JP7301480B2 - ウェーハの加工方法 - Google Patents
ウェーハの加工方法 Download PDFInfo
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- JP7301480B2 JP7301480B2 JP2019190070A JP2019190070A JP7301480B2 JP 7301480 B2 JP7301480 B2 JP 7301480B2 JP 2019190070 A JP2019190070 A JP 2019190070A JP 2019190070 A JP2019190070 A JP 2019190070A JP 7301480 B2 JP7301480 B2 JP 7301480B2
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- Prior art keywords
- wafer
- polyolefin
- sheet
- frame
- based sheet
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Description
波長 :1030nm
平均出力 :3W
繰り返し周波数:50kHz
パルス幅 :10ps
集光スポット径:φ10μm
送り速度 :500mm/秒
1a 表面
1b 裏面
3 分割予定ライン
3a シールドトンネル
3b 細孔
3c 非晶質領域
5 デバイス
7 フレーム
7a 開口
9 ポリオレフィン系シート
9a 切断痕
11 フレームユニット
2 チャックテーブル
2a 保持面
2b,36a 吸引源
2c,36b 切り替え部
4 ヒートガン
4a 熱風
6 ヒートローラー
8 赤外線ランプ
8a 赤外線
10 カッター
12 レーザー加工装置
14 レーザー加工ユニット
14a 加工ヘッド
14b 集光点
16 レーザービーム
18 ピックアップ装置
20 ドラム
22 フレーム保持ユニット
24 クランプ
26 フレーム支持台
28 ロッド
30 エアシリンダ
32 ベース
34 突き上げ機構
34a 冷却部
36 コレット
Claims (7)
- 複数のデバイスが、分割予定ラインによって区画された表面の各領域に形成されたウェーハを個々のデバイスチップに分割するウェーハの加工方法であって、
ウェーハを収容する開口を有するフレームの該開口内にウェーハを位置付け、該ウェーハの裏面または該表面と、該フレームの外周と、にポリオレフィン系シートを配設するポリオレフィン系シート配設工程と、
該ポリオレフィン系シートを加熱し熱圧着により該ウェーハと該フレームとを該ポリオレフィン系シートを介して一体化する一体化工程と、
該ウェーハに対して透過性を有する波長のレーザービームの集光点を該ウェーハの内部に位置付け、該レーザービームを該分割予定ラインに沿って該ウェーハに照射して該ウェーハに連続的にシールドトンネルを形成し、該ウェーハを個々のデバイスチップに分割する分割工程と、
該ポリオレフィン系シートの各デバイスチップに対応する個々の領域において、該ポリオレフィン系シートを冷却し、該ポリオレフィン系シート側から該デバイスチップを突き上げ、該ポリオレフィン系シートから該デバイスチップをピックアップするピックアップ工程と、
を備えることを特徴とするウェーハの加工方法。 - 該一体化工程において、赤外線の照射によって該熱圧着を実施することを特徴とする請求項1記載のウェーハの加工方法。
- 該一体化工程において、一体化を実施した後、該フレームの外周からはみ出したポリオレフィン系シートを除去することを特徴とする請求項1記載のウェーハの加工方法。
- 該ピックアップ工程では、該ポリオレフィン系シートを拡張して各デバイスチップ間の間隔を広げることを特徴とする請求項1記載のウェーハの加工方法。
- 該ポリオレフィン系シートは、ポリエチレンシート、ポリプロピレンシート、ポリスチレンシートのいずれかであることを特徴とする請求項1記載のウェーハの加工方法。
- 該一体化工程において、該ポリオレフィン系シートが該ポリエチレンシートである場合に加熱温度は120℃~140℃であり、該ポリオレフィン系シートが該ポリプロピレンシートである場合に加熱温度は160℃~180℃であり、該ポリオレフィン系シートが該ポリスチレンシートである場合に加熱温度は220℃~240℃であることを特徴とする請求項5記載のウェーハの加工方法。
- 該ウェーハは、Si、GaN、GaAs、ガラスのいずれかで構成されることを特徴とする請求項1記載のウェーハの加工方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019190070A JP7301480B2 (ja) | 2019-10-17 | 2019-10-17 | ウェーハの加工方法 |
CN202011015035.4A CN112687533A (zh) | 2019-10-17 | 2020-09-24 | 晶片的加工方法 |
TW109133677A TWI830953B (zh) | 2019-10-17 | 2020-09-28 | 晶圓的加工方法 |
SG10202009949PA SG10202009949PA (en) | 2019-10-17 | 2020-10-07 | Wafer processing method |
KR1020200130403A KR20210045934A (ko) | 2019-10-17 | 2020-10-08 | 웨이퍼의 가공 방법 |
US17/068,936 US11587832B2 (en) | 2019-10-17 | 2020-10-13 | Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer |
DE102020212954.1A DE102020212954A1 (de) | 2019-10-17 | 2020-10-14 | Waferbearbeitungsverfahren |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019190070A JP7301480B2 (ja) | 2019-10-17 | 2019-10-17 | ウェーハの加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021064751A JP2021064751A (ja) | 2021-04-22 |
JP7301480B2 true JP7301480B2 (ja) | 2023-07-03 |
Family
ID=75268639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019190070A Active JP7301480B2 (ja) | 2019-10-17 | 2019-10-17 | ウェーハの加工方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11587832B2 (ja) |
JP (1) | JP7301480B2 (ja) |
KR (1) | KR20210045934A (ja) |
CN (1) | CN112687533A (ja) |
