Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
  • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
  • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
  • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49826—Assembling or joining
  • Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/53—Means to assemble or disassemble
  • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/53—Means to assemble or disassemble
  • Y10T29/5313—Means to assemble electrical device
  • Y10T29/53265—Means to assemble electrical device with work-holder for assembly
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/53—Means to assemble or disassemble
  • Y10T29/53539—Means to assemble or disassemble including work conveyor
  • Y10T29/53543—Means to assemble or disassemble including work conveyor including transporting track

Definitions

• the present invention relates generally to handling of substrates and more specifically, the simultaneous movement of substrates through process heads while applying an electrical contact.
• Semiconductor substrate processing may include various process operations including, but not limited to, etching, deposition, cleaning and polishing.
• One method to perform a deposition process is to use electroplating.
• the electroplating process requires electrical contact to be made with the substrate as it is exposed to an electroplating process fluid.
• Various methods can be used to perform electroplating however it can be difficult to achieve
• one method of electroplating submerges a substrate in a tank of electroplating fluid. Electrical contact can be made with the substrate using a plurality of electrical contacts submerged in the tank. However, irregularities in the deposition of plating material can occur wherever electrical contact is made with the substrate.
• a substrate holding and transporting assembly includes a base plate and a pair of clamps connected to the base plate in a spaced apart orientation.
• the spaced apart orientation can be defined to enable support of a substrate with at least two independent points, the two independent points defined by the pair of clamps.
• the substrate holding and transporting assembly also includes an electrode assembly being connected to the base plate at a location that is substantially between the pair of clamps. The electrode assembly defined to impart an electrical contact to the substrate when present and held by the pair of clamps.
• a method for clamping and applying an electrical contact to a substrate is disclosed.
• the method includes providing a clamping assembly having an integrated electrode assembly in a receiving position capable of being independently actuated into a closed position.
• the clamping assembly also has at least two substrate clamps in a receiving position, the substrate clamps capable of being independently actuated into a clamped position.
• the method receives the substrate at the clamping assembly and actuates the substrate clamps into the clamped position. The clamped position placing the substrate clamps in contact with the substrate.
• the electrode assembly is actuated into a closed positioned, the closed position of the electrode assembly placing a plurality of electrodes in contact with the substrate. Wherein the plurality of electrodes that are in contact with the substrate apply the electrical contact.
• a substrate handling assembly in yet another embodiment, includes, a base plate and a first substrate clamp coupled to the base plate.
• the first substrate clamps has a clamping face configured to hold and accommodate a substrate, when provided.
• the first substrate clamp also has an open position and a closed position, the closed position being defined to secure the substrate.
• the substrate handling assembly also includes a second substrate clamp coupled to the base plate also having a clamping face configured to hold and accommodate a substrate, when provided.
• the second substrate clamp spaced apart by a clamping distance from the first substrate clamp along the base plate to define support for the substrate.
• the second substrate clamp having an open position and a closed position, the closed position being defined to secure the substrate.
• the substrate handling assembly also includes an electrode assembly connected to the base plate at a location that is substantially between the first and second substrate clamps.
• the electrode assembly having a plurality of electrodes that have an open position and a closed position. The closed position being defined to transition the plurality of electrodes toward the base plate and in contact with the substrate when present.
• Figure 1 is a high level schematic of a process module 102 in accordance with one embodiment of the present invention.
• FIG. 2 is a overview schematic of a gripper assembly in relation to a process station and substrate, in accordance with one embodiment of the present invention.
• Figure 3 is a schematic illustrating a close up view of a gripper assembly in accordance with one embodiment of the present invention.
• Figure 4 is an exploded view of the gripper assembly in accordance with one embodiment of the present invention.
• Figure 5 and Figure 6 are schematics of substrate clamps 402 and 404 in accordance with embodiments of the present invention.
• Figure 7 is an illustration of a contact lever in accordance with one embodiment of the present invention.
