KR101533242B1 - 점착성 하이드로겔 및 그 용도 - Google Patents

점착성 하이드로겔 및 그 용도 Download PDF

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Publication number
KR101533242B1
KR101533242B1 KR1020147015686A KR20147015686A KR101533242B1 KR 101533242 B1 KR101533242 B1 KR 101533242B1 KR 1020147015686 A KR1020147015686 A KR 1020147015686A KR 20147015686 A KR20147015686 A KR 20147015686A KR 101533242 B1 KR101533242 B1 KR 101533242B1
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South Korea
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meth
hydrogel
acrylamide
structural unit
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Korean (ko)
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KR20140091052A (ko
Inventor
가오리 사토
다카아키 하토리
야스히로 후지와라
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세키스이가세이힝코교가부시키가이샤
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Priority claimed from JP2011288771A external-priority patent/JP5722209B2/ja
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Publication of KR20140091052A publication Critical patent/KR20140091052A/ko
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/24Homopolymers or copolymers of amides or imides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/02Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/24Homopolymers or copolymers of amides or imides
    • C09J133/26Homopolymers or copolymers of acrylamide or methacrylamide
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/52Amides or imides
    • C08F220/54Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
    • C08F220/56Acrylamide; Methacrylamide

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Medicinal Preparation (AREA)
  • Materials For Medical Uses (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
  • Adhesive Tapes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020147015686A 2011-12-28 2012-07-04 점착성 하이드로겔 및 그 용도 Active KR101533242B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2011288771A JP5722209B2 (ja) 2011-01-06 2011-12-28 粘着性ハイドロゲル用組成物とその用途
JPJP-P-2011-288771 2011-12-28
JP2012053016A JP5827584B2 (ja) 2012-03-09 2012-03-09 粘着性ハイドロゲル及びその用途
JPJP-P-2012-053016 2012-03-09
PCT/JP2012/067108 WO2013099329A1 (ja) 2011-12-28 2012-07-04 粘着性ハイドロゲル及びその用途

Publications (2)

Publication Number Publication Date
KR20140091052A KR20140091052A (ko) 2014-07-18
KR101533242B1 true KR101533242B1 (ko) 2015-07-02

Family

ID=48696851

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147015686A Active KR101533242B1 (ko) 2011-12-28 2012-07-04 점착성 하이드로겔 및 그 용도

Country Status (7)

Country Link
US (1) US9175195B2 (https=)
EP (1) EP2799507B1 (https=)
JP (1) JP5827584B2 (https=)
KR (1) KR101533242B1 (https=)
CN (1) CN104024361B (https=)
TW (1) TWI571270B (https=)
WO (1) WO2013099329A1 (https=)

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Publication number Priority date Publication date Assignee Title
WO2013140645A1 (ja) 2012-03-22 2013-09-26 積水化成品工業株式会社 粘着性ハイドロゲル、及びコンクリート構造物の電気防食方法
EP3520692B1 (en) * 2016-09-30 2025-08-13 Sekisui Plastics Co., Ltd. Gel sheet
CN110177595B (zh) 2016-10-06 2025-08-19 麦迪凯姆技术有限股份公司 组合的渗透性水凝胶宫颈扩张器及其制备方法
KR101897741B1 (ko) * 2016-10-28 2018-09-12 김관석 하이드로콜로이드형 졸음방지 패치의 제조방법
JP6919993B2 (ja) * 2017-01-06 2021-08-18 信越化学工業株式会社 生体電極組成物、生体電極及び生体電極の製造方法
JP6802779B2 (ja) * 2017-01-06 2020-12-23 信越化学工業株式会社 重合性モノマー、高分子化合物、生体電極組成物、生体電極及び生体電極の製造方法
WO2019004084A1 (ja) 2017-06-30 2019-01-03 三菱鉛筆株式会社 水性ボールペン用インク組成物
JP7455502B2 (ja) * 2017-07-14 2024-03-26 キヤノン株式会社 インクジェット記録方法及びインクジェット記録装置
US20190031923A1 (en) 2017-07-26 2019-01-31 3M Innovative Properties Company Backing for adhesive tape with thermal resistance
JP7164775B2 (ja) * 2018-03-02 2022-11-02 デュポン エレクトロニクス インコーポレイテッド 接合用導電性ペースト
JP6668530B2 (ja) * 2018-09-10 2020-03-18 積水化成品工業株式会社 アルカリ電池用ハイドロゲル、ゲル状電解質及びそれを用いた電池
US12415895B2 (en) 2018-08-31 2025-09-16 Sekisui Kasei Co., Ltd. Hydrogel and uses therefor
WO2020044246A1 (ja) * 2018-08-31 2020-03-05 積水化成品工業株式会社 ハイドロゲル及びその用途
JP6718489B2 (ja) * 2018-08-31 2020-07-08 積水化成品工業株式会社 ハイドロゲルシート及びその用途
JP7231753B2 (ja) * 2019-09-27 2023-03-01 積水化成品工業株式会社 ハイドロゲル
CN115025274B (zh) * 2021-03-04 2023-03-17 海宁侏罗纪生物科技有限公司 一种医用组织粘合胶及其制备方法
CN113729654B (zh) * 2021-09-14 2023-03-28 华中科技大学 术后皮瓣与重建肢体血流状态检测表皮贴附式传感系统
WO2024256828A1 (en) 2023-06-14 2024-12-19 Sheffield Teaching Hospitals Nhs Foundation Trust Electrical stimulation system

