KR101522027B1 - 전자 장치 테스트 세트 및 그 내에 사용되는 컨택트 - Google Patents

전자 장치 테스트 세트 및 그 내에 사용되는 컨택트 Download PDF

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Publication number
KR101522027B1
KR101522027B1 KR1020070019224A KR20070019224A KR101522027B1 KR 101522027 B1 KR101522027 B1 KR 101522027B1 KR 1020070019224 A KR1020070019224 A KR 1020070019224A KR 20070019224 A KR20070019224 A KR 20070019224A KR 101522027 B1 KR101522027 B1 KR 101522027B1
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South Korea
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contact
contacts
dut
lead
engaged
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Korean (ko)
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KR20070088404A (ko
Inventor
비. 쉘 데니스
엘 질크 매튜
이. 로페즈 조세
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죤스테크 인터내셔날 코오포레이션
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Publication of KR20070088404A publication Critical patent/KR20070088404A/ko
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0441Details
    • G01R1/0466Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020070019224A 2006-02-24 2007-02-26 전자 장치 테스트 세트 및 그 내에 사용되는 컨택트 Active KR101522027B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US77665406P 2006-02-24 2006-02-24
US60/776,654 2006-02-24
US11/677,870 2007-02-22
US11/677,870 US7639026B2 (en) 2006-02-24 2007-02-22 Electronic device test set and contact used therein

Publications (2)

Publication Number Publication Date
KR20070088404A KR20070088404A (ko) 2007-08-29
KR101522027B1 true KR101522027B1 (ko) 2015-05-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070019224A Active KR101522027B1 (ko) 2006-02-24 2007-02-26 전자 장치 테스트 세트 및 그 내에 사용되는 컨택트

Country Status (8)

