KR101670940B1 - 기판 처리 장치, 기판의 반송 방법, 이상 처리부 판정 방법 및 컴퓨터 기억 매체 - Google Patents

기판 처리 장치, 기판의 반송 방법, 이상 처리부 판정 방법 및 컴퓨터 기억 매체 Download PDF

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KR101670940B1
KR101670940B1 KR1020110106852A KR20110106852A KR101670940B1 KR 101670940 B1 KR101670940 B1 KR 101670940B1 KR 1020110106852 A KR1020110106852 A KR 1020110106852A KR 20110106852 A KR20110106852 A KR 20110106852A KR 101670940 B1 KR101670940 B1 KR 101670940B1
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defect
processing
substrate
cause
section
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KR20120049803A (ko
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마코토 하야카와
히로시 도미타
타츠헤이 요시다
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020110106852A 2010-11-09 2011-10-19 기판 처리 장치, 기판의 반송 방법, 이상 처리부 판정 방법 및 컴퓨터 기억 매체 Active KR101670940B1 (ko)

Applications Claiming Priority (2)

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JPJP-P-2010-250909 2010-11-09
JP2010250909A JP5566265B2 (ja) 2010-11-09 2010-11-09 基板処理装置、プログラム、コンピュータ記憶媒体及び基板の搬送方法

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KR20120049803A KR20120049803A (ko) 2012-05-17
KR101670940B1 true KR101670940B1 (ko) 2016-10-31

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US (1) US9026240B2 (enExample)
JP (1) JP5566265B2 (enExample)
KR (1) KR101670940B1 (enExample)
CN (1) CN102664158B (enExample)
TW (1) TWI503534B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6221461B2 (ja) * 2013-07-25 2017-11-01 大日本印刷株式会社 欠陥解析方法、凹凸パターン構造体の製造方法及びインプリントシステム
JP6244329B2 (ja) 2015-05-12 2017-12-06 東京エレクトロン株式会社 基板の検査方法、基板処理システム及びコンピュータ記憶媒体
JP6329923B2 (ja) * 2015-06-08 2018-05-23 東京エレクトロン株式会社 基板の検査方法、コンピュータ記憶媒体及び基板検査装置
DE102018106751B4 (de) 2017-07-31 2025-02-27 Taiwan Semiconductor Manufacturing Co. Ltd. Automatisiertes inspektionswerkzeug
US10490463B2 (en) * 2017-07-31 2019-11-26 Taiwan Semiconductor Manufacturing Co., Ltd. Automated inspection tool
CN109685756A (zh) * 2017-10-16 2019-04-26 乐达创意科技有限公司 影像特征自动辨识装置、系统及方法
JP7087397B2 (ja) * 2018-01-17 2022-06-21 東京エレクトロン株式会社 基板の欠陥検査装置、基板の欠陥検査方法及び記憶媒体
KR102267919B1 (ko) 2018-06-28 2021-06-23 주식회사 고영테크놀러지 기판에 실장된 부품의 실장 불량 원인을 결정하는 전자 장치 및 방법
WO2020005001A1 (ko) * 2018-06-28 2020-01-02 주식회사 고영테크놀러지 기판에 실장된 부품의 실장 불량 원인을 결정하는 전자 장치 및 방법
JP7105135B2 (ja) * 2018-08-17 2022-07-22 東京エレクトロン株式会社 処理条件補正方法及び基板処理システム
JP7308337B2 (ja) * 2018-08-17 2023-07-13 東京エレクトロン株式会社 異常判定方法及び基板処理システム
JP7133424B2 (ja) * 2018-10-05 2022-09-08 東京エレクトロン株式会社 基板処理装置、及び基板処理方法、及び記憶媒体
WO2020111756A1 (ko) 2018-11-27 2020-06-04 주식회사 고영테크놀러지 기판에 대한 검사 결과를 표시하는 전자 장치 및 방법
JP7450358B2 (ja) * 2019-09-25 2024-03-15 東京エレクトロン株式会社 基板処理制御方法、基板処理装置、及び記憶媒体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311714A (ja) 2003-04-07 2004-11-04 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2006303241A (ja) 2005-04-21 2006-11-02 Tokyo Seimitsu Co Ltd ウェーハ搬送方法及びウェーハ搬送装置