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JP2002501804A (ja) * 1998-02-09 2002-01-22 アクセルガード・マニュファクチュアリング・カンパニー・リミテッド 医療用電極及び製造方法
JP2007112972A (ja) * 2005-09-22 2007-05-10 Sekisui Plastics Co Ltd 粘着性ハイドロゲル及び粘着性ハイドロゲル製造用組成物
KR20080108488A (ko) * 2006-03-28 2008-12-15 세키스이가세이힝코교가부시키가이샤 고강도 점착성 고분자겔 및 점착 테이프
JP2009227924A (ja) * 2008-03-25 2009-10-08 Sekisui Plastics Co Ltd 粘着性ハイドロゲル、その製造用組成物及びその用途

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US4842768A (en) * 1985-01-16 1989-06-27 Kyowa Gas Chemical Industry Co., Ltd. Electrically conductive adhesive
JP2806594B2 (ja) * 1990-03-16 1998-09-30 久光製薬株式会社 医療用導電性粘着ゲル
US5868136A (en) * 1996-02-20 1999-02-09 Axelgaard Manufacturing Co. Ltd. Medical electrode
JP3437124B2 (ja) 1999-06-18 2003-08-18 積水化成品工業株式会社 導電性高分子ゲルならびにそれを用いたゲルパッドおよび生体用電極
JP2002356661A (ja) * 2001-05-30 2002-12-13 Nippon Koden Corp 粘着剤組成物、その製造法および粘着剤組成物を用いた生体用電極
CN1245450C (zh) * 2001-09-18 2006-03-15 积水化成品工业株式会社 聚合物水凝胶
JP2003096431A (ja) * 2001-09-25 2003-04-03 Sekisui Plastics Co Ltd 粘着性ゲル
JP3838933B2 (ja) * 2002-03-19 2006-10-25 積水化成品工業株式会社 高分子ハイドロゲル電極
JP4222913B2 (ja) * 2003-09-24 2009-02-12 積水化成品工業株式会社 粘着性ハイドロゲル
JP4460253B2 (ja) * 2003-09-26 2010-05-12 積水化成品工業株式会社 親水性高分子ゲル粘着材
JP4522405B2 (ja) * 2004-04-22 2010-08-11 積水化成品工業株式会社 ゲル粘着組成物
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JP2002501804A (ja) * 1998-02-09 2002-01-22 アクセルガード・マニュファクチュアリング・カンパニー・リミテッド 医療用電極及び製造方法
JP2007112972A (ja) * 2005-09-22 2007-05-10 Sekisui Plastics Co Ltd 粘着性ハイドロゲル及び粘着性ハイドロゲル製造用組成物
KR20080108488A (ko) * 2006-03-28 2008-12-15 세키스이가세이힝코교가부시키가이샤 고강도 점착성 고분자겔 및 점착 테이프
JP2009227924A (ja) * 2008-03-25 2009-10-08 Sekisui Plastics Co Ltd 粘着性ハイドロゲル、その製造用組成物及びその用途

Also Published As

Publication number Publication date
KR20140091052A (ko) 2014-07-18
EP2799507A4 (en) 2015-10-28
CN104024361B (zh) 2016-05-25
JP5827584B2 (ja) 2015-12-02
CN104024361A (zh) 2014-09-03
JP2013185119A (ja) 2013-09-19
EP2799507A1 (en) 2014-11-05
US9175195B2 (en) 2015-11-03
TWI571270B (zh) 2017-02-21
US20140296418A1 (en) 2014-10-02
WO2013099329A1 (ja) 2013-07-04
TW201325629A (zh) 2013-07-01
EP2799507B1 (en) 2016-09-07

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