KR101565703B1 - 칩 전자부품 및 그 제조방법 - Google Patents
칩 전자부품 및 그 제조방법 Download PDFInfo
- Publication number
- KR101565703B1 KR101565703B1 KR1020140090841A KR20140090841A KR101565703B1 KR 101565703 B1 KR101565703 B1 KR 101565703B1 KR 1020140090841 A KR1020140090841 A KR 1020140090841A KR 20140090841 A KR20140090841 A KR 20140090841A KR 101565703 B1 KR101565703 B1 KR 101565703B1
- Authority
- KR
- South Korea
- Prior art keywords
- insulating film
- conductor pattern
- coil conductor
- pattern portion
- oxide insulating
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 9
- 239000004020 conductor Substances 0.000 claims abstract description 102
- 238000000034 method Methods 0.000 claims description 35
- 229920000642 polymer Polymers 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 230000003746 surface roughness Effects 0.000 claims description 17
- 239000000126 substance Substances 0.000 claims description 16
- 230000001590 oxidative effect Effects 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 3
- 239000010408 film Substances 0.000 abstract description 114
- 230000007547 defect Effects 0.000 abstract description 19
- 239000000696 magnetic material Substances 0.000 abstract description 16
- 239000010409 thin film Substances 0.000 abstract description 10
- 229910000859 α-Fe Inorganic materials 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000003486 chemical etching Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000010301 surface-oxidation reaction Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2866—Combination of wires and sheets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Manufacturing & Machinery (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014210511A JP6000314B2 (ja) | 2013-10-22 | 2014-10-15 | チップ電子部品及びその製造方法 |
US14/516,151 US9773611B2 (en) | 2013-10-22 | 2014-10-16 | Chip electronic component and manufacturing method thereof |
CN201810343474.4A CN108597730B (zh) | 2013-10-22 | 2014-10-22 | 片式电子组件及其制造方法 |
CN201410566473.8A CN104575937B (zh) | 2013-10-22 | 2014-10-22 | 片式电子组件及其制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130126137 | 2013-10-22 | ||
KR1020130126137 | 2013-10-22 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150079274A Division KR101952859B1 (ko) | 2013-10-22 | 2015-06-04 | 칩 전자부품 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20150046717A KR20150046717A (ko) | 2015-04-30 |
KR101565703B1 true KR101565703B1 (ko) | 2015-11-03 |
Family
ID=53038012
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020140090841A KR101565703B1 (ko) | 2013-10-22 | 2014-07-18 | 칩 전자부품 및 그 제조방법 |
KR1020150079274A KR101952859B1 (ko) | 2013-10-22 | 2015-06-04 | 칩 전자부품 및 그 제조방법 |
KR1020180030889A KR102138887B1 (ko) | 2013-10-22 | 2018-03-16 | 칩 전자부품 및 그 제조방법 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150079274A KR101952859B1 (ko) | 2013-10-22 | 2015-06-04 | 칩 전자부품 및 그 제조방법 |
KR1020180030889A KR102138887B1 (ko) | 2013-10-22 | 2018-03-16 | 칩 전자부품 및 그 제조방법 |
Country Status (2)
Country | Link |
---|---|
KR (3) | KR101565703B1 (zh) |
CN (2) | CN104575937B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170090124A (ko) | 2016-01-28 | 2017-08-07 | 삼성전기주식회사 | 코일 부품 및 그 제조 방법 |
US10923276B2 (en) | 2017-11-29 | 2021-02-16 | Samsung Electro-Mechanics Co., Ltd. | Coil electronic component |
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KR101693749B1 (ko) * | 2015-04-06 | 2017-01-06 | 삼성전기주식회사 | 인덕터 소자 및 그 제조방법 |
KR101813322B1 (ko) | 2015-05-29 | 2017-12-28 | 삼성전기주식회사 | 코일 전자부품 |
KR101832559B1 (ko) * | 2015-05-29 | 2018-02-26 | 삼성전기주식회사 | 코일 전자부품 |
KR20160139967A (ko) * | 2015-05-29 | 2016-12-07 | 삼성전기주식회사 | 코일 전자부품 |
KR101719908B1 (ko) | 2015-07-01 | 2017-03-24 | 삼성전기주식회사 | 코일 전자부품 및 그 제조방법 |
KR101751117B1 (ko) | 2015-07-31 | 2017-06-26 | 삼성전기주식회사 | 코일 전자 부품 및 그 제조방법 |
KR102163056B1 (ko) | 2015-12-30 | 2020-10-08 | 삼성전기주식회사 | 코일 전자 부품 및 그 제조방법 |
JP6615024B2 (ja) * | 2016-03-24 | 2019-12-04 | 太陽誘電株式会社 | 電子部品 |
KR20180054264A (ko) * | 2016-11-15 | 2018-05-24 | 삼성전기주식회사 | 박막형 인덕터 및 그의 제조방법 |
