KR101523397B1 - 통합된 전기적 콘택트를 갖는 기판 그리퍼 - Google Patents

통합된 전기적 콘택트를 갖는 기판 그리퍼 Download PDF

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Publication number
KR101523397B1
KR101523397B1 KR1020097026561A KR20097026561A KR101523397B1 KR 101523397 B1 KR101523397 B1 KR 101523397B1 KR 1020097026561 A KR1020097026561 A KR 1020097026561A KR 20097026561 A KR20097026561 A KR 20097026561A KR 101523397 B1 KR101523397 B1 KR 101523397B1
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KR
South Korea
Prior art keywords
substrate
clamp
assembly
electrode assembly
clamping
Prior art date
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Expired - Fee Related
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KR1020097026561A
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English (en)
Korean (ko)
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KR20100029771A (ko
Inventor
알렉산더 오윅자르즈
로버트 놉
마이크 라브킨
칼 에이 우즈
Original Assignee
램 리써치 코포레이션
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Publication of KR20100029771A publication Critical patent/KR20100029771A/ko
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Publication of KR101523397B1 publication Critical patent/KR101523397B1/ko
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53539—Means to assemble or disassemble including work conveyor
    • Y10T29/53543—Means to assemble or disassemble including work conveyor including transporting track

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020097026561A 2007-05-21 2008-05-16 통합된 전기적 콘택트를 갖는 기판 그리퍼 Expired - Fee Related KR101523397B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/751,536 US7780825B2 (en) 2007-05-21 2007-05-21 Substrate gripper with integrated electrical contacts
US11/751,536 2007-05-21
PCT/US2008/006418 WO2008153682A1 (en) 2007-05-21 2008-05-16 Substrate gripper with integrated electrical contacts

Publications (2)

Publication Number Publication Date
KR20100029771A KR20100029771A (ko) 2010-03-17
KR101523397B1 true KR101523397B1 (ko) 2015-05-27

Family

ID=40071395

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097026561A Expired - Fee Related KR101523397B1 (ko) 2007-05-21 2008-05-16 통합된 전기적 콘택트를 갖는 기판 그리퍼

Country Status (6)

Country Link
US (1) US7780825B2 (enExample)
JP (1) JP5567475B2 (enExample)
KR (1) KR101523397B1 (enExample)
CN (1) CN101755331B (enExample)
TW (1) TWI440115B (enExample)
WO (1) WO2008153682A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITTO20120415A1 (it) * 2012-05-09 2013-11-10 Alenia Aermacchi Spa Impianto industriale e procedimento per la produzione di un prodotto industriale, in particolare per un componente o un sitema aeronautico.
JP6456712B2 (ja) * 2015-02-16 2019-01-23 東京エレクトロン株式会社 基板保持機構及びこれを用いた基板処理装置
CN111699765B (zh) * 2017-08-10 2023-06-06 吉布尔·施密德有限责任公司 用于运输基底的夹紧框架和运输设备
KR102651505B1 (ko) * 2020-08-06 2024-03-28 세메스 주식회사 기판 처리 장치
KR102649713B1 (ko) * 2020-12-23 2024-03-22 세메스 주식회사 기판 처리 장치
US11449112B1 (en) * 2021-03-19 2022-09-20 Baidu Usa Llc Interoperable power delivery module for servers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01147265U (enExample) * 1988-03-28 1989-10-11
JP2002212794A (ja) * 2000-11-15 2002-07-31 Furukawa Electric Co Ltd:The めっき用治具
JP2004250785A (ja) * 2003-01-31 2004-09-09 Ebara Corp 電解処理装置及び基板処理装置
KR20110034038A (ko) * 2008-08-04 2011-04-04 히다치 가세고교 가부시끼가이샤 접착제 조성물, 필름형 접착제, 접착 시트 및 반도체 장치

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119678U (enExample) * 1987-01-22 1988-08-02
JPH0627657Y2 (ja) * 1990-05-23 1994-07-27 株式会社中央製作所 板状被処理物の保持装置
JPH05232421A (ja) * 1992-02-20 1993-09-10 Koei Eng Kk 液晶用基板ハンドリング装置
JPH10145030A (ja) * 1996-11-07 1998-05-29 Maruya Seisakusho:Kk プリント配線基板の基板保持用治具とその取付装置
JP2000031145A (ja) 1998-07-09 2000-01-28 Toshiba Corp 半導体装置の製造方法
JP2001303295A (ja) * 2000-04-18 2001-10-31 Nec Corp メッキ装置
US6439245B1 (en) * 2000-06-30 2002-08-27 Lam Research Corporation Method for transferring wafers from a conveyor system to a wafer processing station
JP2003311536A (ja) 2002-04-23 2003-11-05 Sony Corp 研磨装置及び研磨方法
US7383843B2 (en) * 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
JP4463543B2 (ja) 2003-12-26 2010-05-19 株式会社荏原製作所 基板保持装置及び基板保持方法、並びに基板処理装置
JP2006117979A (ja) * 2004-10-20 2006-05-11 Marunaka Kogyo Kk 電気メッキ装置におけるワークハンガー
JP4456989B2 (ja) * 2004-11-26 2010-04-28 新光電気工業株式会社 部分めっき装置
US20070034526A1 (en) 2005-08-12 2007-02-15 Natsuki Makino Electrolytic processing apparatus and method
JP4568675B2 (ja) * 2005-11-15 2010-10-27 株式会社フジクラ メッキ装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01147265U (enExample) * 1988-03-28 1989-10-11
JP2002212794A (ja) * 2000-11-15 2002-07-31 Furukawa Electric Co Ltd:The めっき用治具
JP2004250785A (ja) * 2003-01-31 2004-09-09 Ebara Corp 電解処理装置及び基板処理装置
KR20110034038A (ko) * 2008-08-04 2011-04-04 히다치 가세고교 가부시끼가이샤 접착제 조성물, 필름형 접착제, 접착 시트 및 반도체 장치

Also Published As

Publication number Publication date
US20080289967A1 (en) 2008-11-27
TW200921823A (en) 2009-05-16
KR20100029771A (ko) 2010-03-17
JP2010528474A (ja) 2010-08-19
TWI440115B (zh) 2014-06-01
WO2008153682A1 (en) 2008-12-18
US7780825B2 (en) 2010-08-24
CN101755331A (zh) 2010-06-23
CN101755331B (zh) 2011-08-31
JP5567475B2 (ja) 2014-08-06

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