KR101699645B1 - 도전성 페이스트 - Google Patents

도전성 페이스트 Download PDF

Info

Publication number
KR101699645B1
KR101699645B1 KR1020157011586A KR20157011586A KR101699645B1 KR 101699645 B1 KR101699645 B1 KR 101699645B1 KR 1020157011586 A KR1020157011586 A KR 1020157011586A KR 20157011586 A KR20157011586 A KR 20157011586A KR 101699645 B1 KR101699645 B1 KR 101699645B1
Authority
KR
South Korea
Prior art keywords
component
conductive paste
parts
mass
group
Prior art date
Application number
KR1020157011586A
Other languages
English (en)
Korean (ko)
Other versions
KR20150089001A (ko
Inventor
후미오 모리우치
히데하루 사토
Original Assignee
페르녹스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 페르녹스 가부시키가이샤 filed Critical 페르녹스 가부시키가이샤
Publication of KR20150089001A publication Critical patent/KR20150089001A/ko
Application granted granted Critical
Publication of KR101699645B1 publication Critical patent/KR101699645B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020157011586A 2012-12-21 2013-12-16 도전성 페이스트 KR101699645B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012289431 2012-12-21
JPJP-P-2012-289431 2012-12-21
PCT/JP2013/083638 WO2014098036A1 (ja) 2012-12-21 2013-12-16 導電性ペースト

Publications (2)

Publication Number Publication Date
KR20150089001A KR20150089001A (ko) 2015-08-04
KR101699645B1 true KR101699645B1 (ko) 2017-01-24

Family

ID=50978365

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157011586A KR101699645B1 (ko) 2012-12-21 2013-12-16 도전성 페이스트

Country Status (5)

Country Link
JP (1) JPWO2014098036A1 (zh)
KR (1) KR101699645B1 (zh)
CN (1) CN105008462B (zh)
TW (1) TW201432723A (zh)
WO (1) WO2014098036A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019088521A1 (ko) * 2017-10-31 2019-05-09 엘에스니꼬동제련 주식회사 태양전지 전극용 도전성 페이스트 및 이를 사용하여 제조된 태양전지

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102192757B1 (ko) * 2014-07-22 2020-12-18 알파 어셈블리 솔루션스 인크. 가요성 전자 표면을 위한 연신성 상호접속재
CN107545945A (zh) * 2017-07-03 2018-01-05 杭州正祺新材料有限公司 一种薄膜电容器电极封装用导电浆料及其制造方法
CN110157246B (zh) * 2019-06-18 2022-04-08 海盐华达油墨有限公司 一种导电油墨的制备方法
CN115602357A (zh) * 2022-10-24 2023-01-13 浙江振有电子股份有限公司（Cn） 一种强稳定性、高导电性的贯孔铜浆及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0693455A (ja) * 1991-04-08 1994-04-05 Mitsubishi Gas Chem Co Inc 銅膜形成基材の製造法
JPH05135619A (ja) * 1991-11-13 1993-06-01 Kao Corp 導電性銅ペーストの製造方法および該方法により得られる導電性銅ペースト
JPH05217422A (ja) * 1992-02-04 1993-08-27 Kao Corp 導電性ペーストおよび導電性塗膜
JP3152070B2 (ja) * 1994-07-08 2001-04-03 三菱マテリアル株式会社 透明導電膜形成用組成物
JPH1072673A (ja) * 1996-04-30 1998-03-17 Nippon Terupen Kagaku Kk 金属ペースト及び金属膜の製造方法
KR100709724B1 (ko) * 2007-01-30 2007-04-24 (주)이그잭스 도전막 형성을 위한 금속 페이스트
CN104246909B (zh) * 2012-03-30 2017-09-12 荒川化学工业股份有限公司 导电浆料、固化物、电极以及电子设备
JP6089175B2 (ja) * 2012-06-29 2017-03-08 荒川化学工業株式会社 導電性ペーストの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019088521A1 (ko) * 2017-10-31 2019-05-09 엘에스니꼬동제련 주식회사 태양전지 전극용 도전성 페이스트 및 이를 사용하여 제조된 태양전지

Also Published As

Publication number Publication date
CN105008462B (zh) 2017-03-08
WO2014098036A1 (ja) 2014-06-26
JPWO2014098036A1 (ja) 2017-01-12
TW201432723A (zh) 2014-08-16
KR20150089001A (ko) 2015-08-04
CN105008462A (zh) 2015-10-28

Similar Documents

Publication Publication Date Title
KR101699645B1 (ko) 도전성 페이스트
JP6592363B2 (ja) 薄膜印刷用導電性組成物及び薄膜導電パターン形成方法
JP5742112B2 (ja) 硬化性電磁波シールド性接着性フィルムおよびその製造方法
EP1972660B1 (en) Conductive composition, conductive paint, and method of forming conductive paint
JP4832615B1 (ja) 低温焼結性導電性ペーストおよびそれを用いた導電膜と導電膜の形成方法
JP6089175B2 (ja) 導電性ペーストの製造方法
KR101479479B1 (ko) 투명 도전성 부재의 제조 방법
CN101524007A (zh) 生产结构化导电表面的方法
TW201937006A (zh) 電子零件封裝及其製造方法
JP2011171522A (ja) 硬化性電磁波シールド性接着性フィルムおよびその製造方法
KR20150038285A (ko) 잉크 조성물, 회로 보드, 및 그 제조 방법
JP4853775B2 (ja) 還元性ポリマー微粒子を用いるパターン化された金属膜が形成されためっきフィルムの製造法
JP2007173075A (ja) 導電性微粒子及び異方性導電材料
JP2015115314A (ja) レーザーエッチング用導電性銀ペースト、回路基板用基材および回路基板
WO2019013179A1 (ja) 無電解めっき下地膜形成用組成物
JP6296290B2 (ja) 金属ベースプリント配線板及びその製造方法
TWI548524B (zh) Laminated body, conductive pattern and circuit
JP2014080555A (ja) 熱硬化性組成物及び熱硬化性導電性ペースト
JP2967117B2 (ja) 電子線硬化型導電性ペースト組成物
CN110574125B (zh) 导电性糊剂
JPH06100804A (ja) 導電性のペースト組成物
JP5515212B2 (ja) ウェットエッチング用レジストインク、および金属層のパターン形成方法、および回路基板製造方法。
JPS6330796B2 (zh)
JP2008093914A (ja) 銅被覆プラスチック基板及びその製造方法
JP2014194055A (ja) めっき下地用塗料、当該塗料を用いためっき下地塗膜層の製造方法、めっき物の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20191119

Year of fee payment: 4