• Figure 8 is an illustration of the electrode manifold assembly in accordance with one embodiment of the present invention.
• Figure 8A is an illustration of the electrode manifold, in accordance with one embodiment of the present invention.
• Figure 8B is an illustration of an electrode arm 804 in accordance with one embodiment of the present invention.
• Figure 8C is an exemplary schematic of an electrode diffuser in accordance with one embodiment of the present invention.
• Figure 9 is a schematic illustrating a side view of a substrate clamp assembly installed in a gripper assembly in accordance with one embodiment of the present invention.
• Figure 10 is a schematic illustrating a side of an electrode assembly installed in a gripper assembly in accordance with one embodiment of the present invention.
• Figure 1 IA and Figure 1 IB are schematics illustrating various clamping distances, and comparative deflections of the substrate, in accordance with embodiments of the present invention.
• Figure 12A and Figure 12B are schematic illustrations of a transport system for moving the gripper assemblies in accordance with one embodiment of the present invention.
• Figure 13 is a flow chart illustrating a procedure that transport a substrate through a processing assembly in accordance with one embodiment of the present invention.
• An invention for holding and transporting a substrate.
• the holding and transporting a substrate are disclosed.
• One embodiment of a holding and transport system for a substrate uses two grippers to hold and move the substrate into a proximity head. Initially in this embodiment, a first gripper picks up the substrate in an exclusion zone along the edge of the substrate. The first gripper
• a second gripper is in position to receive the now processed substrate.
• a handoff of the substrate between the first gripper and second gripper occurs after the second gripper clamps down on the substrate.
• FIG. 1 is a high level schematic of a process module 102 in accordance with one
• the process module 102 is located in a clean room 108 and connected to computer 106.
• Computer 106 can provide direct control and monitoring of the processes performed in process module 102. Additionally, attaching computer 106 to a computer network can provide remote control and monitoring of the process module 102.
• the clean room 108 can provide facilities 109 capable of supplying and
• Process module 102 can include ambient controls 110 that can include, but are not limited to, air filters, heaters, humidifying devices and dehumidifying devices. Also found in process module 102 are various process stations. Process module 102 includes process stations A, B, and C and is intended to be exemplary as it would be possible to have a
• Process station B includes gripper assembly 121 and gripper assembly 121a, plating assembly 120 and substrate handlers 123.
• the gripper assembly 121 is positioned to clamp and move a substrate 150 from the substrate handler 123 into the plating assembly 120. Note that alternate and additional processes other than plating can be performed. Also note that processes performed
• 0 by a process station can performed by a single or multiple proximity process heads.
• the gripper assembly 121a As the substrate 150 emerges from the plating assembly 120, the gripper assembly 121a is positioned to receive the substrate 150. When an appropriate amount of the substrate 150 has emerged from the plating assembly 150, the gripper assembly 121a can clamp onto the substrate 150 and pull the substrate 150 through the plating assembly. In one embodiment,
• process station B can include a variety of processing assemblies and proximity heads other than, and in addition to, the plating assembly 120.
• process stations A and C can accommodate and facilitate a
• FIG 2 is a overview schematic of a gripper assembly 121 in relation to a process station 204 and substrate 150, in accordance with one embodiment of the present invention. As illustrated and described above, the gripper assembly 121 has released the substrate 150. In this embodiment, the substrate 150 has emerged from the process station 204, and for
• the gripper assembly 121 and the second gripper are configured to secure the substrate using substrate clamps and apply and electrical charge with an electrode assembly that is integrated into the gripper assembly.
• FIG. 3 is a schematic illustrating a close up view of a gripper assembly 121 in accordance with one embodiment of the present invention.
• the gripper assembly 121 can be broken down into the following three subassemblies: clamp assembly 300, electrode assembly 302 and clamp assembly 304.
• Other embodiments of the gripper assembly can include a single clamp assembly or additional clamp assemblies.
• additional electrode assemblies can be included in alternate embodiments of the gripper assembly 121.
