CN102725355B - 导热硅橡胶组合物 - Google Patents

导热硅橡胶组合物 Download PDF

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Publication number
CN102725355B
CN102725355B CN201180006026.1A CN201180006026A CN102725355B CN 102725355 B CN102725355 B CN 102725355B CN 201180006026 A CN201180006026 A CN 201180006026A CN 102725355 B CN102725355 B CN 102725355B
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China
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component
silicon
silicone rubber
mass
rubber composition
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CN201180006026.1A
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Chinese (zh)
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CN102725355A (zh
Inventor
小玉春美
大西正之
坂口虑
中吉和己
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201180006026.1A 2010-01-28 2011-01-20 导热硅橡胶组合物 Active CN102725355B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010016719A JP5534837B2 (ja) 2010-01-28 2010-01-28 熱伝導性シリコーンゴム組成物
JP2010-016719 2010-01-28
PCT/JP2011/051538 WO2011093353A2 (en) 2010-01-28 2011-01-20 Thermally conductive silicone rubber composition

Publications (2)

Publication Number Publication Date
CN102725355A CN102725355A (zh) 2012-10-10
CN102725355B true CN102725355B (zh) 2014-10-08

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CN201180006026.1A Active CN102725355B (zh) 2010-01-28 2011-01-20 导热硅橡胶组合物

Country Status (7)

Country Link
US (1) US20120292558A1 (enExample)
EP (1) EP2528974B1 (enExample)
JP (1) JP5534837B2 (enExample)
KR (1) KR101758799B1 (enExample)
CN (1) CN102725355B (enExample)
TW (1) TWI513770B (enExample)
WO (1) WO2011093353A2 (enExample)

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WO2013077699A1 (ko) * 2011-11-25 2013-05-30 주식회사 엘지화학 경화성 조성물
JP5664563B2 (ja) * 2012-01-23 2015-02-04 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5922463B2 (ja) * 2012-03-30 2016-05-24 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6065780B2 (ja) * 2012-08-30 2017-01-25 信越化学工業株式会社 導電性回路描画用インク組成物、導電性回路形成方法及びそれにより形成された導電性回路
US20150299543A1 (en) * 2012-12-07 2015-10-22 Dow Corning Toray Co., Ltd. Curable Silicone Composition And Optical Semiconductor Device
JP6339761B2 (ja) 2012-12-17 2018-06-06 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び熱伝導性部材
CN103275492A (zh) * 2013-06-28 2013-09-04 惠州市粤泰翔科技有限公司 一种加快电子、电器热量传导的导热硅胶及其制备方法
CN104672907A (zh) * 2013-11-30 2015-06-03 招远市东晟橡胶制品有限公司 一种硅橡胶组合物
KR102141722B1 (ko) 2014-02-13 2020-08-05 도레이첨단소재 주식회사 열전도성 시트용 점착제 조성물 및 이로부터 제조된 열전도성 시트
JP6257436B2 (ja) * 2014-04-25 2018-01-10 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体
KR101630769B1 (ko) * 2014-06-24 2016-06-16 매그나칩 반도체 유한회사 방열 반도체 칩 패키지 및 그 제조 방법
JP6264250B2 (ja) * 2014-09-30 2018-01-24 信越化学工業株式会社 合成樹脂組成物に配合するシリコーンゴム粒子の製造方法
JP6260519B2 (ja) * 2014-11-25 2018-01-17 信越化学工業株式会社 一液付加硬化型シリコーン組成物の保存方法及び硬化方法
CN104497583A (zh) * 2014-12-17 2015-04-08 苏州锦腾电子科技有限公司 高导热高耐磨硅橡胶及其制备方法
CN104497585A (zh) * 2014-12-17 2015-04-08 苏州锦腾电子科技有限公司 一种高导热性硅橡胶及其制备方法
JP6524879B2 (ja) * 2015-10-13 2019-06-05 信越化学工業株式会社 付加一液硬化型熱伝導性シリコーングリース組成物
CN105331116A (zh) * 2015-11-17 2016-02-17 镇江高美新材料有限公司 单组份加热固化液体硅橡胶及其制备方法
CN105860540A (zh) * 2016-05-11 2016-08-17 强新正品（苏州）环保材料科技有限公司 一种增强型导热硅胶片的制备方法
JP6620703B2 (ja) * 2016-08-16 2019-12-18 信越化学工業株式会社 熱伝導性シリコーン樹脂組成物及びその硬化方法
JP6870258B2 (ja) 2016-09-23 2021-05-12 日亜化学工業株式会社 導電性接着剤および導電性材料
KR101864534B1 (ko) * 2017-03-31 2018-06-04 주식회사 케이씨씨 방열 겔형 실리콘 고무 조성물
JP6896579B2 (ja) * 2017-09-27 2021-06-30 株式会社東芝 構造体、配線基板、配線基板用基材及び銅張積層板
CN108015938A (zh) * 2017-12-18 2018-05-11 无锡海特信成高分子科技有限公司 一种高导热硅脂工艺流程
JP7144542B2 (ja) * 2018-06-27 2022-09-29 ダウ シリコーンズ コーポレーション サーマルギャップフィラー及びバッテリーマネジメントシステムへのその用途
JP2020132739A (ja) * 2019-02-18 2020-08-31 信越化学工業株式会社 ダイボンディング用シリコーン樹脂組成物、硬化物及び発光ダイオード素子
JP7172805B2 (ja) * 2019-04-02 2022-11-16 信越化学工業株式会社 付加硬化型シリコーン接着剤組成物
CN112980196A (zh) * 2019-12-18 2021-06-18 富士高分子工业株式会社 导热性组合物、导热性片材及其制造方法
CN117730123A (zh) * 2021-07-14 2024-03-19 美国陶氏有机硅公司 导热有机硅组合物
CN115637050A (zh) * 2021-07-20 2023-01-24 中蓝晨光化工研究设计院有限公司 一种导热硅氧烷组合物
WO2023053760A1 (ja) * 2021-09-30 2023-04-06 旭化成ワッカーシリコーン株式会社 熱伝導性シリコーン組成物および該組成物を使用するギャップフィラーの製造方法
CN116023786B (zh) * 2021-10-27 2024-04-12 山东东岳有机硅材料股份有限公司 一种自修复混炼硅橡胶及其制备与自修复方法
JP7577048B2 (ja) * 2021-11-10 2024-11-01 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
CN115612446B (zh) * 2022-10-27 2024-01-26 江西蓝星星火有机硅有限公司 灌封用导热加成型有机硅组合物
CN119039789B (zh) * 2024-08-30 2025-09-26 北京康美特科技股份有限公司 一种导热硅橡胶及其制备方法

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Also Published As

Publication number Publication date
TW201137045A (en) 2011-11-01
EP2528974A2 (en) 2012-12-05
TWI513770B (zh) 2015-12-21
CN102725355A (zh) 2012-10-10
WO2011093353A2 (en) 2011-08-04
US20120292558A1 (en) 2012-11-22
JP5534837B2 (ja) 2014-07-02
WO2011093353A3 (en) 2011-09-29
KR20120116007A (ko) 2012-10-19
KR101758799B1 (ko) 2017-07-18
JP2011153252A (ja) 2011-08-11
EP2528974B1 (en) 2017-10-18

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