JP2010528474A - 統合電気接点を有する基板把持装置 - Google Patents
統合電気接点を有する基板把持装置 Download PDFInfo
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- JP2010528474A JP2010528474A JP2010509357A JP2010509357A JP2010528474A JP 2010528474 A JP2010528474 A JP 2010528474A JP 2010509357 A JP2010509357 A JP 2010509357A JP 2010509357 A JP2010509357 A JP 2010509357A JP 2010528474 A JP2010528474 A JP 2010528474A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53539—Means to assemble or disassemble including work conveyor
- Y10T29/53543—Means to assemble or disassemble including work conveyor including transporting track
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
【選択図】図4
Description
Claims (20)
- 基板保持搬送組立体であって、
ベースプレートと、
一対のクランプにより画定される少なくとも二つの独立点により基板を支持可能に画成された離間配向性を有して前記ベースプレートに接続された一対のクランプと、
実質的に前記一対のクランプ間の位置において前記ベースプレートに接続されており、前記基板が存在し且つ前記一対のクランプにより保持される時、前記基板に電気接点を与えるように形成された電極組立体と、
を備える基板保持搬送組立体。 - 請求項1記載の基板保持搬送組立体であって、更に、
前記ベースプレートに接続されており、前記一対のクランプを開位置へ操作するように構成された一対のクランプアクチュエータを備える、基板保持搬送組立体。 - 請求項2記載の基板保持搬送組立体であって、更に、
上部プレートに接続されており、前記電極アクチュエータを閉位置へ操作するように構成された電極アクチュエータを備える、基板保持搬送組立体。 - 請求項3記載の基板保持搬送組立体であって、
前記クランプアクチュエータ及び前記電極アクチュエータは、独立して制御される、基板保持搬送組立体。 - 請求項1記載の基板保持搬送組立体であって、
前記電極組立体は、基板の存在時に前記基板へガスを分配するように形成される、基板保持搬送組立体。 - 請求項1記載の基板保持搬送組立体であって、
圧縮モジュールが、基板の存在時に前記基板を保持するための一定の圧力を前記一対のクランプに及ぼす、基板保持搬送組立体。 - 請求項6記載の基板保持搬送組立体であって、
前記圧縮モジュールは、バネである、基板保持搬送組立体。 - 基板をクランプして電気接点を付与する方法であって、
閉位置へ独立して作動させることが可能な、受領位置にある統合電極組立体、及び、クランプ位置へ独立して作動させることが可能な、受領位置にある少なくとも二つの基板クランプを有するクランプ組立体を提供するステップと、
前記クランプ組立体において前記基板を受領するステップと、
前記基板クランプを前記基板と接触した状態にする前記クランプ位置へ前記基板クランプを作動させるステップと、
前記電極組立体の複数の電極を前記基板に接触した状態にする閉位置へ前記電極組立体を作動させるステップと、を備え、
前記基板と接触している前記複数の電極は、前記電気接点を付与する、方法。 - 請求項8記載の方法であって、
前記電極組立体は、更に、基板の存在時に前記基板の上面へガスを分配するように構成されたディフューザを含む、方法。 - 請求項8記載の方法であって、
前記基板クランプの上方に位置決めされた圧縮モジュールが、前記基板クランプの上面に一定の力を及ぼす、方法。 - 請求項10記載の方法であって、
前記圧縮モジュールは、バネである、方法。 - 請求項8記載の方法であって、
前記基板クランプの前記作動は、空気圧により実行される、方法。 - 請求項8記載の方法であって、
前記電極組立体の前記作動は、空気圧により実行される、方法。 - 基板ハンドリング組立体であって、
ベースプレートと、
前記ベースプレートに結合され、提供時に基板を保持して受け入れるように構成されたクランプ面を有し、開位置と、前記基板を固定するように画定された閉位置とを有する第一の基板クランプと、
前記ベースプレートに結合され、提供時に基板を保持して受け入れるように構成されたクランプ面を有し、前記ベースプレートに沿って前記第一の基板クランプからクランプ距離だけ間隔を空けて前記基板に対する支持部を画成し、開位置と、前記基板を固定するように画定された閉位置とを有する第二の基板クランプと、
実質的に前記第一及び第二の基板クランプ間の位置において前記ベースプレートに接続され、複数の電極を有し、開位置と、前記複数の電極を前記ベースプレートへ向けて移動させて存在時に前記基板に接触させるように画定された閉位置とを有する電極組立体と、
を備える基板ハンドリング組立体。 - 請求項14記載の基板ハンドリング組立体であって、
前記第一の基板クランプ、前記第二の基板クランプ、及び前記電極組立体のそれぞれは、独立したアクチュエータを有する、基板ハンドリング組立体。 - 請求項14記載の基板ハンドリング組立体であって、
前記電極組立体は、更に、基板の存在時に前記基板の上面へガスを分配するように構成されたディフューザを含む、基板ハンドリング組立体。 - 請求項14記載の基板ハンドリング組立体であって、更に、
前記第一の基板クランプの上面上方に位置決めされた圧縮モジュールを備え、