US20180174736A1 (en) * | 2016-12-15 | 2018-06-21 | Samsung Electro-Mechanics Co., Ltd. | Inductor and manufacturing method of inductor |
KR101983190B1 (ko) | 2017-06-23 | 2019-09-10 | 삼성전기주식회사 | 박막 인덕터 |
KR101973448B1 (ko) * | 2017-12-11 | 2019-04-29 | 삼성전기주식회사 | 코일 부품 |
KR102064041B1 (ko) | 2017-12-11 | 2020-01-08 | 삼성전기주식회사 | 코일 부품 |
KR102052807B1 (ko) * | 2017-12-26 | 2019-12-09 | 삼성전기주식회사 | 인덕터 및 이의 제작 방법 |
KR20190078884A (ko) * | 2017-12-27 | 2019-07-05 | 삼성전기주식회사 | 인덕터 |
JP7464352B2 (ja) * | 2018-03-09 | 2024-04-09 | 日東電工株式会社 | 配線基板およびその製造方法 |
CN111524695B (zh) * | 2019-02-01 | 2021-08-31 | 乾坤科技股份有限公司 | 磁性装置及其制造方法 |
KR102679990B1 (ko) * | 2019-07-17 | 2024-07-02 | 삼성전기주식회사 | 코일 부품 |
KR102224311B1 (ko) | 2019-07-29 | 2021-03-08 | 삼성전기주식회사 | 코일 부품 |
JP7184063B2 (ja) * | 2020-03-30 | 2022-12-06 | 株式会社村田製作所 | コイル部品およびその製造方法 |
CN112086261A (zh) * | 2020-09-08 | 2020-12-15 | 奇力新电子股份有限公司 | 薄膜电感及其制造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151332A (ja) * | 2000-11-15 | 2002-05-24 | Sony Corp | 薄膜コイル及びその形成方法、並びに薄膜磁気ヘッド、薄膜インダクタ、薄膜磁気センサ |
JP2006024677A (ja) * | 2004-07-07 | 2006-01-26 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
JP2006253320A (ja) * | 2005-03-09 | 2006-09-21 | Tdk Corp | コイル部品 |
JP2010205905A (ja) | 2009-03-03 | 2010-09-16 | Fuji Electric Systems Co Ltd | 磁気部品および磁気部品の製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE423944B (sv) * | 1980-10-06 | 1982-06-14 | Asea Ab | Transformator eller reaktor |
CN1178232C (zh) * | 1999-04-26 | 2004-12-01 | 松下电器产业株式会社 | 电子零件及无线终端装置 |
JP2001244116A (ja) * | 2000-02-29 | 2001-09-07 | Taiyo Yuden Co Ltd | 電子部品及びその製造方法 |
US6977796B2 (en) * | 2002-02-08 | 2005-12-20 | Headway Technologies, Inc. | Wiring pattern and method of manufacturing the same and thin film magnetic head and method of manufacturing the same |
JP2005210010A (ja) | 2004-01-26 | 2005-08-04 | Tdk Corp | コイル基板及びその製造方法並びに表面実装型コイル素子 |
JP2006278484A (ja) * | 2005-03-28 | 2006-10-12 | Tdk Corp | コイル部品、及びコイル部品の製造方法 |
JP2006310716A (ja) * | 2005-03-31 | 2006-11-09 | Tdk Corp | 平面コイル素子 |
JP5115691B2 (ja) * | 2006-12-28 | 2013-01-09 | Tdk株式会社 | コイル装置、及びコイル装置の製造方法 |
CN101814361A (zh) * | 2009-11-27 | 2010-08-25 | 蔡建林 | 轻便箔式绕组变压器 |
EP2661757A1 (en) * | 2011-01-04 | 2013-11-13 | ÅAC Microtec AB | Coil assembly comprising planar coil |
JP6060508B2 (ja) * | 2012-03-26 | 2017-01-18 | Tdk株式会社 | 平面コイル素子およびその製造方法 |
JP5929401B2 (ja) * | 2012-03-26 | 2016-06-08 | Tdk株式会社 | 平面コイル素子 |
-
2014
- 2014-07-18 KR KR1020140090841A patent/KR101565703B1/ko active IP Right Grant
- 2014-10-22 CN CN201410566473.8A patent/CN104575937B/zh active Active
- 2014-10-22 CN CN201810343474.4A patent/CN108597730B/zh active Active
-
2015
- 2015-06-04 KR KR1020150079274A patent/KR101952859B1/ko active IP Right Grant
-
2018
- 2018-03-16 KR KR1020180030889A patent/KR102138887B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151332A (ja) * | 2000-11-15 | 2002-05-24 | Sony Corp | 薄膜コイル及びその形成方法、並びに薄膜磁気ヘッド、薄膜インダクタ、薄膜磁気センサ |
JP2006024677A (ja) * | 2004-07-07 | 2006-01-26 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
JP2006253320A (ja) * | 2005-03-09 | 2006-09-21 | Tdk Corp | コイル部品 |
JP2010205905A (ja) | 2009-03-03 | 2010-09-16 | Fuji Electric Systems Co Ltd | 磁気部品および磁気部品の製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170090124A (ko) | 2016-01-28 | 2017-08-07 | 삼성전기주식회사 | 코일 부품 및 그 제조 방법 |
KR102380838B1 (ko) * | 2016-01-28 | 2022-03-31 | 삼성전기주식회사 | 코일 부품 및 그 제조 방법 |
US10923276B2 (en) | 2017-11-29 | 2021-02-16 | Samsung Electro-Mechanics Co., Ltd. | Coil electronic component |
Also Published As
Publication number | Publication date |
---|---|
CN108597730B (zh) | 2021-02-05 |
CN104575937A (zh) | 2015-04-29 |
CN104575937B (zh) | 2018-05-18 |
KR102138887B1 (ko) | 2020-07-29 |
KR20180031653A (ko) | 2018-03-28 |
KR20150073900A (ko) | 2015-07-01 |
KR101952859B1 (ko) | 2019-02-28 |
KR20150046717A (ko) | 2015-04-30 |
CN108597730A (zh) | 2018-09-28 |
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