Country Link
US (1) US7639026B2 (https=)
EP (2) EP2463666A3 (https=)
JP (1) JP5219383B2 (https=)
KR (1) KR101522027B1 (https=)
CA (1) CA2579697A1 (https=)
MY (1) MY154288A (https=)
SG (1) SG135138A1 (https=)
TW (1) TWI429913B (https=)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009043591A (ja) * 2007-08-09 2009-02-26 Yamaichi Electronics Co Ltd Icソケット
US8278955B2 (en) 2008-03-24 2012-10-02 Interconnect Devices, Inc. Test interconnect
US20090267629A1 (en) * 2008-04-23 2009-10-29 J. Foong Technologies Sdn. Bhd. Contact for interconnect system in a test socket
US20090289647A1 (en) 2008-05-01 2009-11-26 Interconnect Devices, Inc. Interconnect system
WO2009149949A1 (de) * 2008-06-12 2009-12-17 Multitest Elektronische Systeme Gmbh Kontaktsockel
JP5029969B2 (ja) * 2008-11-12 2012-09-19 山一電機株式会社 電気接続装置
TW201027849A (en) 2009-01-13 2010-07-16 Yi-Zhi Yang Connector
US8988090B2 (en) 2009-04-21 2015-03-24 Johnstech International Corporation Electrically conductive kelvin contacts for microcircuit tester
EP2422205B1 (en) 2009-04-21 2019-09-18 JohnsTech International Corporation Electrically conductive kelvin contacts for microcircuit tester
US9329204B2 (en) 2009-04-21 2016-05-03 Johnstech International Corporation Electrically conductive Kelvin contacts for microcircuit tester
US9069011B2 (en) * 2009-09-11 2015-06-30 Exelon Generation Company, Llc Electrical terminal test point and methods of use
US9500645B2 (en) 2009-11-23 2016-11-22 Cyvek, Inc. Micro-tube particles for microfluidic assays and methods of manufacture
US10022696B2 (en) 2009-11-23 2018-07-17 Cyvek, Inc. Microfluidic assay systems employing micro-particles and methods of manufacture
US9855735B2 (en) 2009-11-23 2018-01-02 Cyvek, Inc. Portable microfluidic assay devices and methods of manufacture and use
US9759718B2 (en) 2009-11-23 2017-09-12 Cyvek, Inc. PDMS membrane-confined nucleic acid and antibody/antigen-functionalized microlength tube capture elements, and systems employing them, and methods of their use
JP5701894B2 (ja) 2009-11-23 2015-04-15 サイヴェク・インコーポレイテッド アッセイを行う方法及び装置
US9700889B2 (en) 2009-11-23 2017-07-11 Cyvek, Inc. Methods and systems for manufacture of microarray assay systems, conducting microfluidic assays, and monitoring and scanning to obtain microfluidic assay results
US10065403B2 (en) 2009-11-23 2018-09-04 Cyvek, Inc. Microfluidic assay assemblies and methods of manufacture
WO2011145916A1 (en) * 2010-05-21 2011-11-24 Jf Microtechnology Sdn. Bhd. An electrical interconnect assembly and a test contact for an electrical interconnect assembly
USD668625S1 (en) * 2010-07-22 2012-10-09 Titan Semiconductor Tool, LLC Integrated circuit socket connector
JP2014516158A (ja) * 2011-05-27 2014-07-07 ジェイエフ マイクロテクノロジ・スンディリアン・ブルハド 電気相互接続アッセンブリー
KR200455379Y1 (ko) * 2011-06-13 2011-09-01 나경화 반도체 칩 테스트용 핀 및 그를 포함한 반도체 칩 테스트용 소켓
KR102114734B1 (ko) 2012-03-08 2020-05-25 싸이벡, 아이엔씨 미세유체 분석 장치용 마이크로튜브 입자 및 제조방법
US9274141B1 (en) * 2013-01-22 2016-03-01 Johnstech International Corporation Low resistance low wear test pin for test contactor
US10794933B1 (en) 2013-03-15 2020-10-06 Johnstech International Corporation Integrated circuit contact test apparatus with and method of construction
WO2014167693A1 (ja) 2013-04-11 2014-10-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
TWI500222B (zh) * 2013-07-12 2015-09-11 Ccp Contact Probes Co Ltd 連接器組合
US10114039B1 (en) * 2015-04-24 2018-10-30 Johnstech International Corporation Selectively geometric shaped contact pin for electronic component testing and method of fabrication
US9343830B1 (en) * 2015-06-08 2016-05-17 Xcerra Corporation Integrated circuit chip tester with embedded micro link
US10436819B1 (en) 2015-07-07 2019-10-08 Johnstech International Corporation Constant pressure pin tip for testing integrated circuit chips
US9958499B1 (en) 2015-07-07 2018-05-01 Johnstech International Corporation Constant stress pin tip for testing integrated circuit chips
US10228367B2 (en) 2015-12-01 2019-03-12 ProteinSimple Segmented multi-use automated assay cartridge
JP2018091643A (ja) * 2016-11-30 2018-06-14 矢崎総業株式会社 磁界検出センサ
US11002760B1 (en) 2017-02-06 2021-05-11 Johnstech International Corporation High isolation housing for testing integrated circuits
MX2020007325A (es) 2017-09-25 2021-01-29 Johnstech Int Corp Contactor de alto grado de aislamiento con clavija de prueba y carcasa para probar circuitos integrados.
USD942290S1 (en) * 2019-07-12 2022-02-01 Johnstech International Corporation Tip for integrated circuit test pin
WO2022072858A1 (en) * 2020-10-02 2022-04-07 Johnstech International Corporation Housing with anti-dislodge capability
US11906576B1 (en) 2021-05-04 2024-02-20 Johnstech International Corporation Contact assembly array and testing system having contact assembly array
US11867752B1 (en) 2021-05-13 2024-01-09 Johnstech International Corporation Contact assembly and kelvin testing system having contact assembly
KR20240104127A (ko) * 2021-11-03 2024-07-04 존스테크 인터내셔널 코포레이션 수직 백스톱을 갖는 하우징
USD1042345S1 (en) 2022-04-05 2024-09-17 Johnstech International Corporation Test pin
USD1110279S1 (en) 2022-04-05 2026-01-27 Johnstech International Corporation Contact pin for integrated circuit testing
USD1075695S1 (en) 2022-04-05 2025-05-20 Johnstech International Corporation Contact pin for integrated circuit testing
USD1042346S1 (en) 2022-04-05 2024-09-17 Johnstech International Corporation Contact pin for integrated circuit testing
JP2024064692A (ja) * 2022-10-28 2024-05-14 株式会社日本マイクロニクス コンタクトピンおよび電気的接続装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000057821A (ko) * 1999-01-29 2000-09-25 가부시키가이샤 어드밴티스트 컨택트 구조물의 패키징 및 상호 접속부
KR20000076017A (ko) * 1997-03-06 2000-12-26 플라둥, 만프레드 케이블을 테이크 업 또는 스토잉하기 위한 장치
US20040248448A1 (en) * 2003-04-23 2004-12-09 Gilk Mathew L. Small contactor pin