前記第一の基板クランプが前記閉位置にある時、前記圧縮モジュールは、前記第一の基板クランプの前記正面に一定の力を及ぼす、基板ハンドリング組立体。 - 請求項17記載の基板ハンドリング組立体であって、
前記圧縮モジュールは、バネである、基板ハンドリング組立体。 - 請求項14記載の基板ハンドリング組立体であって、
前記第一及び第二の基板クランプは、非金属材料により作成される、基板ハンドリング組立体。 - 請求項14記載の基板ハンドリング組立体であって、
前記アクチュエータは、空気圧式である、基板ハンドリング組立体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/751,536 | 2007-05-21 | ||
US11/751,536 US7780825B2 (en) | 2007-05-21 | 2007-05-21 | Substrate gripper with integrated electrical contacts |
PCT/US2008/006418 WO2008153682A1 (en) | 2007-05-21 | 2008-05-16 | Substrate gripper with integrated electrical contacts |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010528474A true JP2010528474A (ja) | 2010-08-19 |
JP2010528474A5 JP2010528474A5 (ja) | 2011-06-23 |
JP5567475B2 JP5567475B2 (ja) | 2014-08-06 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2010509357A Expired - Fee Related JP5567475B2 (ja) | 2007-05-21 | 2008-05-16 | 統合電気接点を有する基板把持搬送組立体、電気接点を付与する方法、及び、基板ハンドリング組立体 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7780825B2 (ja) |
JP (1) | JP5567475B2 (ja) |
KR (1) | KR101523397B1 (ja) |
CN (1) | CN101755331B (ja) |
TW (1) | TWI440115B (ja) |
WO (1) | WO2008153682A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITTO20120415A1 (it) * | 2012-05-09 | 2013-11-10 | Alenia Aermacchi Spa | Impianto industriale e procedimento per la produzione di un prodotto industriale, in particolare per un componente o un sitema aeronautico. |
JP6456712B2 (ja) * | 2015-02-16 | 2019-01-23 | 東京エレクトロン株式会社 | 基板保持機構及びこれを用いた基板処理装置 |
EP3666049B1 (de) * | 2017-08-10 | 2021-09-29 | Gebr. Schmid GmbH | Klemmrahmen und transportvorrichtung zum transport von substraten |
KR102651505B1 (ko) * | 2020-08-06 | 2024-03-28 | 세메스 주식회사 | 기판 처리 장치 |
KR102649713B1 (ko) * | 2020-12-23 | 2024-03-22 | 세메스 주식회사 | 기판 처리 장치 |
Citations (10)
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JPS63119678U (ja) * | 1987-01-22 | 1988-08-02 | ||
JPH0413662U (ja) * | 1990-05-23 | 1992-02-04 | ||
JPH05232421A (ja) * | 1992-02-20 | 1993-09-10 | Koei Eng Kk | 液晶用基板ハンドリング装置 |
JPH10145030A (ja) * | 1996-11-07 | 1998-05-29 | Maruya Seisakusho:Kk | プリント配線基板の基板保持用治具とその取付装置 |
JP2000031145A (ja) * | 1998-07-09 | 2000-01-28 | Toshiba Corp | 半導体装置の製造方法 |
JP2001303295A (ja) * | 2000-04-18 | 2001-10-31 | Nec Corp | メッキ装置 |
JP2005328039A (ja) * | 2004-04-01 | 2005-11-24 | Lam Res Corp | 薄い高速流体層を使用してウェーハ表面を処理する方法及び装置 |
JP2006117979A (ja) * | 2004-10-20 | 2006-05-11 | Marunaka Kogyo Kk | 電気メッキ装置におけるワークハンガー |
JP2006152349A (ja) * | 2004-11-26 | 2006-06-15 | Shinko Electric Ind Co Ltd | 部分めっき装置 |
JP2007138195A (ja) * | 2005-11-15 | 2007-06-07 | Fujikura Ltd | メッキ装置 |
Family Cites Families (8)
