JP2007248460A - 電子装置のテストセット及びそれに用いられる端子 - Google Patents
電子装置のテストセット及びそれに用いられる端子 Download PDFInfo
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- JP2007248460A JP2007248460A JP2007045642A JP2007045642A JP2007248460A JP 2007248460 A JP2007248460 A JP 2007248460A JP 2007045642 A JP2007045642 A JP 2007045642A JP 2007045642 A JP2007045642 A JP 2007045642A JP 2007248460 A JP2007248460 A JP 2007248460A
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- Prior art keywords
- terminal
- lead
- test set
- test
- dut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012360 testing method Methods 0.000 title claims abstract description 60
- 239000002184 metal Substances 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 10
- 238000009825 accumulation Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000005299 abrasion Methods 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 230000009471 action Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Abstract
【解決手段】テストセットにおいて使用され、試験装置のロード基盤に取付け可能な端子は、多数の接触位置を形成する第1の端部を有し、試験される装置の少なくとも1つのリードを、ロード基板上の対応する金属製の導電線に電気的に接続する。その端子が、該端子によって形成された平面に略垂直な軸線の回りに回転しようとする時、次の接触位置が試験される装置のリードに順次係合される。
【選択図】図1
Description
(関連出願に対する相互参照)
本願は、米国特許法第111条(a)に基づいて、出願された正規の出願であって、米国特許法第111条(b)に基づいて2006年2月24日に先に出願された米国仮出願第60/776,654号の優先権を、米国特許法第119条(e)(1)に基づいて、主張するものである。
Claims (8)
- 試験装置のロード基板に実装され、試験される装置(DUT)の少なくとも1つのリードを、前記ロード基板上の対応する金属製の導電線に電気的に接続するためのテストセットにおいて、
前記装置の前記リードによって係合可能な多数の接触位置を形成する第1の端部、及び前記金属製の導電線と係合する弓形の端縁を備えた第2の端部を有する端子であって、前記端子の前記第1の端部が前記DUTの前記リードに係合され、かつ前記端子によって形成された平面に略垂直な軸線の回りに回転しようとする時、前記金属製の導電線を横切って回転させられる端子と、
前記端子の前記第1の端部が前記DUTの前記リードに係合されている場合において前記軸線の回りに端子を回転させるために、前記ロード基板と前記DUTとの中間に前記端子を弾性的に支持するための手段と
を備えたテストセット。 - 前記多数の接触位置が複数の突起部を備える請求項1に記載のテストセット。
- 前記突起部が互いに略並行である請求項2に記載のテストセット。
- 前記突起部が前記軸線に略並行である請求項3に記載のテストセット。
- 前記端子の前記第1の端部が前記DUTの前記リードに初めに係合される第1の配置から、前記端子が試験位置に配置される第2の配置まで、前記軸線の回りに回転する時に、前記突起部が前記装置の前記リードに順次係合可能である請求項4に記載のテストセット。
- 前記端子が前記第1の配置に位置する場合において最も内側に位置する突起部のみが、前記DUTの前記リードに係合される請求項5に記載のテストセット。
- 前記端子が前記第1の配置から前記第2の配置まで前記軸線の回りに回転する時に、次に外側に位置する突起部が、順次係合される請求項6に記載のテストセット。
- 試験装置によって試験される装置の少なくとも1つのリードを、前記試験装置のロード基板上の対応する金属製の導電線に電気的に接続するための端子であって、
DUTの前記リードによって係合可能な多数の接触位置を形成する第1の端部と、前記金属製の導電線と係合される第2の端部とを有する薄い金属製の本体を備える端子。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US77665406P | 2006-02-24 | 2006-02-24 | |
US60/776,654 | 2006-02-24 | ||
US11/677,870 | 2007-02-22 | ||
US11/677,870 US7639026B2 (en) | 2006-02-24 | 2007-02-22 | Electronic device test set and contact used therein |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007248460A true JP2007248460A (ja) | 2007-09-27 |
JP2007248460A5 JP2007248460A5 (ja) | 2010-04-15 |
JP5219383B2 JP5219383B2 (ja) | 2013-06-26 |
Family
ID=38110606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007045642A Active JP5219383B2 (ja) | 2006-02-24 | 2007-02-26 | 電子装置のテストセット |
Country Status (8)
Country | Link |
---|---|
US (1) | US7639026B2 (ja) |
EP (2) | EP1826575B1 (ja) |
JP (1) | JP5219383B2 (ja) |
KR (1) | KR101522027B1 (ja) |
CA (1) | CA2579697A1 (ja) |
MY (1) | MY154288A (ja) |
SG (1) | SG135138A1 (ja) |
TW (1) | TWI429913B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US7914295B2 (en) | 2008-11-12 | 2011-03-29 | Yamaichi Electronics Co., Ltd. | Electrical connecting device |
WO2024090359A1 (ja) * | 2022-10-28 | 2024-05-02 | 株式会社日本マイクロニクス | コンタクトピンおよび電気的接続装置 |