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS3812185B1 (enExample) * 1961-12-30 1963-07-15
US3781117A (en) * 1972-03-31 1973-12-25 United States Steel Corp Apparatus for surface inspection of moving material
US4644172A (en) * 1984-02-22 1987-02-17 Kla Instruments Corporation Electronic control of an automatic wafer inspection system
US4618938A (en) * 1984-02-22 1986-10-21 Kla Instruments Corporation Method and apparatus for automatic wafer inspection
US4771468A (en) * 1986-04-17 1988-09-13 International Business Machines Corporation System for automatic inspection of periodic patterns
US5086397A (en) * 1989-07-18 1992-02-04 Schuster Pamela K Method and apparatus for data collection of testing and inspection of products made on a production assembly line
JP2986868B2 (ja) * 1990-03-14 1999-12-06 株式会社日立製作所 外観検査方法及びその装置
JPH0480939A (ja) * 1990-07-24 1992-03-13 Hitachi Ltd 半導体集積回路装置の製造方法
US5081965A (en) * 1990-08-15 1992-01-21 Warr Valves, Inc. Intake valve for internal combustion engine
JP3472600B2 (ja) * 1993-08-25 2003-12-02 株式会社日立製作所 半導体デバイスの製造方法
JPH07201946A (ja) * 1993-12-28 1995-08-04 Hitachi Ltd 半導体装置等の製造方法及びその装置並びに検査方法及びその装置
DE19502434A1 (de) * 1994-04-29 1995-11-02 Hewlett Packard Co System und Verfahren zur inkrementalen Herstellung von Schaltungsplatinen
US5539752A (en) * 1995-06-30 1996-07-23 Advanced Micro Devices, Inc. Method and system for automated analysis of semiconductor defect data
US6021512A (en) * 1996-11-27 2000-02-01 International Business Machines Corporation Data processing system having memory sub-array redundancy and method therefor
US5910895A (en) * 1997-06-13 1999-06-08 Teradyne, Inc. Low cost, easy to use automatic test system software
JP2000077609A (ja) * 1998-08-28 2000-03-14 Hitachi Ltd 半導体集積回路装置
US6466314B1 (en) * 1998-09-17 2002-10-15 Applied Materials, Inc. Reticle design inspection system
JP3812185B2 (ja) * 1998-12-01 2006-08-23 株式会社日立製作所 欠陥分類方法およびその装置
US6539106B1 (en) * 1999-01-08 2003-03-25 Applied Materials, Inc. Feature-based defect detection
US6449749B1 (en) * 1999-11-18 2002-09-10 Pdf Solutions, Inc. System and method for product yield prediction
KR100341821B1 (ko) * 2000-02-02 2002-06-26 윤덕용 펄스형 반도체 광원 어레이를 이용한 저장형광스크린판독장치 및 방법
JP3555859B2 (ja) * 2000-03-27 2004-08-18 広島日本電気株式会社 半導体生産システム及び半導体装置の生産方法
US6566017B1 (en) * 2000-08-14 2003-05-20 Taiwan Semiconductor Manufacturing Co., Ltd Semiconductor wafer imaging mask having uniform pattern features and method of making same
JP2002196469A (ja) * 2000-12-25 2002-07-12 Hitachi Ltd デバイスの製造方法、それに用いるホトマスク、およびそのホトマスクの製造方法
JPWO2002056332A1 (ja) * 2001-01-10 2004-05-20 株式会社荏原製作所 電子線による検査装置、検査方法、及びその検査装置を用いたデバイス製造方法
US20020147960A1 (en) * 2001-01-26 2002-10-10 Applied Materials, Inc. Method and apparatus for determining scheduling for wafer processing in cluster tools with integrated metrology and defect control
