DE102018127276B8 - Bauelement-Zuführvorrichtung für eine positionsadaptive Bereitstellung von Bauelementen an einer Abholposition, Bestücksystem und Verfahren zum Bereitstellen von Bauelementen - Google Patents

Bauelement-Zuführvorrichtung für eine positionsadaptive Bereitstellung von Bauelementen an einer Abholposition, Bestücksystem und Verfahren zum Bereitstellen von Bauelementen Download PDF

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Publication number
DE102018127276B8
DE102018127276B8 DE102018127276.6A DE102018127276A DE102018127276B8 DE 102018127276 B8 DE102018127276 B8 DE 102018127276B8 DE 102018127276 A DE102018127276 A DE 102018127276A DE 102018127276 B8 DE102018127276 B8 DE 102018127276B8
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DE
Germany
Prior art keywords
components
pick
feed device
placement system
component feed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102018127276.6A
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English (en)
Other versions
DE102018127276B3 (de
Inventor
Sebastian Lohmeier
Thomas Rossmann
Klaus Sattler
Stefan Seitz
Michele Trigiani
Severin Unger
Stefan Geiger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASMPT GmbH and Co KG
Original Assignee
ASM Assembly Systems GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM Assembly Systems GmbH and Co KG filed Critical ASM Assembly Systems GmbH and Co KG
Priority to DE102018127276.6A priority Critical patent/DE102018127276B8/de
Priority to CN201911035684.8A priority patent/CN111132536B/zh
Priority to KR1020190136433A priority patent/KR102325457B1/ko
Application granted granted Critical
Publication of DE102018127276B3 publication Critical patent/DE102018127276B3/de
Publication of DE102018127276B8 publication Critical patent/DE102018127276B8/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/028—Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B23P19/001—Article feeders for assembling machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B23P19/001—Article feeders for assembling machines
    • B23P19/004—Feeding the articles from hoppers to machines or dispensers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/02—Control or detection
    • B65G2203/0208—Control or detection relating to the transported articles
    • B65G2203/0233—Position of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/02—Control or detection
    • B65G2203/0208—Control or detection relating to the transported articles
    • B65G2203/0241—Quantity of articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G27/00—Jigging conveyors

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geophysics (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Feeding Of Articles To Conveyors (AREA)
DE102018127276.6A 2018-10-31 2018-10-31 Bauelement-Zuführvorrichtung für eine positionsadaptive Bereitstellung von Bauelementen an einer Abholposition, Bestücksystem und Verfahren zum Bereitstellen von Bauelementen Active DE102018127276B8 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE102018127276.6A DE102018127276B8 (de) 2018-10-31 2018-10-31 Bauelement-Zuführvorrichtung für eine positionsadaptive Bereitstellung von Bauelementen an einer Abholposition, Bestücksystem und Verfahren zum Bereitstellen von Bauelementen
CN201911035684.8A CN111132536B (zh) 2018-10-31 2019-10-29 在元件进给设备的拾取位置自适应位置地提供元件
KR1020190136433A KR102325457B1 (ko) 2018-10-31 2019-10-30 부품 공급 장치의 픽업 위치에서 부품들의 위치 적응식 제공

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102018127276.6A DE102018127276B8 (de) 2018-10-31 2018-10-31 Bauelement-Zuführvorrichtung für eine positionsadaptive Bereitstellung von Bauelementen an einer Abholposition, Bestücksystem und Verfahren zum Bereitstellen von Bauelementen

Publications (2)

Publication Number Publication Date
DE102018127276B3 DE102018127276B3 (de) 2020-04-23
DE102018127276B8 true DE102018127276B8 (de) 2020-06-18

Family

ID=70468443

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102018127276.6A Active DE102018127276B8 (de) 2018-10-31 2018-10-31 Bauelement-Zuführvorrichtung für eine positionsadaptive Bereitstellung von Bauelementen an einer Abholposition, Bestücksystem und Verfahren zum Bereitstellen von Bauelementen

Country Status (3)