• the clamp assemblies 300 and 304 are shown in a closed positioned even though a substrate is not present.
• the gripper assembly 121 can be broken down into the following three subassemblies: clamp assembly 300, electrode assembly 302 and clamp assembly 304.
• Other embodiments of the gripper assembly can include a single clamp assembly or additional clamp assemblies.
• additional electrode assemblies can be included in alternate embodiments of the gripper assembly 121.
• the clamp assemblies 300 and 304 are shown in a closed positioned even though a substrate is not present.
• the clamp assemblies 300 and 304 are shown
• Electrode assembly 302 is shown in an open position.
• the clamp assemblies can be in an open position and the electrode assembly can be in a closed position when a substrate is not present.
• the gripper assembly 121 approaches a stationary substrate with clamp assemblies 300 and 304 in a closed position and the electrode assembly 302 in an open
• the clamp assemblies 300 and 304 can be actuated into an open position.
• the clamp assemblies 300 and 304 can be closed on the appropriate areas of the substrate.
• the appropriate areas of the substrate include an exclusion zone at the edge of the substrate.
• clamp assemblies 300 and 304 secure the substrate to the gripper assembly 121.
• the clamp assemblies 300 can move independently from clamp assembly 304. This can allow clamp assembly 300 to close on the substrate first, followed by clamp assembly 304, or vice versa. In other embodiments, actuation of the independent clamp assemblies 300 and 304 occurs simultaneously.
• electrode assembly 302 can be actuated to a closed position placing electrodes in contact with the substrate. In one embodiment, the electrodes contact the substrate in the exclusion zone at the edge of the substrate. Note that the electrode assembly 302 can be selectively applied to the substrate. This can be beneficial as gripper assemblies 121 can transport substrates through
• the gripper assembly 121 can be fabricated as modular components permitting the rapid addition, removal or replacement of an electrode assembly 302, or clamp assembly 300 or 304 as needed. Other embodiments can allows the electrode assembly to be swapped out for an additional clamp assembly.
• FIG 4 is an exploded view of the gripper assembly 121 in accordance with one embodiment of the present invention.
• the clamp assemblies 300 and 304 include an actuator 407, a substrate clamp 404 or substrate clamp 402, a compression module 408 and a stop block 412.
• the substrate clamps 404 and 402 are coupled to a base 410 at a coupling point. The coupling point allows the substrate clamps 402 and 404 to pivot to an open position and a closed position.
• Also coupled to the based 410 are the actuators 407 that are capable of pivoting the substrate clamps 402 and 404 into an open position about the coupling point.
• the substrate clamps 402 and 404 include a feature 414 to interface with the compression module 408.
• the feature 414 is a counterbore region to accommodate the compression module 408.
• compression module 408 is illustrated as a spring, this is intended to be exemplary as the compression module in other embodiments can be an actuator capable of providing a constant and
• the stop block 412 is coupled to a top 416 and can provide an upper limit of movement for the substrate clamps 402 and 404 when moved into the open position by the actuators 407.
• the stop blocks 412 are not required as the actuators 407 can be configured to limit a maximum distance of travel.
• the electrode assembly 302 includes a contact lever 406, electrode manifold assembly 400, actuator 407, and tension module 414 (not shown).
• the electrode manifold assembly 400 is coupled to the contact lever 406 and the contact lever 406 is coupled to the base 410.
• the contact lever 406 is coupled to the base at a coupling point that allows the contact lever 406 to pivot into an open position and a closed position. Additional
• the tension module 414 is positioned between the base 410 and the electrode manifold assembly 400.
• the tension module 414 can provide a constant force that pivots the electrode manifold assembly 400 into the open position.
• the actuator 407 can be coupled to the top 416 and when actuated, can lower the tension module 414 .
• the actuator 407 can be operated pneumatically while other embodiments of the actuator 407 can be operated using a variety of alternate techniques.
• FIG. 5 and Figure 6 are schematics of substrate clamps 402 and 404 in accordance with embodiments of the present invention.
