KR101524993B1 - 편류판 및 분류 장치 - Google Patents

편류판 및 분류 장치 Download PDF

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Publication number
KR101524993B1
KR101524993B1 KR1020147032873A KR20147032873A KR101524993B1 KR 101524993 B1 KR101524993 B1 KR 101524993B1 KR 1020147032873 A KR1020147032873 A KR 1020147032873A KR 20147032873 A KR20147032873 A KR 20147032873A KR 101524993 B1 KR101524993 B1 KR 101524993B1
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South Korea
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plate
fluid
flow
duct
pump
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English (en)
Korean (ko)
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KR20140146219A (ko
Inventor
신고 니시다
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센주긴조쿠고교 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to soldering or welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020147032873A 2012-04-27 2013-03-19 편류판 및 분류 장치 Active KR101524993B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012103249A JP5601342B2 (ja) 2012-04-27 2012-04-27 偏流板及び噴流装置
JPJP-P-2012-103249 2012-04-27
PCT/JP2013/057832 WO2013161453A1 (ja) 2012-04-27 2013-03-19 偏流板及び噴流装置

Publications (2)

Publication Number Publication Date
KR20140146219A KR20140146219A (ko) 2014-12-24
KR101524993B1 true KR101524993B1 (ko) 2015-06-01

Family

ID=49482790

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147032873A Active KR101524993B1 (ko) 2012-04-27 2013-03-19 편류판 및 분류 장치

Country Status (10)

Country Link
US (1) US9622395B2 (https=)
EP (1) EP2842683B1 (https=)
JP (1) JP5601342B2 (https=)
KR (1) KR101524993B1 (https=)
CN (1) CN104254423B (https=)
IN (1) IN2014DN09117A (https=)
MY (1) MY182200A (https=)
PH (1) PH12014502409B1 (https=)
SG (1) SG11201406926XA (https=)
WO (1) WO2013161453A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014157339A1 (ja) * 2013-03-29 2014-10-02 千住金属工業株式会社 偏流板及び噴流装置
DE102013110731B3 (de) * 2013-09-27 2014-11-06 Ersa Gmbh Trennstreifen-Anordnung für Lötdüse, sowie Lötdüseneinrichtung zum selektiven Wellenlöten
CN104594990B (zh) * 2015-02-27 2017-06-23 天纳克（苏州）排放系统有限公司 混合管及其排气处理装置
CN106975816A (zh) * 2017-03-28 2017-07-25 深圳市联合超越电子设备有限公司 喷口角度可调的喷流装置
CN113262392B (zh) * 2021-04-25 2022-08-09 泰尔茂医疗产品(杭州)有限公司 连接器
CN116871620A (zh) * 2023-08-02 2023-10-13 快克智能装备股份有限公司 可适用于盲区焊接的喷嘴及选择性波峰焊接装置
CN117508622A (zh) * 2023-11-29 2024-02-06 中国航空工业集团公司沈阳飞机设计研究所 一种能够提高高温尾喷流控制效果的偏流板
CN118699619B (zh) * 2024-06-27 2025-11-21 武汉船用机械有限责任公司 导管的制作方法
CN121038247B (zh) * 2025-10-29 2026-01-27 华能会理风力发电有限公司 一种变流器散热装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63137570A (ja) * 1986-11-27 1988-06-09 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPH10313171A (ja) * 1997-05-12 1998-11-24 Nihon Dennetsu Keiki Co Ltd はんだ付け装置
JPH1144409A (ja) * 1997-07-23 1999-02-16 Kozo Sekimoto 燃焼炉
JP2009019781A (ja) * 2007-07-10 2009-01-29 Showa Denko Kk 熱交換器

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154371A (en) * 1981-03-19 1982-09-24 Tdk Corp Method and device for soldering
GB2117690B (en) * 1982-04-02 1986-01-08 Zevatron Gmbh Apparatus for soldering workpieces
JPH01114165A (ja) 1987-10-27 1989-05-02 Mitsubishi Electric Corp 垂直偏向回路
JPH01143762A (ja) 1987-11-26 1989-06-06 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPH0641722Y2 (ja) * 1988-01-29 1994-11-02 千住金属工業株式会社 噴流はんだ槽
JPH0314059A (ja) 1989-06-13 1991-01-22 Nec Corp バスシステム
JPH0314059U (https=) * 1989-06-20 1991-02-13
JP4136887B2 (ja) 2003-06-17 2008-08-20 千住システムテクノロジー株式会社 半田槽用ポンプ及びそれを使用する半田槽
DE602004027279D1 (de) * 2003-10-10 2010-07-01 Senju Metal Industry Co Strahllotbehältnis
US8091758B2 (en) 2005-02-07 2012-01-10 Senju Metal Industry Co., Ltd. Wave soldering bath
EP2022590B1 (en) * 2006-04-05 2011-09-14 Senju Metal Industry Co., Ltd. Wave soldering tank
CN201089051Y (zh) * 2007-08-03 2008-07-23 陈许松 无铅波峰焊锡机
JP5332654B2 (ja) 2009-01-27 2013-11-06 千住金属工業株式会社 噴流はんだ槽
CN101698259A (zh) * 2009-09-30 2010-04-28 苏州明富自动化设备有限公司 一种焊锡喷锡装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63137570A (ja) * 1986-11-27 1988-06-09 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPH10313171A (ja) * 1997-05-12 1998-11-24 Nihon Dennetsu Keiki Co Ltd はんだ付け装置
JPH1144409A (ja) * 1997-07-23 1999-02-16 Kozo Sekimoto 燃焼炉
JP2009019781A (ja) * 2007-07-10 2009-01-29 Showa Denko Kk 熱交換器

Also Published As

Publication number Publication date
EP2842683A4 (en) 2016-04-13
MY182200A (en) 2021-01-18
EP2842683B1 (en) 2017-10-18
WO2013161453A1 (ja) 2013-10-31
CN104254423B (zh) 2015-11-25
PH12014502409A1 (en) 2015-01-12
US20150305216A1 (en) 2015-10-22
US9622395B2 (en) 2017-04-11
SG11201406926XA (en) 2015-02-27
KR20140146219A (ko) 2014-12-24
CN104254423A (zh) 2014-12-31
IN2014DN09117A (https=) 2015-05-22
EP2842683A1 (en) 2015-03-04
PH12014502409B1 (en) 2015-01-12
JP2013230481A (ja) 2013-11-14
JP5601342B2 (ja) 2014-10-08

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