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JP2009043591A (ja) * | 2007-08-09 | 2009-02-26 | Yamaichi Electronics Co Ltd | Icソケット |
US8278955B2 (en) | 2008-03-24 | 2012-10-02 | Interconnect Devices, Inc. | Test interconnect |
US20090267629A1 (en) * | 2008-04-23 | 2009-10-29 | J. Foong Technologies Sdn. Bhd. | Contact for interconnect system in a test socket |
US20090289647A1 (en) | 2008-05-01 | 2009-11-26 | Interconnect Devices, Inc. | Interconnect system |
DE112009000035B4 (de) * | 2008-06-12 | 2015-04-16 | Multitest Elektronische Systeme Gmbh | Kontaktfeder und Kontaktsockel mit einer Mehrzahl von solchen Kontaktfedern |
TW201027849A (en) | 2009-01-13 | 2010-07-16 | Yi-Zhi Yang | Connector |
JP5695637B2 (ja) | 2009-04-21 | 2015-04-08 | ジョンステック インターナショナル コーポレーションJohnstech International Corporation | 超小型回路試験器の導電ケルビン接点 |
US9329204B2 (en) | 2009-04-21 | 2016-05-03 | Johnstech International Corporation | Electrically conductive Kelvin contacts for microcircuit tester |
US8988090B2 (en) | 2009-04-21 | 2015-03-24 | Johnstech International Corporation | Electrically conductive kelvin contacts for microcircuit tester |
US9069011B2 (en) * | 2009-09-11 | 2015-06-30 | Exelon Generation Company, Llc | Electrical terminal test point and methods of use |
US9500645B2 (en) | 2009-11-23 | 2016-11-22 | Cyvek, Inc. | Micro-tube particles for microfluidic assays and methods of manufacture |
US9759718B2 (en) | 2009-11-23 | 2017-09-12 | Cyvek, Inc. | PDMS membrane-confined nucleic acid and antibody/antigen-functionalized microlength tube capture elements, and systems employing them, and methods of their use |
US9651568B2 (en) | 2009-11-23 | 2017-05-16 | Cyvek, Inc. | Methods and systems for epi-fluorescent monitoring and scanning for microfluidic assays |
US9855735B2 (en) | 2009-11-23 | 2018-01-02 | Cyvek, Inc. | Portable microfluidic assay devices and methods of manufacture and use |
US10065403B2 (en) | 2009-11-23 | 2018-09-04 | Cyvek, Inc. | Microfluidic assay assemblies and methods of manufacture |
US9700889B2 (en) | 2009-11-23 | 2017-07-11 | Cyvek, Inc. | Methods and systems for manufacture of microarray assay systems, conducting microfluidic assays, and monitoring and scanning to obtain microfluidic assay results |
WO2011063408A1 (en) | 2009-11-23 | 2011-05-26 | Cyvek, Inc. | Method and apparatus for performing assays |
WO2011145916A1 (en) * | 2010-05-21 | 2011-11-24 | Jf Microtechnology Sdn. Bhd. | An electrical interconnect assembly and a test contact for an electrical interconnect assembly |
USD668625S1 (en) * | 2010-07-22 | 2012-10-09 | Titan Semiconductor Tool, LLC | Integrated circuit socket connector |
SG195107A1 (en) | 2011-05-27 | 2013-12-30 | Jf Microtechnology Sdn Bhd | An electrical interconnect assembly |
KR200455379Y1 (ko) * | 2011-06-13 | 2011-09-01 | 나경화 | 반도체 칩 테스트용 핀 및 그를 포함한 반도체 칩 테스트용 소켓 |
KR102114734B1 (ko) | 2012-03-08 | 2020-05-25 | 싸이벡, 아이엔씨 | 미세유체 분석 장치용 마이크로튜브 입자 및 제조방법 |
US9274141B1 (en) * | 2013-01-22 | 2016-03-01 | Johnstech International Corporation | Low resistance low wear test pin for test contactor |
US10794933B1 (en) | 2013-03-15 | 2020-10-06 | Johnstech International Corporation | Integrated circuit contact test apparatus with and method of construction |
JP6234441B2 (ja) | 2013-04-11 | 2017-11-22 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
TWI500222B (zh) * | 2013-07-12 | 2015-09-11 | Ccp Contact Probes Co Ltd | 連接器組合 |