• the substrate clamps 402 and 404 have a bottom
• the substrate clamps 402 and 404 illustrated in Figures 5 and 6 are configured to accommodate a circular substrate having a diameter of about 300 mm.
• the clamping surface 500 is partially defined by two radii, Rl and R2.
• Rl is about 145 mm and R2 is about 150 mm.
• the listed values for Rl and R2 are exemplary for a substrate having a diameter of about 300 mm.
• One skilled in the art should recognize that the values of
• substrate clamps 402 and 404 could be modified in order to fabricate substrate clamps to accommodate substrates of alternate diameters. Furthermore, the use of circular substrates and the subsequent radii of the substrate clamp are not intended to be limiting. Other embodiments of substrate clamps 402 and 404 can be configured to accommodate non-circular substrates. [0038] In one embodiment, the substrate clamps 402 and 404 can have an overall length L, of
• Pivot hole 506 can traverse the width of the substrate clamp 402 or 404 and provide the coupling location between the substrate clamp and the base.
• Figure 7 is an illustration of a contact lever 406 in accordance with one embodiment of the present invention.
• Thru hole 702 traverses the contact lever 406 and allows the tension
• FIG. 8 is an illustration of the electrode manifold assembly 300 in accordance with
• the electrode manifold assembly 300 includes a contact manifold 800, electrode arms 804, and electrode diffusers
• Figure 8A is an illustration of the electrode manifold 800, in accordance with one
• Mounting holes 814 are positioned to provide a coupling location between the electrode manifold and the contact lever. Additionally, outlet holes 810 are positioned and sized to accommodate electrode tubes. The outlet holes 810 intersect a gas manifold 816, the gas manifold having two openings at port 812 and port 818. The gas manifold 816 allows pressurized gas that is input through either port 812 or port 818
• FIG. 8B is an illustration of an electrode arm 804 in accordance with one embodiment of the present invention.
• the electrode arm 804 is a hollow cylinder formed from an electrically conductive material.
• the electrode arm 804 has an overall length of about 23 mm, an outer diameter of about 2 mm and an inner diameter of about 1 mm.
• the electrode arm 804 also has a manifold end 820 and an electrode end 822.
• the manifold end 820 is configured to couple with the outlet hole 810 of the electrode manifold 800 while the electrode end 822 is configured to couple with the electrode diffuser
• the couplings between the manifold end 820 and the electrode manifold 800 can be substantially airtight.
• the coupling between the electrode end 822 and the electrode diffuser 802 can also be substantially airtight.
• electrode arm 804 can be constructed from tubing with a triangular, square, pentagonal, hexagonal, etc. cross-section.
• FIG. 8C is an exemplary schematic of an electrode diffuser 802 in accordance with one embodiment of the present invention.
• the electrode diffuser 802 can be made from an
• the electrode diffuser 802 has an overall length L, of about 3 mm.
• a first end of the electrode diffuser 802 has a coupling cavity 830 configured to mate with the electrode end of the electrode tube.
• the holes 834 can act to diffuse compressed gas transited through the electrode arms toward the substrate.
• the electrode tip 835 is axially aligned with the electrode diffuser and extends from the second end of the electrode diffuser 802.
• the electrode tip 835 can have a contact surface 832 that is substantially cylindrical with a diameter d, of about 0.8 mm. Furthermore, the
• !5 contact surface 832 can be offset from the second end of the electrode diffuser 802 by about 1 mm.
• FIG. 9 is a schematic illustrating a side view of a substrate clamp assembly installed in a gripper assembly in accordance with one embodiment of the present invention.
• the compression module 408 is a spring that applies a constant force to the substrate clamp 404 resulting in the substrate clamp 404 defaulting to a closed position.
• the actuator 407 pushes the substrate clamp 404 which pivots the substrate clamp 404 about the coupling point 506 and lifts the clamping surface 500.