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4321122A (en) * 1980-03-31 1982-03-23 Eastman Kodak Company Apparatus for forming electrical contact with an analysis slide
US5634801A (en) * 1991-01-09 1997-06-03 Johnstech International Corporation Electrical interconnect contact system
US5207584A (en) * 1991-01-09 1993-05-04 Johnson David A Electrical interconnect contact system
US5781022A (en) * 1991-06-04 1998-07-14 Micron Technology, Inc. Substrate having self limiting contacts for establishing an electrical connection with a semiconductor die
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
JP3675989B2 (ja) * 1995-11-17 2005-07-27 株式会社テセック 電子部品用コネクタ
JP2000156268A (ja) * 1998-11-18 2000-06-06 Kasasaku Electronics:Kk Icソケット及びicソケット用コンタクトピン
JP2000228262A (ja) * 1999-02-08 2000-08-15 Mitsubishi Electric Corp テストソケットのピン及び溝形成方法
JP2001004698A (ja) * 1999-06-18 2001-01-12 Mitsubishi Electric Corp テスト用ソケット、及びその接触端子の製造方法、並びに電子機器あるいは半導体パッケージ
US6794890B1 (en) * 1999-07-27 2004-09-21 Mitsubishi Denki Kabushiki Kaisha Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested
JP2002093541A (ja) * 2000-09-19 2002-03-29 Miyazaki Oki Electric Co Ltd Icソケット
KR100351676B1 (ko) * 2000-10-12 2002-09-05 주식회사 우영 콘택핀 및 이것을 구비한 집적회로 패키지 테스트용 소켓
US6854981B2 (en) * 2002-06-03 2005-02-15 Johnstech International Corporation Small pin connecters
SG129245A1 (en) * 2003-04-29 2007-02-26 Tan Yin Leong Improved probe for integrated circuit test socket
US7445465B2 (en) * 2005-07-08 2008-11-04 Johnstech International Corporation Test socket

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000076017A (ko) * 1997-03-06 2000-12-26 플라둥, 만프레드 케이블을 테이크 업 또는 스토잉하기 위한 장치
KR20000057821A (ko) * 1999-01-29 2000-09-25 가부시키가이샤 어드밴티스트 컨택트 구조물의 패키징 및 상호 접속부
US20040248448A1 (en) * 2003-04-23 2004-12-09 Gilk Mathew L. Small contactor pin

Also Published As

Publication number Publication date
SG135138A1 (en) 2007-09-28
JP5219383B2 (ja) 2013-06-26
EP1826575A3 (en) 2009-06-03
CA2579697A1 (en) 2007-08-24
US7639026B2 (en) 2009-12-29
US20070236236A1 (en) 2007-10-11
EP2463666A3 (en) 2012-08-29
EP1826575A2 (en) 2007-08-29
EP2463666A2 (en) 2012-06-13
TW200741210A (en) 2007-11-01
KR20070088404A (ko) 2007-08-29
EP1826575B1 (en) 2012-02-08
JP2007248460A (ja) 2007-09-27
MY154288A (en) 2015-05-29
TWI429913B (zh) 2014-03-11

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