KR101467718B1 - 반도체 장치의 제조방법 및 그 방법에 사용되는 반도체 웨이퍼 표면 보호용 필름 - Google Patents
반도체 장치의 제조방법 및 그 방법에 사용되는 반도체 웨이퍼 표면 보호용 필름 Download PDFInfo
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- KR101467718B1 KR101467718B1 KR1020137015128A KR20137015128A KR101467718B1 KR 101467718 B1 KR101467718 B1 KR 101467718B1 KR 1020137015128 A KR1020137015128 A KR 1020137015128A KR 20137015128 A KR20137015128 A KR 20137015128A KR 101467718 B1 KR101467718 B1 KR 101467718B1
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- semiconductor wafer
- protective film
- layer
- surface protective
- wafer surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/105—Esters of polyhydric alcohols or polyhydric phenols of pentaalcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/106—Esters of polycondensation macromers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
- C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/006—Presence of polyolefin in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2011-173948 | 2011-08-09 | ||
JP2011173948 | 2011-08-09 | ||
JPJP-P-2012-117631 | 2012-05-23 | ||
JP2012117631 | 2012-05-23 | ||
PCT/JP2012/005058 WO2013021644A1 (ja) | 2011-08-09 | 2012-08-09 | 半導体装置の製造方法およびその方法に用いられる半導体ウエハ表面保護用フィルム |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130084695A KR20130084695A (ko) | 2013-07-25 |
KR101467718B1 true KR101467718B1 (ko) | 2014-12-01 |
Family
ID=47668179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020137015128A KR101467718B1 (ko) | 2011-08-09 | 2012-08-09 | 반도체 장치의 제조방법 및 그 방법에 사용되는 반도체 웨이퍼 표면 보호용 필름 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5393902B2 (zh) |
KR (1) | KR101467718B1 (zh) |
CN (1) | CN103748664B (zh) |
SG (1) | SG189515A1 (zh) |
TW (1) | TWI544533B (zh) |
WO (1) | WO2013021644A1 (zh) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5951216B2 (ja) * | 2011-10-13 | 2016-07-13 | リンテック株式会社 | 粘着シートおよびその使用方法 |
EP3316280B1 (en) * | 2015-06-29 | 2024-02-28 | Mitsui Chemicals Tohcello, Inc. | Use of a film for manufacturing semiconductor parts |
GB2551732B (en) * | 2016-06-28 | 2020-05-27 | Disco Corp | Method of processing wafer |
TW201901847A (zh) | 2017-05-11 | 2019-01-01 | 日商三井化學東賽璐股份有限公司 | 零件製造用具以及零件製造方法 |
DE102018202254A1 (de) * | 2018-02-14 | 2019-08-14 | Disco Corporation | Verfahren zum Bearbeiten eines Wafers |
JP2018100423A (ja) * | 2018-03-20 | 2018-06-28 | リンテック株式会社 | 粘着テープおよび半導体装置の製造方法 |
TWI825080B (zh) * | 2018-03-30 | 2023-12-11 | 日商琳得科股份有限公司 | 半導體晶片的製造方法 |
JP7214364B2 (ja) * | 2018-05-01 | 2023-01-30 | 株式会社ディスコ | ウエーハの加工方法 |
JP7114176B2 (ja) * | 2018-06-01 | 2022-08-08 | 株式会社ディスコ | 樹脂パッケージ基板の加工方法 |
JP7154686B2 (ja) * | 2018-06-06 | 2022-10-18 | 株式会社ディスコ | ウェーハの加工方法 |
JP2019212783A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
JP2019212784A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
JP2019220550A (ja) * | 2018-06-19 | 2019-12-26 | 株式会社ディスコ | ウエーハの加工方法 |
JP7181020B2 (ja) * | 2018-07-26 | 2022-11-30 | 株式会社ディスコ | ウエーハの加工方法 |
JP7166718B2 (ja) * | 2018-10-17 | 2022-11-08 | 株式会社ディスコ | ウェーハの加工方法 |
JP7175565B2 (ja) * | 2018-10-17 | 2022-11-21 | 株式会社ディスコ | ウェーハの加工方法 |
JP7204296B2 (ja) * | 2018-10-17 | 2023-01-16 | 株式会社ディスコ | ウェーハの加工方法 |