Country Link
KR (1) KR102325457B1 (de)
CN (1) CN111132536B (de)
DE (1) DE102018127276B8 (de)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013219473A1 (de) * 2013-09-26 2015-03-26 Asm Assembly Systems Gmbh & Co. Kg Vorrichtung zum Transportieren von Bauelementen und Bauelement-Zuführvorrichtung zum Bereitstellen von Bauelementen in einem Bereitstellungsbereich
DE102016106266A1 (de) * 2015-04-13 2016-10-13 Asm Assembly Systems Gmbh & Co. Kg Bereitstellen von vereinzelten Bauelementen mittels Vibration in einem Bereitstellungsbereich
WO2016208069A1 (ja) * 2015-06-26 2016-12-29 富士機械製造株式会社 部品実装機

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0626973B2 (ja) * 1985-11-15 1994-04-13 ロ−ム株式会社 マガジンへのチツプ部品の並べ装置
JPH03145150A (ja) * 1989-10-30 1991-06-20 Nitto Denko Corp 半導体ウエハのバッファ搬送装置
JPH06232241A (ja) * 1993-02-03 1994-08-19 Matsushita Electric Ind Co Ltd 半導体製造装置の基板位置決め機構
CN1189436A (zh) * 1997-01-28 1998-08-05 三星电子株式会社 托盘供给装置
JP4041767B2 (ja) * 2003-05-13 2008-01-30 松下電器産業株式会社 電子部品供給装置
JP5497775B2 (ja) * 2009-10-15 2014-05-21 富士機械製造株式会社 電子回路部品装着機
JP5732403B2 (ja) * 2009-12-11 2015-06-10 富士機械製造株式会社 バルクフィーダ
JP5212429B2 (ja) * 2010-07-09 2013-06-19 パナソニック株式会社 部品実装装置および部品実装方法
JP5850661B2 (ja) * 2011-07-20 2016-02-03 富士機械製造株式会社 部品供給装置
CN104770077A (zh) * 2012-08-31 2015-07-08 黄永洙 具有元件自动暴露装置的载带的自动供给设备
JP6154138B2 (ja) * 2013-01-10 2017-06-28 Juki株式会社 ボウルフィーダアセンブリおよび電子部品実装装置
WO2014128913A1 (ja) * 2013-02-22 2014-08-28 富士機械製造株式会社 部品実装システムおよびそれに用いるバルク部品決定方法
DE102013219477B4 (de) * 2013-09-26 2015-05-21 Asm Assembly Systems Gmbh & Co. Kg Bereitstellen von Bauelementen mittels Vibration und optisches Erfassen der Bauelemente von unten mittels einer integrierten Kamera
DE102013016707B4 (de) * 2013-10-09 2015-05-07 Asm Assembly Systems Gmbh & Co. Kg Transportvorrichtung und Bestückvorrichtung damit
CN105050375A (zh) * 2015-08-17 2015-11-11 苏州辉隆自动化设备有限公司 盘装料供料设备以及供料方法
US10617048B2 (en) * 2016-03-10 2020-04-07 Panasonic Intellectual Property Management Co., Ltd. Component supplier and component supplying method
CN107801372B (zh) * 2016-08-29 2022-06-21 Juki株式会社 安装头及安装装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013219473A1 (de) * 2013-09-26 2015-03-26 Asm Assembly Systems Gmbh & Co. Kg Vorrichtung zum Transportieren von Bauelementen und Bauelement-Zuführvorrichtung zum Bereitstellen von Bauelementen in einem Bereitstellungsbereich
DE102016106266A1 (de) * 2015-04-13 2016-10-13 Asm Assembly Systems Gmbh & Co. Kg Bereitstellen von vereinzelten Bauelementen mittels Vibration in einem Bereitstellungsbereich
WO2016208069A1 (ja) * 2015-06-26 2016-12-29 富士機械製造株式会社 部品実装機

Also Published As

Publication number Publication date
DE102018127276B3 (de) 2020-04-23
CN111132536B (zh) 2022-02-18
KR102325457B1 (ko) 2021-11-15
CN111132536A (zh) 2020-05-08
KR20200049665A (ko) 2020-05-08

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Owner name: ASMPT GMBH & CO. KG, DE

Free format text: FORMER OWNER: ASM ASSEMBLY SYSTEMS GMBH & CO. KG, 81379 MUENCHEN, DE