DE (1) | DE102020212954A1 (ja) |
SG (1) | SG10202009949PA (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7140626B2 (ja) * | 2018-10-10 | 2022-09-21 | 株式会社ディスコ | リングフレームの保持機構 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005191297A (ja) | 2003-12-25 | 2005-07-14 | Jsr Corp | ダイシングフィルム及び半導体ウェハの切断方法 |
JP2006203133A (ja) | 2005-01-24 | 2006-08-03 | Lintec Corp | チップ体の製造方法、デバイスの製造方法およびチップ体固着用粘接着シート |
WO2013021644A1 (ja) | 2011-08-09 | 2013-02-14 | 三井化学株式会社 | 半導体装置の製造方法およびその方法に用いられる半導体ウエハ表面保護用フィルム |
JP2017199845A (ja) | 2016-04-28 | 2017-11-02 | 株式会社ディスコ | デバイスの製造方法及び研削装置 |
US20190051561A1 (en) | 2017-08-09 | 2019-02-14 | Disco Corporation | Workpiece dividing method |
Family Cites Families (13)
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JPS539710B2 (ja) * | 1972-08-07 | 1978-04-07 | ||
US4197346A (en) | 1978-10-10 | 1980-04-08 | Appleton Papers Inc. | Self-contained pressure-sensitive record material and process of preparation |
JP3076179B2 (ja) | 1993-07-26 | 2000-08-14 | 株式会社ディスコ | ダイシング装置 |
JP3076179U (ja) | 2000-09-07 | 2001-03-30 | 和雄 落合 | コップ型ボトルキャップ |
JP2006049591A (ja) * | 2004-08-05 | 2006-02-16 | Disco Abrasive Syst Ltd | ウエーハに貼着された接着フィルムの破断方法および破断装置 |
JP2008117943A (ja) * | 2006-11-06 | 2008-05-22 | Nitto Denko Corp | ウォータージェットレーザダイシング用粘着シート |
JP6151557B2 (ja) | 2013-05-13 | 2017-06-21 | 株式会社ディスコ | レーザー加工方法 |
JP6121281B2 (ja) * | 2013-08-06 | 2017-04-26 | 株式会社ディスコ | ウエーハの加工方法 |
WO2016052444A1 (ja) * | 2014-09-29 | 2016-04-07 | リンテック株式会社 | 半導体ウエハ加工用シート用基材、半導体ウエハ加工用シート、および半導体装置の製造方法 |
JP2019192717A (ja) | 2018-04-20 | 2019-10-31 | 株式会社ディスコ | ウエーハの加工方法 |
JP7154809B2 (ja) | 2018-04-20 | 2022-10-18 | 株式会社ディスコ | ウエーハの加工方法 |
JP7181020B2 (ja) * | 2018-07-26 | 2022-11-30 | 株式会社ディスコ | ウエーハの加工方法 |
JP7345973B2 (ja) * | 2019-08-07 | 2023-09-19 | 株式会社ディスコ | ウェーハの加工方法 |
-
2019
- 2019-10-17 JP JP2019190070A patent/JP7301480B2/ja active Active
-
2020
- 2020-09-24 CN CN202011015035.4A patent/CN112687533A/zh active Pending
- 2020-10-07 SG SG10202009949PA patent/SG10202009949PA/en unknown
- 2020-10-08 KR KR1020200130403A patent/KR20210045934A/ko active Search and Examination
- 2020-10-13 US US17/068,936 patent/US11587832B2/en active Active
- 2020-10-14 DE DE102020212954.1A patent/DE102020212954A1/de active Pending
Patent Citations (6)
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JP2005191297A (ja) | 2003-12-25 | 2005-07-14 | Jsr Corp | ダイシングフィルム及び半導体ウェハの切断方法 |
JP2006203133A (ja) | 2005-01-24 | 2006-08-03 | Lintec Corp | チップ体の製造方法、デバイスの製造方法およびチップ体固着用粘接着シート |
WO2013021644A1 (ja) | 2011-08-09 | 2013-02-14 | 三井化学株式会社 | 半導体装置の製造方法およびその方法に用いられる半導体ウエハ表面保護用フィルム |
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US20190051561A1 (en) | 2017-08-09 | 2019-02-14 | Disco Corporation | Workpiece dividing method |
JP2019033212A (ja) | 2017-08-09 | 2019-02-28 | 株式会社ディスコ | 分割方法 |
Also Published As
Publication number | Publication date |
---|---|
DE102020212954A1 (de) | 2021-04-22 |
CN112687533A (zh) | 2021-04-20 |
KR20210045934A (ko) | 2021-04-27 |
US11587832B2 (en) | 2023-02-21 |
TW202129726A (zh) | 2021-08-01 |
US20210118737A1 (en) | 2021-04-22 |
JP2021064751A (ja) | 2021-04-22 |
SG10202009949PA (en) | 2021-05-28 |
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