JP4770035B2 (ja) * 2001-02-23 2011-09-07 東京エレクトロン株式会社 処理システム及び処理システムの被処理体の搬送方法
WO2003021642A2 (en) * 2001-08-31 2003-03-13 Applied Materials, Inc. Method and apparatus for processing a wafer
JP3870052B2 (ja) * 2001-09-20 2007-01-17 株式会社日立製作所 半導体装置の製造方法及び欠陥検査データ処理方法
JP3916468B2 (ja) * 2002-01-11 2007-05-16 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2003287875A (ja) * 2002-01-24 2003-10-10 Hitachi Ltd マスクの製造方法および半導体集積回路装置の製造方法
US6774990B2 (en) * 2002-08-23 2004-08-10 Intel Corporation Method to inspect patterns with high resolution photoemission
US20040086166A1 (en) * 2002-11-01 2004-05-06 Photon Dynamics, Inc. Method and apparatus for flat patterned media inspection
KR100500526B1 (ko) * 2003-06-26 2005-07-12 삼성전자주식회사 반도체소자 검사장치
JP2005158780A (ja) * 2003-11-20 2005-06-16 Hitachi Ltd パターン欠陥検査方法及びその装置
JP2005217062A (ja) * 2004-01-28 2005-08-11 Matsushita Electric Ind Co Ltd フォトリソプロセス装置および欠陥検査方法
US7099729B2 (en) * 2004-02-20 2006-08-29 Powerchip Semiconductor Corp. Semiconductor process and yield analysis integrated real-time management method
JP2006277298A (ja) * 2005-03-29 2006-10-12 Tokyo Electron Ltd 基板処理装置、履歴情報記録方法、履歴情報記録プログラム及び履歴情報記録システム
JP2006278619A (ja) * 2005-03-29 2006-10-12 Hitachi Kokusai Electric Inc 半導体製造装置
JP4716362B2 (ja) * 2005-06-07 2011-07-06 東京エレクトロン株式会社 基板処理システム及び基板処理方法
JP2007194262A (ja) * 2006-01-17 2007-08-02 Olympus Corp 欠陥判定システムおよび基板処理システム
WO2007123238A1 (ja) * 2006-04-25 2007-11-01 Sharp Kabushiki Kaisha 不良原因設備特定システム
CN101432864B (zh) * 2006-04-27 2012-05-30 夏普株式会社 缺陷分布分类方法及系统、故障源设备确定方法及系统
TWI431380B (zh) * 2006-05-12 2014-03-21 Photon Dynamics Inc 沉積修復設備及方法
JP4388563B2 (ja) * 2007-03-27 2009-12-24 東京エレクトロン株式会社 基板の処理方法、基板処理装置及びコンピュータ読み取り可能な記憶媒体
JP5002380B2 (ja) 2007-09-06 2012-08-15 東京エレクトロン株式会社 処理装置の異常検出方法、処理装置及びコンピュータ読み取り可能な記憶媒体
JP5344734B2 (ja) * 2007-12-28 2013-11-20 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5156452B2 (ja) * 2008-03-27 2013-03-06 東京エレクトロン株式会社 欠陥分類方法、プログラム、コンピュータ記憶媒体及び欠陥分類装置
JP5099054B2 (ja) * 2009-03-13 2012-12-12 東京エレクトロン株式会社 基板処理装置、基板処理方法、塗布、現像装置、塗布、現像方法及び記憶媒体
JP5243335B2 (ja) * 2009-04-21 2013-07-24 東京エレクトロン株式会社 欠陥検査方法、欠陥検査装置、欠陥検査プログラム、及びそのプログラムを記録した記録媒体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311714A (ja) 2003-04-07 2004-11-04 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2006303241A (ja) 2005-04-21 2006-11-02 Tokyo Seimitsu Co Ltd ウェーハ搬送方法及びウェーハ搬送装置

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Publication number Publication date
CN102664158A (zh) 2012-09-12
KR20120049803A (ko) 2012-05-17
TW201229498A (en) 2012-07-16
JP2012104593A (ja) 2012-05-31
TWI503534B (zh) 2015-10-11
JP5566265B2 (ja) 2014-08-06
CN102664158B (zh) 2015-12-16
US20120116567A1 (en) 2012-05-10
US9026240B2 (en) 2015-05-05

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