JP5567475B2 - 統合電気接点を有する基板把持搬送組立体、電気接点を付与する方法、及び、基板ハンドリング組立体 - Google Patents

統合電気接点を有する基板把持搬送組立体、電気接点を付与する方法、及び、基板ハンドリング組立体 Download PDF

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JP5567475B2
JP5567475B2 JP2010509357A JP2010509357A JP5567475B2 JP 5567475 B2 JP5567475 B2 JP 5567475B2 JP 2010509357 A JP2010509357 A JP 2010509357A JP 2010509357 A JP2010509357 A JP 2010509357A JP 5567475 B2 JP5567475 B2 JP 5567475B2
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Japan
Prior art keywords
substrate
assembly
clamp
holding
electrode
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Expired - Fee Related
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JP2010509357A
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Japanese (ja)
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JP2010528474A (ja
JP2010528474A5 (enExample
Inventor
オウクザルツ・アレクサンダー
クノップ・ロバート
ラブキン・マイク
ウッズ・カール・エー．
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53539—Means to assemble or disassemble including work conveyor
    • Y10T29/53543—Means to assemble or disassemble including work conveyor including transporting track

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2010509357A 2007-05-21 2008-05-16 統合電気接点を有する基板把持搬送組立体、電気接点を付与する方法、及び、基板ハンドリング組立体 Expired - Fee Related JP5567475B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/751,536 US7780825B2 (en) 2007-05-21 2007-05-21 Substrate gripper with integrated electrical contacts
US11/751,536 2007-05-21
PCT/US2008/006418 WO2008153682A1 (en) 2007-05-21 2008-05-16 Substrate gripper with integrated electrical contacts

Publications (3)

Publication Number Publication Date
JP2010528474A JP2010528474A (ja) 2010-08-19
JP2010528474A5 JP2010528474A5 (enExample) 2011-06-23
JP5567475B2 true JP5567475B2 (ja) 2014-08-06

Family

ID=40071395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010509357A Expired - Fee Related JP5567475B2 (ja) 2007-05-21 2008-05-16 統合電気接点を有する基板把持搬送組立体、電気接点を付与する方法、及び、基板ハンドリング組立体

Country Status (6)

Country Link
US (1) US7780825B2 (enExample)
JP (1) JP5567475B2 (enExample)
KR (1) KR101523397B1 (enExample)
CN (1) CN101755331B (enExample)
TW (1) TWI440115B (enExample)
WO (1) WO2008153682A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITTO20120415A1 (it) * 2012-05-09 2013-11-10 Alenia Aermacchi Spa Impianto industriale e procedimento per la produzione di un prodotto industriale, in particolare per un componente o un sitema aeronautico.
JP6456712B2 (ja) * 2015-02-16 2019-01-23 東京エレクトロン株式会社 基板保持機構及びこれを用いた基板処理装置
WO2019029813A1 (de) * 2017-08-10 2019-02-14 Gebr. Schmid Gmbh Klemmrahmen und transportvorrichtung zum transport von substraten
KR102651505B1 (ko) * 2020-08-06 2024-03-28 세메스 주식회사 기판 처리 장치
KR102649713B1 (ko) * 2020-12-23 2024-03-22 세메스 주식회사 기판 처리 장치
US11449112B1 (en) * 2021-03-19 2022-09-20 Baidu Usa Llc Interoperable power delivery module for servers

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119678U (enExample) * 1987-01-22 1988-08-02
JPH01147265U (enExample) * 1988-03-28 1989-10-11
JPH0627657Y2 (ja) * 1990-05-23 1994-07-27 株式会社中央製作所 板状被処理物の保持装置
JPH05232421A (ja) * 1992-02-20 1993-09-10 Koei Eng Kk 液晶用基板ハンドリング装置
JPH10145030A (ja) * 1996-11-07 1998-05-29 Maruya Seisakusho:Kk プリント配線基板の基板保持用治具とその取付装置
JP2000031145A (ja) 1998-07-09 2000-01-28 Toshiba Corp 半導体装置の製造方法
JP2001303295A (ja) * 2000-04-18 2001-10-31 Nec Corp メッキ装置
US6439245B1 (en) * 2000-06-30 2002-08-27 Lam Research Corporation Method for transferring wafers from a conveyor system to a wafer processing station
JP3413185B2 (ja) * 2000-11-15 2003-06-03 古河電気工業株式会社 めっき用治具
JP2003311536A (ja) 2002-04-23 2003-11-05 Sony Corp 研磨装置及び研磨方法
US7383843B2 (en) * 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
JP2004250785A (ja) * 2003-01-31 2004-09-09 Ebara Corp 電解処理装置及び基板処理装置
JP4463543B2 (ja) 2003-12-26 2010-05-19 株式会社荏原製作所 基板保持装置及び基板保持方法、並びに基板処理装置
JP2006117979A (ja) * 2004-10-20 2006-05-11 Marunaka Kogyo Kk 電気メッキ装置におけるワークハンガー
JP4456989B2 (ja) * 2004-11-26 2010-04-28 新光電気工業株式会社 部分めっき装置
US20070034526A1 (en) 2005-08-12 2007-02-15 Natsuki Makino Electrolytic processing apparatus and method
JP4568675B2 (ja) * 2005-11-15 2010-10-27 株式会社フジクラ メッキ装置
US8373283B2 (en) * 2008-08-04 2013-02-12 Hitachi Chemical Company, Ltd. Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device

Also Published As

Publication number Publication date
US20080289967A1 (en) 2008-11-27
CN101755331B (zh) 2011-08-31
KR101523397B1 (ko) 2015-05-27
WO2008153682A1 (en) 2008-12-18
TWI440115B (zh) 2014-06-01
US7780825B2 (en) 2010-08-24
JP2010528474A (ja) 2010-08-19
CN101755331A (zh) 2010-06-23
KR20100029771A (ko) 2010-03-17
TW200921823A (en) 2009-05-16

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