• FIG 10 is a schematic illustrating a side of an electrode assembly installed in a gripper assembly in accordance with one embodiment of the present invention.
• the tension module 414 is a spring that can apply a constant force to the electrode manifold 400 resulting in the electrode assembly defaulting to an open position.
• the actuator 407 pushes down on the electrode assembly thereby lowering the electrode tips into contact with the substrate.
• the electrode arms 804 can flex providing a spring effect to facilitate a highly reliable electrical contact with the substrate.
• Figure 1 IA and Figure 1 IB are schematics illustrating various clamping distances, and comparative deflections of the substrate 150, in accordance with embodiments of the present invention.
• a single gripper assembly initially holds a substrate 150 in two substrate clamps separated by a clamping distance.
• the clamping distance can be defined as a distance X from the edge of the substrate 150.
• the clamping distance can be defined as a distance Y between the clamping areas 500.
• the substrate 150 can act as a cantilevered member. As illustrated in Figures l la and 1 Ib, the mass of the substrate 150 can create a moment arm with a fulcrum located approximately where the substrate clamps are contacting the substrate 150. This moment arm can result in the substrate 150 deflecting a distance d. Note that the deflection d illustrated in Figures 1 IA and 1 IB is exaggerated for illustrative purposes. Commensurate with deflection d, is the induction of stress and strain within the substrate 150. Thus, the clamping distance, and the subsequent deflection of the substrate 150, can be partially constrained by the sensitivity of the substrate 150 to stress and strain.
• FIG. 12A and Figure 12B are schematic illustrations of a transport system for moving the gripper assemblies in accordance with one embodiment of the present invention. Viewed from an end, gripper assembly 121 can be seen at the end of an arm 1202. The Arm 1202 can be coupled to guide 1204a and guide 1204b. The guides 1204a and 1204b can configure to restrict motion of the arm in a direction normal to a rail 1206. In one embodiment, the rail 1206 is part of a linear actuator that allows the arm 1202 to move in the direction X, as shown in Figure 12B.
• a moment is developed on the arm 1202 based on the mass of the gripper assembly and addition of a substrate when present in the gripper.
• the material and shape of the arm 1202 can be chosen based on its ability to resist deflection. As potentially corrosive process fluids may be used in close proximity to the arm 1202, an additional consideration is the chemical resistivity of a material for the arm 1202.
• the arm 1202 is fabricated using American Society for Testing and Materials (ASTM) stainless steel type 316. In other embodiments, different materials such as plastic, non-ferrous metals, coated ferrous metals and alternate types of stainless steel may be used.
• Figure 13 is a flow chart illustrating a procedure that transport a substrate through a processing assembly in accordance with one embodiment of the present invention.
• the procedure begins with operation 1302 where the substrate clamps and electrode assembly for a first gripper assembly are placed in an open position. Operation 1304 is next and the first gripper assembly is moved into a position to hold the substrate. Next, operation 1306 closes the substrate clamps on the substrate, which is followed by operation 1308 that closes the electrode assembly on the substrate.
• operation 1310 that moves the substrate into a substrate processing assembly. This is followed by operation 1312 where the substrate clamps and electrode assembly of the second gripper assembly are placed in an open position.
• Operation 1814 is next and positions the second gripper assembly in a location to receive the substrate, as it emerges processed, from the process assembly. Once enough of the processed substrate has emerged from the process assembly, operation 1316 closes the substrate clamps of the second gripper assembly on the processed substrate. This is followed by operation 1318 where the electrodes assembly of the second gripper assembly is closed on the processed substrate. Operation 1320 continues the procedure as the first and second grippers continue to move the substrate through the process assembly. At a particular point, operation 1322 opens the electrode assembly of the first gripper assembly followed by operation 1324 that opens the substrate clamps of the first gripper assembly.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Robotics (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Electroplating Methods And Accessories (AREA)

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• 2007
  • 2007-05-21 US US11/751,536 patent/US7780825B2/en not_active Expired - Fee Related
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