KR101743918B1 - 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법 - Google Patents

발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법 Download PDF

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Publication number
KR101743918B1
KR101743918B1 KR1020100116371A KR20100116371A KR101743918B1 KR 101743918 B1 KR101743918 B1 KR 101743918B1 KR 1020100116371 A KR1020100116371 A KR 1020100116371A KR 20100116371 A KR20100116371 A KR 20100116371A KR 101743918 B1 KR101743918 B1 KR 101743918B1
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KR
South Korea
Prior art keywords
resin
light emitting
emitting device
device package
package
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Application number
KR1020100116371A
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English (en)
Korean (ko)
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KR20120054954A (ko
Inventor
김주용
최승기
홍지훈
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삼성전자주식회사
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Priority to KR1020100116371A priority Critical patent/KR101743918B1/ko
Priority to JP2011243464A priority patent/JP5944142B2/ja
Priority to US13/295,411 priority patent/US8546153B2/en
Priority to CN201110380876.XA priority patent/CN102544257B/zh
Priority to EP11190027.0A priority patent/EP2455204B1/en
Publication of KR20120054954A publication Critical patent/KR20120054954A/ko
Priority to US14/029,350 priority patent/US9056690B2/en
Application granted granted Critical
Publication of KR101743918B1 publication Critical patent/KR101743918B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
    • B65B3/04—Methods of, or means for, filling the material into the containers or receptacles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/44—Measuring, controlling or regulating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/042—Feeding of the material to be moulded, e.g. into a mould cavity using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020100116371A 2010-11-22 2010-11-22 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법 Active KR101743918B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020100116371A KR101743918B1 (ko) 2010-11-22 2010-11-22 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법
JP2011243464A JP5944142B2 (ja) 2010-11-22 2011-11-07 発光素子パッケージの樹脂塗布装置、及びこれを用いる発光素子パッケージの製造方法
US13/295,411 US8546153B2 (en) 2010-11-22 2011-11-14 Resin dispensing apparatus for light emitting device package and method of manufacturing light emitting device package using the same
CN201110380876.XA CN102544257B (zh) 2010-11-22 2011-11-22 树脂分配设备及使用其制造发光装置封装件的方法
EP11190027.0A EP2455204B1 (en) 2010-11-22 2011-11-22 Resin dispensing apparatus for light emitting device package and method of manufacturing light emitting device package
US14/029,350 US9056690B2 (en) 2010-11-22 2013-09-17 Resin dispensing apparatus for light emitting device package and method of manufacturing light emitting device package using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100116371A KR101743918B1 (ko) 2010-11-22 2010-11-22 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법

Publications (2)

Publication Number Publication Date
KR20120054954A KR20120054954A (ko) 2012-05-31
KR101743918B1 true KR101743918B1 (ko) 2017-06-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100116371A Active KR101743918B1 (ko) 2010-11-22 2010-11-22 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법

Country Status (5)

Country Link
US (2) US8546153B2 (enExample)
EP (1) EP2455204B1 (enExample)
JP (1) JP5944142B2 (enExample)
KR (1) KR101743918B1 (enExample)
CN (1) CN102544257B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140178901A1 (en) 2011-03-22 2014-06-26 The General Hospital Corporation Molecular Analysis of Tumor Samples
US9490402B2 (en) * 2012-08-17 2016-11-08 Zhiqiang Qian LED light-emitting device for white light
KR101436456B1 (ko) 2013-07-30 2014-09-01 (주)위시스 Ehd 펌프를 이용한 led 소자 제조 방법
DE102014106020A1 (de) * 2014-04-29 2015-10-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
KR102493202B1 (ko) * 2016-01-25 2023-01-30 주식회사 두오텍 칩패키지 와이어 접촉감지 시스템

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006086408A (ja) * 2004-09-17 2006-03-30 Stanley Electric Co Ltd Ｌｅｄ装置

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JPH01284364A (ja) * 1988-05-11 1989-11-15 Seiwa Denki Kk ディスペンサー
JPH01288363A (ja) * 1988-05-13 1989-11-20 Seiwa Denki Kk ディスペンサー
JP2856881B2 (ja) * 1990-10-08 1999-02-10 株式会社東芝 半導体封止装置
JPH0766539A (ja) 1993-08-25 1995-03-10 Toyota Motor Corp 電極における接着用樹脂の塗布方法及びその塗布装置
JPH07161743A (ja) * 1993-12-02 1995-06-23 Hitachi Ltd 樹脂モールド装置
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Also Published As

Publication number Publication date
CN102544257B (zh) 2015-01-21
JP2012114430A (ja) 2012-06-14
US20120129281A1 (en) 2012-05-24
US8546153B2 (en) 2013-10-01
KR20120054954A (ko) 2012-05-31
EP2455204A3 (en) 2014-12-24
JP5944142B2 (ja) 2016-07-05
US9056690B2 (en) 2015-06-16
EP2455204B1 (en) 2016-04-27
CN102544257A (zh) 2012-07-04
EP2455204A2 (en) 2012-05-23
US20140014682A1 (en) 2014-01-16

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