 2015-04-11 Ｌｇ化學股份有限公司 可固化組成物
JP5664563B2 (ja) * 2012-01-23 2015-02-04 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5922463B2 (ja) * 2012-03-30 2016-05-24 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6065780B2 (ja) * 2012-08-30 2017-01-25 信越化学工業株式会社 導電性回路描画用インク組成物、導電性回路形成方法及びそれにより形成された導電性回路
JP6223358B2 (ja) * 2012-12-07 2017-11-01 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および光半導体装置
JP6339761B2 (ja) 2012-12-17 2018-06-06 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び熱伝導性部材
CN103275492A (zh) * 2013-06-28 2013-09-04 惠州市粤泰翔科技有限公司 一种加快电子、电器热量传导的导热硅胶及其制备方法
CN104672907A (zh) * 2013-11-30 2015-06-03 招远市东晟橡胶制品有限公司 一种硅橡胶组合物
KR102141722B1 (ko) 2014-02-13 2020-08-05 도레이첨단소재 주식회사 열전도성 시트용 점착제 조성물 및 이로부터 제조된 열전도성 시트
JP6257436B2 (ja) * 2014-04-25 2018-01-10 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体
KR101630769B1 (ko) * 2014-06-24 2016-06-16 매그나칩 반도체 유한회사 방열 반도체 칩 패키지 및 그 제조 방법
JP6264250B2 (ja) * 2014-09-30 2018-01-24 信越化学工業株式会社 合成樹脂組成物に配合するシリコーンゴム粒子の製造方法
JP6260519B2 (ja) * 2014-11-25 2018-01-17 信越化学工業株式会社 一液付加硬化型シリコーン組成物の保存方法及び硬化方法
CN104497585A (zh) * 2014-12-17 2015-04-08 苏州锦腾电子科技有限公司 一种高导热性硅橡胶及其制备方法
CN104497583A (zh) * 2014-12-17 2015-04-08 苏州锦腾电子科技有限公司 高导热高耐磨硅橡胶及其制备方法
JP6524879B2 (ja) * 2015-10-13 2019-06-05 信越化学工業株式会社 付加一液硬化型熱伝導性シリコーングリース組成物
CN105331116A (zh) * 2015-11-17 2016-02-17 镇江高美新材料有限公司 单组份加热固化液体硅橡胶及其制备方法
CN105860540A (zh) * 2016-05-11 2016-08-17 强新正品（苏州）环保材料科技有限公司 一种增强型导热硅胶片的制备方法
JP6620703B2 (ja) * 2016-08-16 2019-12-18 信越化学工業株式会社 熱伝導性シリコーン樹脂組成物及びその硬化方法
JP6870258B2 (ja) 2016-09-23 2021-05-12 日亜化学工業株式会社 導電性接着剤および導電性材料
KR101864534B1 (ko) * 2017-03-31 2018-06-04 주식회사 케이씨씨 방열 겔형 실리콘 고무 조성물
JP6896579B2 (ja) * 2017-09-27 2021-06-30 株式会社東芝 構造体、配線基板、配線基板用基材及び銅張積層板
CN108015938A (zh) * 2017-12-18 2018-05-11 无锡海特信成高分子科技有限公司 一种高导热硅脂工艺流程
EP3814426A4 (en) * 2018-06-27 2022-01-26 Dow Silicones Corporation THERMAL SPACE CHARGE AND ITS APPLICATION TO A BATTERY MANAGEMENT SYSTEM
JP2020132739A (ja) * 2019-02-18 2020-08-31 信越化学工業株式会社 ダイボンディング用シリコーン樹脂組成物、硬化物及び発光ダイオード素子
JP7172805B2 (ja) * 2019-04-02 2022-11-16 信越化学工業株式会社 付加硬化型シリコーン接着剤組成物
JP2021095569A (ja) * 2019-12-18 2021-06-24 富士高分子工業株式会社 熱伝導性組成物、熱伝導性シート及びその製造方法
CN117730123A (zh) * 2021-07-14 2024-03-19 美国陶氏有机硅公司 导热有机硅组合物
CN115637050A (zh) * 2021-07-20 2023-01-24 中蓝晨光化工研究设计院有限公司 一种导热硅氧烷组合物
WO2023053760A1 (ja) * 2021-09-30 2023-04-06 旭化成ワッカーシリコーン株式会社 熱伝導性シリコーン組成物および該組成物を使用するギャップフィラーの製造方法
CN116023786B (zh) * 2021-10-27 2024-04-12 山东东岳有机硅材料股份有限公司 一种自修复混炼硅橡胶及其制备与自修复方法
JP7577048B2 (ja) * 2021-11-10 2024-11-01 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
CN115612446B (zh) * 2022-10-27 2024-01-26 江西蓝星星火有机硅有限公司 灌封用导热加成型有机硅组合物
CN119039789B (zh) * 2024-08-30 2025-09-26 北京康美特科技股份有限公司 一种导热硅橡胶及其制备方法

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JP2004262972A (ja) * 2003-02-13 2004-09-24 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーン組成物

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JP2004262972A (ja) * 2003-02-13 2004-09-24 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーン組成物

Also Published As

Publication number Publication date
JP2011153252A (ja) 2011-08-11
TW201137045A (en) 2011-11-01
EP2528974B1 (en) 2017-10-18
JP5534837B2 (ja) 2014-07-02
CN102725355A (zh) 2012-10-10
WO2011093353A3 (en) 2011-09-29
WO2011093353A2 (en) 2011-08-04
US20120292558A1 (en) 2012-11-22
CN102725355B (zh) 2014-10-08
TWI513770B (zh) 2015-12-21
KR20120116007A (ko) 2012-10-19
EP2528974A2 (en) 2012-12-05

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