KR101536554B1 - 본딩용 와이어 - Google Patents

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Publication number
KR101536554B1
KR101536554B1 KR1020157004000A KR20157004000A KR101536554B1 KR 101536554 B1 KR101536554 B1 KR 101536554B1 KR 1020157004000 A KR1020157004000 A KR 1020157004000A KR 20157004000 A KR20157004000 A KR 20157004000A KR 101536554 B1 KR101536554 B1 KR 101536554B1
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South Korea
Prior art keywords
wire
mass
bonding
less
quot
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KR1020157004000A
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English (en)
Korean (ko)
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KR20150032900A (ko
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츠요시 하세가와
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다츠다 덴센 가부시키가이샤
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/85009—Pre-treatment of the connector or the bonding area
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    • H01L2224/8518—Translational movements
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    • H01L2224/85986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L2924/1204—Optical Diode
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
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  • Wire Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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WO2017154453A1 (ja) * 2016-03-11 2017-09-14 タツタ電線株式会社 ボンディングワイヤ
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DE112020004723T5 (de) * 2019-10-01 2022-06-15 Tanaka Denshi Kogyo K.K. Drahtbondstruktur, hierfür verwendeter Bonddraht und Halbleitervorrichtung
CN111029267B (zh) * 2019-11-22 2021-12-24 中国电子科技集团公司第十三研究所 一种倒装互连结构及其制备方法
US11636809B2 (en) 2019-11-29 2023-04-25 Chengdu Boe Optoelectronics Technology Co., Ltd. Display substrate and display device

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JP2012049198A (ja) * 2010-08-24 2012-03-08 Sumitomo Metal Mining Co Ltd 銀ボンディングワイヤ
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JP4771562B1 (ja) * 2011-02-10 2011-09-14 田中電子工業株式会社 Ａｇ−Ａｕ−Ｐｄ三元合金系ボンディングワイヤ
TW201216300A (en) * 2011-07-11 2012-04-16 Profound Material Technology Co Ltd Composite silver thread
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