JP5944142B2 - 発光素子パッケージの樹脂塗布装置、及びこれを用いる発光素子パッケージの製造方法 - Google Patents

発光素子パッケージの樹脂塗布装置、及びこれを用いる発光素子パッケージの製造方法 Download PDF

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Publication number
JP5944142B2
JP5944142B2 JP2011243464A JP2011243464A JP5944142B2 JP 5944142 B2 JP5944142 B2 JP 5944142B2 JP 2011243464 A JP2011243464 A JP 2011243464A JP 2011243464 A JP2011243464 A JP 2011243464A JP 5944142 B2 JP5944142 B2 JP 5944142B2
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Japan
Prior art keywords
light emitting
resin
emitting device
device package
unit
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JP2011243464A
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English (en)
Japanese (ja)
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JP2012114430A (ja
JP2012114430A5 (enExample
Inventor
ヨン キム、ジョー
ヨン キム、ジョー
キ チョイ、スン
キ チョイ、スン
フン ホン、ジェ
フン ホン、ジェ
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Publication of JP2012114430A publication Critical patent/JP2012114430A/ja
Publication of JP2012114430A5 publication Critical patent/JP2012114430A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/44—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B3/00—Packaging plastic material, semiliquids, liquids or mixed solids and liquids, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
    • B65B3/04—Methods of, or means for, filling the material into the containers or receptacles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/042—Feeding of the material to be moulded, e.g. into a mould cavity using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2011243464A 2010-11-22 2011-11-07 発光素子パッケージの樹脂塗布装置、及びこれを用いる発光素子パッケージの製造方法 Active JP5944142B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0116371 2010-11-22
KR1020100116371A KR101743918B1 (ko) 2010-11-22 2010-11-22 발광소자 패키지의 수지 도포 장치 및 이를 이용한 발광소자 패키지 제조방법

Publications (3)

Publication Number Publication Date
JP2012114430A JP2012114430A (ja) 2012-06-14
JP2012114430A5 JP2012114430A5 (enExample) 2015-01-08
JP5944142B2 true JP5944142B2 (ja) 2016-07-05

Family

ID=45093397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011243464A Active JP5944142B2 (ja) 2010-11-22 2011-11-07 発光素子パッケージの樹脂塗布装置、及びこれを用いる発光素子パッケージの製造方法

Country Status (5)

Country Link
US (2) US8546153B2 (enExample)
EP (1) EP2455204B1 (enExample)
JP (1) JP5944142B2 (enExample)
KR (1) KR101743918B1 (enExample)
CN (1) CN102544257B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140178901A1 (en) 2011-03-22 2014-06-26 The General Hospital Corporation Molecular Analysis of Tumor Samples
US9490402B2 (en) * 2012-08-17 2016-11-08 Zhiqiang Qian LED light-emitting device for white light
KR101436456B1 (ko) 2013-07-30 2014-09-01 (주)위시스 Ehd 펌프를 이용한 led 소자 제조 방법
DE102014106020A1 (de) * 2014-04-29 2015-10-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
KR102493202B1 (ko) * 2016-01-25 2023-01-30 주식회사 두오텍 칩패키지 와이어 접촉감지 시스템

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01284364A (ja) * 1988-05-11 1989-11-15 Seiwa Denki Kk ディスペンサー
JPH01288363A (ja) * 1988-05-13 1989-11-20 Seiwa Denki Kk ディスペンサー
JP2856881B2 (ja) * 1990-10-08 1999-02-10 株式会社東芝 半導体封止装置
JPH0766539A (ja) 1993-08-25 1995-03-10 Toyota Motor Corp 電極における接着用樹脂の塗布方法及びその塗布装置
JPH07161743A (ja) * 1993-12-02 1995-06-23 Hitachi Ltd 樹脂モールド装置
JP3352564B2 (ja) * 1994-05-20 2002-12-03 ヴィエルティー コーポレーション アセンブリへの充填材料の充填方法
JPH0831851A (ja) * 1994-07-13 1996-02-02 Hitachi Cable Ltd ダイボンディング装置
JPH0878452A (ja) * 1994-09-06 1996-03-22 Hitachi Ltd 樹脂封止装置
JPH08131813A (ja) * 1994-11-07 1996-05-28 Horiba Ltd 粘性流体供給装置
JP2002096013A (ja) * 2000-09-26 2002-04-02 Fujitsu Ltd 樹脂塗布方法
JP2002118271A (ja) * 2000-10-11 2002-04-19 Fujitsu Ltd 光素子の樹脂封止構造
CN1424772A (zh) * 2001-12-13 2003-06-18 诠兴开发科技股份有限公司 短波长的发光二极管封装方法
CN2537070Y (zh) * 2002-03-18 2003-02-19 佘孝平 拉链式防盗报警器
US6814110B2 (en) * 2002-12-12 2004-11-09 Stainless Steel Coatings, Inc. Method of and apparatus for improved pressurized fluid dispensing for the guaranteed filling of cavities and/or the generating of guaranteed uniform gasket beads and the like
CN2618683Y (zh) * 2003-05-09 2004-06-02 黄清文 点胶机
JP2005152826A (ja) * 2003-11-27 2005-06-16 Matsushita Electric Ind Co Ltd 吐出装置および封止装置
JP2006086408A (ja) * 2004-09-17 2006-03-30 Stanley Electric Co Ltd Ｌｅｄ装置
JP2008034443A (ja) * 2006-07-26 2008-02-14 Sharp Corp 樹脂塗布方法および光半導体装置
KR100863203B1 (ko) 2006-09-01 2008-10-13 주식회사 탑 엔지니어링 반도체 소자 제조용 도포장비의 노즐 충돌 인식장치
US20080290359A1 (en) * 2007-04-23 2008-11-27 Samsung Electro-Mechanics Co., Ltd. Light emitting device and manufacturing method of the same
CN201067733Y (zh) * 2007-07-06 2008-06-04 周明华 一种点胶机
CN201143480Y (zh) * 2007-09-17 2008-11-05 黄清文 三维自动点胶机
CN201562330U (zh) * 2009-11-11 2010-08-25 连龙 防盗自动报警器
JP2011187810A (ja) * 2010-03-10 2011-09-22 Renesas Electronics Corp 樹脂塗布装置、及び樹脂塗布方法

Also Published As

Publication number Publication date
CN102544257B (zh) 2015-01-21
JP2012114430A (ja) 2012-06-14
US20120129281A1 (en) 2012-05-24
US8546153B2 (en) 2013-10-01
KR20120054954A (ko) 2012-05-31
KR101743918B1 (ko) 2017-06-07
EP2455204A3 (en) 2014-12-24
US9056690B2 (en) 2015-06-16
EP2455204B1 (en) 2016-04-27
CN102544257A (zh) 2012-07-04
EP2455204A2 (en) 2012-05-23
US20140014682A1 (en) 2014-01-16

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