KR101710334B1 - 편향가능 구조를 포함하는 디바이스 - Google Patents

편향가능 구조를 포함하는 디바이스 Download PDF

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KR101710334B1
KR101710334B1 KR1020167001911A KR20167001911A KR101710334B1 KR 101710334 B1 KR101710334 B1 KR 101710334B1 KR 1020167001911 A KR1020167001911 A KR 1020167001911A KR 20167001911 A KR20167001911 A KR 20167001911A KR 101710334 B1 KR101710334 B1 KR 101710334B1
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micromirror
electrodes
wafer
substrate
layer
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KR20160015392A (ko
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토르비외른 에베포르스
에드바르드 켈베스텐
페테르 오그렌
니클라스 스베딘
토마스 에릭손
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사일렉스 마이크로시스템스 에이비
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00095—Interconnects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
    • G02B6/3512—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
    • G02B6/3518—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3584—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/092—Buried interconnects in the substrate or in the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/095—Feed-through, via through the lid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020167001911A 2008-12-23 2009-12-23 편향가능 구조를 포함하는 디바이스 Active KR101710334B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0802663-5 2008-12-23
SE0802663A SE533992C2 (sv) 2008-12-23 2008-12-23 Elektrisk anslutning i en struktur med isolerande och ledande lager
PCT/SE2009/051496 WO2010074649A1 (en) 2008-12-23 2009-12-23 Via structure and method thereof

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020117014438A Division KR101659638B1 (ko) 2008-12-23 2009-12-23 층상형 mems 구조 및 그 방법

Publications (2)

Publication Number Publication Date
KR20160015392A KR20160015392A (ko) 2016-02-12
KR101710334B1 true KR101710334B1 (ko) 2017-02-27

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KR1020117014438A Active KR101659638B1 (ko) 2008-12-23 2009-12-23 층상형 mems 구조 및 그 방법
KR1020167001911A Active KR101710334B1 (ko) 2008-12-23 2009-12-23 편향가능 구조를 포함하는 디바이스

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Country Link
US (2) US8592981B2 (enExample)
EP (3) EP2377154B1 (enExample)
JP (3) JP5701772B2 (enExample)
KR (2) KR101659638B1 (enExample)
CN (1) CN102362346B (enExample)
SE (1) SE533992C2 (enExample)
WO (1) WO2010074649A1 (enExample)

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JP6578547B2 (ja) 2015-07-23 2019-09-25 株式会社ホンダロック 後方視認装置
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CN106783801B (zh) * 2016-11-18 2020-02-14 浙江大学 高密度soi封装基板及其制备方法
US10204873B2 (en) * 2017-05-08 2019-02-12 Infineon Technologies Americas Corp. Breakable substrate for semiconductor die
CN107172800B (zh) * 2017-06-08 2023-10-17 鹤山市中富兴业电路有限公司 一种用于天线射频传输的pcb板及其制作方法
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WO2024197278A2 (en) * 2023-03-23 2024-09-26 The Regents Of The University Of California Co-wiring method for primitive spatial modulation with lightweight operation
CN119278397A (zh) * 2023-03-29 2025-01-07 ｓａｎｔｅｃ Ｈｏｌｄｉｎｇｓ株式会社 光开关

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Also Published As

Publication number Publication date
SE0802663A1 (sv) 2010-06-24
KR20160015392A (ko) 2016-02-12
US20120018898A1 (en) 2012-01-26
US20140063580A1 (en) 2014-03-06
WO2010074649A1 (en) 2010-07-01
EP2377154A4 (en) 2012-06-27
US9448401B2 (en) 2016-09-20
US8592981B2 (en) 2013-11-26
JP5701772B2 (ja) 2015-04-15
JP2015146018A (ja) 2015-08-13
JP6093788B2 (ja) 2017-03-08
EP2381289A1 (en) 2011-10-26
JP2015147295A (ja) 2015-08-20
CN102362346B (zh) 2014-07-30
EP2383601A1 (en) 2011-11-02
SE533992C2 (sv) 2011-03-22
KR20110110771A (ko) 2011-10-07
JP2012513621A (ja) 2012-06-14
EP2377154A1 (en) 2011-10-19
EP2383601B1 (en) 2015-12-23
EP2377154B1 (en) 2019-08-14
KR101659638B1 (ko) 2016-09-26
CN102362346A (zh) 2012-02-22

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