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JPH01147265U (ja) * | 1988-03-28 | 1989-10-11 | ||
US6439245B1 (en) * | 2000-06-30 | 2002-08-27 | Lam Research Corporation | Method for transferring wafers from a conveyor system to a wafer processing station |
JP3413185B2 (ja) * | 2000-11-15 | 2003-06-03 | 古河電気工業株式会社 | めっき用治具 |
JP2003311536A (ja) | 2002-04-23 | 2003-11-05 | Sony Corp | 研磨装置及び研磨方法 |
JP2004250785A (ja) * | 2003-01-31 | 2004-09-09 | Ebara Corp | 電解処理装置及び基板処理装置 |
JP4463543B2 (ja) | 2003-12-26 | 2010-05-19 | 株式会社荏原製作所 | 基板保持装置及び基板保持方法、並びに基板処理装置 |
US20070034526A1 (en) | 2005-08-12 | 2007-02-15 | Natsuki Makino | Electrolytic processing apparatus and method |
US8373283B2 (en) * | 2008-08-04 | 2013-02-12 | Hitachi Chemical Company, Ltd. | Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device |
-
2007
- 2007-05-21 US US11/751,536 patent/US7780825B2/en not_active Expired - Fee Related
-
2008
- 2008-05-16 KR KR1020097026561A patent/KR101523397B1/ko not_active IP Right Cessation
- 2008-05-16 CN CN2008800166495A patent/CN101755331B/zh not_active Expired - Fee Related
- 2008-05-16 JP JP2010509357A patent/JP5567475B2/ja not_active Expired - Fee Related
- 2008-05-16 WO PCT/US2008/006418 patent/WO2008153682A1/en active Application Filing
- 2008-05-19 TW TW097118344A patent/TWI440115B/zh not_active IP Right Cessation
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63119678U (ja) * | 1987-01-22 | 1988-08-02 | ||
JPH0413662U (ja) * | 1990-05-23 | 1992-02-04 | ||
JPH05232421A (ja) * | 1992-02-20 | 1993-09-10 | Koei Eng Kk | 液晶用基板ハンドリング装置 |
JPH10145030A (ja) * | 1996-11-07 | 1998-05-29 | Maruya Seisakusho:Kk | プリント配線基板の基板保持用治具とその取付装置 |
JP2000031145A (ja) * | 1998-07-09 | 2000-01-28 | Toshiba Corp | 半導体装置の製造方法 |
JP2001303295A (ja) * | 2000-04-18 | 2001-10-31 | Nec Corp | メッキ装置 |
JP2005328039A (ja) * | 2004-04-01 | 2005-11-24 | Lam Res Corp | 薄い高速流体層を使用してウェーハ表面を処理する方法及び装置 |
JP2006117979A (ja) * | 2004-10-20 | 2006-05-11 | Marunaka Kogyo Kk | 電気メッキ装置におけるワークハンガー |
JP2006152349A (ja) * | 2004-11-26 | 2006-06-15 | Shinko Electric Ind Co Ltd | 部分めっき装置 |
JP2007138195A (ja) * | 2005-11-15 | 2007-06-07 | Fujikura Ltd | メッキ装置 |
Also Published As
Publication number | Publication date |
---|---|
US7780825B2 (en) | 2010-08-24 |
CN101755331A (zh) | 2010-06-23 |
US20080289967A1 (en) | 2008-11-27 |
KR101523397B1 (ko) | 2015-05-27 |
TWI440115B (zh) | 2014-06-01 |
KR20100029771A (ko) | 2010-03-17 |
JP5567475B2 (ja) | 2014-08-06 |
CN101755331B (zh) | 2011-08-31 |
WO2008153682A1 (en) | 2008-12-18 |
TW200921823A (en) | 2009-05-16 |
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