JP7175567B2 (ja) * | 2018-10-17 | 2022-11-21 | 株式会社ディスコ | ウェーハの加工方法 |
JP7204294B2 (ja) * | 2018-10-17 | 2023-01-16 | 株式会社ディスコ | ウェーハの加工方法 |
JP7166719B2 (ja) * | 2018-10-17 | 2022-11-08 | 株式会社ディスコ | ウェーハの加工方法 |
JP7204295B2 (ja) * | 2018-10-17 | 2023-01-16 | 株式会社ディスコ | ウェーハの加工方法 |
JP7175566B2 (ja) * | 2018-10-17 | 2022-11-21 | 株式会社ディスコ | ウェーハの加工方法 |
JP7166720B2 (ja) * | 2018-10-17 | 2022-11-08 | 株式会社ディスコ | ウェーハの加工方法 |
KR20210093229A (ko) * | 2018-11-22 | 2021-07-27 | 린텍 가부시키가이샤 | 열경화성 보호막 형성용 필름, 보호막 형성용 복합 시트, 및 칩의 제조 방법 |
JP7224719B2 (ja) * | 2019-01-17 | 2023-02-20 | 株式会社ディスコ | ウェーハの加工方法 |
JP7242136B2 (ja) * | 2019-03-05 | 2023-03-20 | 株式会社ディスコ | ウェーハの加工方法 |
JP7242135B2 (ja) * | 2019-03-05 | 2023-03-20 | 株式会社ディスコ | ウェーハの加工方法 |
JP7242134B2 (ja) * | 2019-03-05 | 2023-03-20 | 株式会社ディスコ | ウェーハの加工方法 |
US12103288B2 (en) * | 2019-03-27 | 2024-10-01 | Mitsui Chemicals Tohcello, Inc. | Affixing device |
JP7286245B2 (ja) * | 2019-06-07 | 2023-06-05 | 株式会社ディスコ | ウェーハの加工方法 |
JP2021015840A (ja) * | 2019-07-10 | 2021-02-12 | 株式会社ディスコ | ウェーハの加工方法 |
JP2021015823A (ja) * | 2019-07-10 | 2021-02-12 | 株式会社ディスコ | ウェーハの加工方法 |
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JP7350432B2 (ja) * | 2019-08-07 | 2023-09-26 | 株式会社ディスコ | ウェーハの加工方法 |
JP7345974B2 (ja) * | 2019-08-07 | 2023-09-19 | 株式会社ディスコ | ウェーハの加工方法 |
JP7334010B2 (ja) * | 2019-08-07 | 2023-08-28 | 株式会社ディスコ | ウェーハの加工方法 |
JP7334012B2 (ja) * | 2019-08-07 | 2023-08-28 | 株式会社ディスコ | ウェーハの加工方法 |
JP7334009B2 (ja) * | 2019-08-07 | 2023-08-28 | 株式会社ディスコ | ウェーハの加工方法 |
JP7461118B2 (ja) * | 2019-08-19 | 2024-04-03 | 株式会社ディスコ | ウエーハの加工方法 |
JP7374657B2 (ja) * | 2019-08-21 | 2023-11-07 | 株式会社ディスコ | ウエーハの加工方法 |
JP7301480B2 (ja) * | 2019-10-17 | 2023-07-03 | 株式会社ディスコ | ウェーハの加工方法 |
JP2021068742A (ja) * | 2019-10-18 | 2021-04-30 | 株式会社ディスコ | リングフレーム |
JP7418184B2 (ja) * | 2019-11-14 | 2024-01-19 | 株式会社ディスコ | 保護部材の設置方法、被加工物の加工方法及び保護部材の製造方法 |
TWI725785B (zh) * | 2020-03-19 | 2021-04-21 | 碩正科技股份有限公司 | 半導體晶圓保護片 |
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KR20050099057A (ko) * | 2004-04-08 | 2005-10-13 | 주식회사 해피베드 | 환자용 침대의 세면탁자 전개 및 회전구조 |
JP2005340796A (ja) * | 2004-04-28 | 2005-12-08 | Mitsui Chemicals Inc | 半導体ウエハ表面保護フィルム及び該保護フィルムを用いる半導体ウエハの保護方法 |
JP2006229076A (ja) * | 2005-02-18 | 2006-08-31 | Sekisui Chem Co Ltd | Icチップの製造方法 |
JP2007096115A (ja) * | 2005-09-29 | 2007-04-12 | Fujitsu Ltd | 半導体装置の製造方法 |
Family Cites Families (3)
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- 2012-08-09 WO PCT/JP2012/005058 patent/WO2013021644A1/ja active Application Filing
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- 2012-08-09 CN CN201280038816.2A patent/CN103748664B/zh active Active
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KR20050099057A (ko) * | 2004-04-08 | 2005-10-13 | 주식회사 해피베드 | 환자용 침대의 세면탁자 전개 및 회전구조 |
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WO2013021644A1 (ja) | 2013-02-14 |
CN103748664A (zh) | 2014-04-23 |
JP5393902B2 (ja) | 2014-01-22 |
TW201316393A (zh) | 2013-04-16 |
KR20130084695A (ko) | 2013-07-25 |
CN103748664B (zh) | 2016-04-20 |
JPWO2013021644A1 (ja) | 2015-03-05 |
TWI544533B (zh) | 2016-08-01 |
SG189515A1 (en) | 2013-05-31 |
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