US10114039B1 (en) * | 2015-04-24 | 2018-10-30 | Johnstech International Corporation | Selectively geometric shaped contact pin for electronic component testing and method of fabrication |
US9343830B1 (en) * | 2015-06-08 | 2016-05-17 | Xcerra Corporation | Integrated circuit chip tester with embedded micro link |
US10436819B1 (en) | 2015-07-07 | 2019-10-08 | Johnstech International Corporation | Constant pressure pin tip for testing integrated circuit chips |
US9958499B1 (en) | 2015-07-07 | 2018-05-01 | Johnstech International Corporation | Constant stress pin tip for testing integrated circuit chips |
US10228367B2 (en) | 2015-12-01 | 2019-03-12 | ProteinSimple | Segmented multi-use automated assay cartridge |
JP2018091643A (ja) * | 2016-11-30 | 2018-06-14 | 矢崎総業株式会社 | 磁界検出センサ |
US11002760B1 (en) | 2017-02-06 | 2021-05-11 | Johnstech International Corporation | High isolation housing for testing integrated circuits |
WO2019060877A1 (en) | 2017-09-25 | 2019-03-28 | Johnstech International Corporation | HIGH TEST PIN INSULATION SWITCH AND INTEGRATED CIRCUIT TEST HOUSING |
USD942290S1 (en) * | 2019-07-12 | 2022-02-01 | Johnstech International Corporation | Tip for integrated circuit test pin |
US11906576B1 (en) | 2021-05-04 | 2024-02-20 | Johnstech International Corporation | Contact assembly array and testing system having contact assembly array |
US11867752B1 (en) | 2021-05-13 | 2024-01-09 | Johnstech International Corporation | Contact assembly and kelvin testing system having contact assembly |
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JPH05174880A (ja) * | 1991-01-09 | 1993-07-13 | David A Johnson | 電気的相互接続コンタクト装置 |
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2007
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- 2007-02-23 MY MYPI20070275A patent/MY154288A/en unknown
- 2007-02-23 EP EP07003763A patent/EP1826575B1/en active Active
- 2007-02-23 SG SG200701278-4A patent/SG135138A1/en unknown
- 2007-02-23 EP EP12154283A patent/EP2463666A3/en not_active Withdrawn
- 2007-02-26 KR KR1020070019224A patent/KR101522027B1/ko active IP Right Grant
- 2007-02-26 TW TW096106539A patent/TWI429913B/zh active
- 2007-02-26 CA CA002579697A patent/CA2579697A1/en not_active Abandoned
- 2007-02-26 JP JP2007045642A patent/JP5219383B2/ja active Active
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JPH09232481A (ja) * | 1995-11-17 | 1997-09-05 | Tesetsuku:Kk | 電子部品用コネクタ |
JP2000228262A (ja) * | 1999-02-08 | 2000-08-15 | Mitsubishi Electric Corp | テストソケットのピン及び溝形成方法 |
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US7914295B2 (en) | 2008-11-12 | 2011-03-29 | Yamaichi Electronics Co., Ltd. | Electrical connecting device |
WO2024090359A1 (ja) * | 2022-10-28 | 2024-05-02 | 株式会社日本マイクロニクス | コンタクトピンおよび電気的接続装置 |
Also Published As
Publication number | Publication date |
---|---|
JP5219383B2 (ja) | 2013-06-26 |
TW200741210A (en) | 2007-11-01 |
US7639026B2 (en) | 2009-12-29 |
EP2463666A2 (en) | 2012-06-13 |
US20070236236A1 (en) | 2007-10-11 |
TWI429913B (zh) | 2014-03-11 |
EP1826575B1 (en) | 2012-02-08 |
KR20070088404A (ko) | 2007-08-29 |
EP1826575A2 (en) | 2007-08-29 |
EP1826575A3 (en) | 2009-06-03 |
SG135138A1 (en) | 2007-09-28 |
KR101522027B1 (ko) | 2015-05-20 |
MY154288A (en) | 2015-05-29 |
CA2579697A1 (en) | 2007-08-24 |
EP2463666A3 (en) | 2012-08-29 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |