KR101724323B1 - 진동, 및 통합된 카메라에 의한 하부로부터의 소자의 광학 검출을 이용한 소자의 제공 - Google Patents

진동, 및 통합된 카메라에 의한 하부로부터의 소자의 광학 검출을 이용한 소자의 제공 Download PDF

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KR101724323B1
KR101724323B1 KR1020140128369A KR20140128369A KR101724323B1 KR 101724323 B1 KR101724323 B1 KR 101724323B1 KR 1020140128369 A KR1020140128369 A KR 1020140128369A KR 20140128369 A KR20140128369 A KR 20140128369A KR 101724323 B1 KR101724323 B1 KR 101724323B1
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South Korea
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providing
elements
region
light
camera
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KR1020140128369A
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Korean (ko)
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KR20150034649A (ko
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슈테판 막
안드레아스 쵤러
칼 하인츠 베쉬
하랄트 슈탄츨
노르베르트 하일만
크리스토프 피셔
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에이에스엠 어셈블리 시스템즈 게엠베하 운트 콤파니 카게
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Publication of KR20150034649A publication Critical patent/KR20150034649A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/028—Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
KR1020140128369A 2013-09-26 2014-09-25 진동, 및 통합된 카메라에 의한 하부로부터의 소자의 광학 검출을 이용한 소자의 제공 KR101724323B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013219477.3 2013-09-26
DE102013219477.3A DE102013219477B4 (de) 2013-09-26 2013-09-26 Bereitstellen von Bauelementen mittels Vibration und optisches Erfassen der Bauelemente von unten mittels einer integrierten Kamera

Publications (2)

Publication Number Publication Date
KR20150034649A KR20150034649A (ko) 2015-04-03
KR101724323B1 true KR101724323B1 (ko) 2017-04-07

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KR1020140128369A KR101724323B1 (ko) 2013-09-26 2014-09-25 진동, 및 통합된 카메라에 의한 하부로부터의 소자의 광학 검출을 이용한 소자의 제공

Country Status (3)

Country Link
KR (1) KR101724323B1 (de)
CN (1) CN104519728B (de)
DE (1) DE102013219477B4 (de)

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* Cited by examiner, † Cited by third party
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CN106061226B (zh) * 2015-04-13 2019-10-15 先进装配系统有限责任两合公司 通过振动向贴装准备区域内提供散装元件的元件输入装置及相应的贴装准备工序
DE102017116042B4 (de) 2017-07-17 2019-03-21 Asm Assembly Systems Gmbh & Co. Kg Verfahren und Bestückautomat zum Bestücken von Bauelementeträgern mit elektronischen Bauelementen
DE102018102288B4 (de) * 2018-02-01 2019-09-05 Asm Assembly Systems Gmbh & Co. Kg Verfahren und Vorrichtung zum Bestimmen der Orientierung eines Bauelements mit gebogenen Anschlusskontakten anhand von charakteristischen Reflexen, Bestückautomat.
CN108455193A (zh) * 2018-03-09 2018-08-28 无锡市锡东橡塑机械有限公司 一种芯片送料机构
CN108761911A (zh) * 2018-05-29 2018-11-06 Oppo（重庆）智能科技有限公司 显示模组及电子设备
FR3086279B1 (fr) * 2018-09-24 2020-10-02 Expertise Vision Convoyeur a inertie et procede de transport de pieces mettant en oeuvre un tel convoyeur a inertie
DE102018127275B3 (de) * 2018-10-31 2020-03-12 Asm Assembly Systems Gmbh & Co. Kg Bauelement-Zuführvorrichtung und Verfahren zum Bereitstellen von vereinzelten Bauelementen mittels Vibration, Bestücksystem
DE102018127276B8 (de) * 2018-10-31 2020-06-18 Asm Assembly Systems Gmbh & Co. Kg Bauelement-Zuführvorrichtung für eine positionsadaptive Bereitstellung von Bauelementen an einer Abholposition, Bestücksystem und Verfahren zum Bereitstellen von Bauelementen
DE102020100615B3 (de) * 2020-01-14 2021-06-17 Asm Assembly Systems Gmbh & Co. Kg Bauteilkassette, Annahmevorrichtung sowie System mit einer Bauteilkassette und einer Annahmevorrichtung.
DE102020100613B3 (de) * 2020-01-14 2021-05-12 Asm Assembly Systems Gmbh & Co. Kg Annahmevorrichtung, Bauteilkassette und System
CN113306760B (zh) * 2021-05-25 2022-06-10 贝隆精密科技股份有限公司 一种柔性震动机械手摆盘机
CN113681217B (zh) * 2021-08-09 2023-05-26 浙江同星科技股份有限公司 一种大型换热器焊接用自动输送装置
CN113844911B (zh) * 2021-09-27 2024-04-05 山东诺诚智汇数字科技有限公司 基于激光视觉的化肥装车系统及方法

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JP2001199541A (ja) 2000-01-13 2001-07-24 Murata Mfg Co Ltd 部品の取扱装置および取扱方法
JP2011213454A (ja) 2010-03-31 2011-10-27 Sinfonia Technology Co Ltd 振動搬送装置
JP2012106838A (ja) 2010-11-17 2012-06-07 Murata Mfg Co Ltd 電子部品供給装置及び電子部品の供給方法

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DE8804665U1 (de) * 1988-04-08 1988-06-01 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
JPH07151523A (ja) * 1993-11-30 1995-06-16 Sanyo Electric Co Ltd 電子部品検査装置
JP3430919B2 (ja) * 1998-05-15 2003-07-28 株式会社村田製作所 部品搬送装置
JP4713776B2 (ja) * 2001-07-23 2011-06-29 富士機械製造株式会社 電気部品供給システム
DK1513749T3 (da) * 2002-06-06 2006-10-09 Flexfactory Ag Fremföring af rystegodsdele
KR101079501B1 (ko) * 2004-08-27 2011-11-03 쓰쿠바 세이코 가부시키가이샤 반송 검사 장치 및 반송 장치
JP2006100484A (ja) * 2004-09-29 2006-04-13 Taiyo Yuden Co Ltd 部品供給装置
CH700371B1 (fr) 2009-02-05 2013-11-15 Asyril Sa Système d'alimentation en composants.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001199541A (ja) 2000-01-13 2001-07-24 Murata Mfg Co Ltd 部品の取扱装置および取扱方法
JP2011213454A (ja) 2010-03-31 2011-10-27 Sinfonia Technology Co Ltd 振動搬送装置
JP2012106838A (ja) 2010-11-17 2012-06-07 Murata Mfg Co Ltd 電子部品供給装置及び電子部品の供給方法

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Publication number Publication date
CN104519728B (zh) 2018-02-02
CN104519728A (zh) 2015-04-15
DE102013219477B4 (de) 2015-05-21
KR20150034649A (ko) 2015-04-03
DE102013219477A1 (de) 2015-03-26

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