KR101467179B1 - 금속박적층체 - Google Patents

금속박적층체 Download PDF

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Publication number
KR101467179B1
KR101467179B1 KR1020070133902A KR20070133902A KR101467179B1 KR 101467179 B1 KR101467179 B1 KR 101467179B1 KR 1020070133902 A KR1020070133902 A KR 1020070133902A KR 20070133902 A KR20070133902 A KR 20070133902A KR 101467179 B1 KR101467179 B1 KR 101467179B1
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KR
South Korea
Prior art keywords
polyimide
layer
thermal expansion
polyimide layer
ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020070133902A
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English (en)
Korean (ko)
Other versions
KR20090066399A (ko
Inventor
유홍
김철호
김대년
조병욱
Original Assignee
에스케이이노베이션 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020070133902A priority Critical patent/KR101467179B1/ko
Application filed by 에스케이이노베이션 주식회사 filed Critical 에스케이이노베이션 주식회사
Priority to CN2008801217899A priority patent/CN101903169B/zh
Priority to JP2010539287A priority patent/JP5425093B2/ja
Priority to PCT/KR2008/007242 priority patent/WO2009082101A2/en
Priority to US12/745,712 priority patent/US8318315B2/en
Priority to TW097149240A priority patent/TWI474921B/zh
Publication of KR20090066399A publication Critical patent/KR20090066399A/ko
Application granted granted Critical
Publication of KR101467179B1 publication Critical patent/KR101467179B1/ko
Assigned to 주식회사 넥스플렉스 reassignment 주식회사 넥스플렉스 권리의 전부이전등록 Assignors: 에스케이이노베이션 주식회사
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
KR1020070133902A 2007-12-20 2007-12-20 금속박적층체 Active KR101467179B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020070133902A KR101467179B1 (ko) 2007-12-20 2007-12-20 금속박적층체
JP2010539287A JP5425093B2 (ja) 2007-12-20 2008-12-08 金属箔積層体
PCT/KR2008/007242 WO2009082101A2 (en) 2007-12-20 2008-12-08 Metal-clad laminate
US12/745,712 US8318315B2 (en) 2007-12-20 2008-12-08 Metal-clad laminate
CN2008801217899A CN101903169B (zh) 2007-12-20 2008-12-08 金属包覆层积体
TW097149240A TWI474921B (zh) 2007-12-20 2008-12-17 覆金屬之積層板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070133902A KR101467179B1 (ko) 2007-12-20 2007-12-20 금속박적층체

Publications (2)

Publication Number Publication Date
KR20090066399A KR20090066399A (ko) 2009-06-24
KR101467179B1 true KR101467179B1 (ko) 2014-12-01

Family

ID=40801656

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070133902A Active KR101467179B1 (ko) 2007-12-20 2007-12-20 금속박적층체

Country Status (6)

Country Link
US (1) US8318315B2 (https=)
JP (1) JP5425093B2 (https=)
KR (1) KR101467179B1 (https=)
CN (1) CN101903169B (https=)
TW (1) TWI474921B (https=)
WO (1) WO2009082101A2 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5621768B2 (ja) * 2009-04-14 2014-11-12 宇部興産株式会社 メタライジング用のポリイミドフィルム、これらの製造方法、及び金属積層ポリイミドフィルム
KR101437612B1 (ko) * 2010-12-20 2014-09-15 에스케이이노베이션 주식회사 후막 폴리이미드 연성금속적층판의 제조방법
KR101514221B1 (ko) * 2011-12-07 2015-04-23 에스케이이노베이션 주식회사 다층 폴리이미드 구조의 연성금속적층판 제조방법
CN104066574B (zh) * 2011-12-28 2016-08-24 Sk新技术株式会社 柔性金属箔层叠体及其制造方法
WO2013100627A1 (ko) * 2011-12-28 2013-07-04 에스케이이노베이션 주식회사 연성금속박적층체 및 이의 제조방법
KR102038137B1 (ko) * 2012-12-21 2019-10-30 주식회사 넥스플렉스 다층 연성금속박 적층체 및 이의 제조방법
DE102016012554B4 (de) * 2016-10-20 2021-09-23 Martin Huber Patent UG (haftungsbeschränkt) Wärmemotor mit mehreren Doppelschichtbauteilen
JP6891564B2 (ja) * 2017-03-16 2021-06-18 コニカミノルタ株式会社 透明耐熱性積層フィルム、透明フレキシブルプリント基板、透明電極基板、照明装置及び有機エレクトロルミネッセンス表示装置
CN109517171B (zh) * 2017-09-19 2021-06-01 臻鼎科技股份有限公司 低介电聚酰亚胺用树脂组合物、聚酰亚胺、聚酰亚胺膜及覆铜板
TWI665260B (zh) * 2017-09-19 2019-07-11 臻鼎科技股份有限公司 低介電聚醯亞胺組合物、聚醯亞胺、聚醯亞胺膜及覆銅板
JP7375318B2 (ja) * 2018-05-16 2023-11-08 東レ株式会社 ポリイミド前駆体樹脂組成物、ポリイミド樹脂組成物およびその膜状物、それを含む積層体、ならびにフレキシブルデバイス
US12060456B2 (en) 2019-02-01 2024-08-13 Lg Chem, Ltd. Polyimide precursor composition and polyimide film, substrate for display device, and optical device prepared by using same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513902A (ja) * 1990-09-04 1993-01-22 Chisso Corp フレキシブルプリント基板及びその製造法
KR20070091577A (ko) * 2006-03-06 2007-09-11 주식회사 엘지화학 금속적층판 및 이의 제조방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4847353A (en) 1986-11-20 1989-07-11 Nippon Steel Chemical Co., Ltd. Resins of low thermal expansivity
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
EP0459452A3 (en) * 1990-05-30 1992-04-08 Ube Industries, Ltd. Aromatic polyimide film laminated with metal foil
US7285321B2 (en) 2003-11-12 2007-10-23 E.I. Du Pont De Nemours And Company Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto
US20070169886A1 (en) * 2004-03-04 2007-07-26 Toray Industries, Inc. Heat-resistant resin laminated film, multilayer film with metal layer including same and semiconductor device
JP4544588B2 (ja) 2005-03-14 2010-09-15 株式会社エー・エム・ティー・研究所 積層体
JP2007118477A (ja) * 2005-10-31 2007-05-17 Toray Ind Inc 両面金属箔積層板およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513902A (ja) * 1990-09-04 1993-01-22 Chisso Corp フレキシブルプリント基板及びその製造法
KR20070091577A (ko) * 2006-03-06 2007-09-11 주식회사 엘지화학 금속적층판 및 이의 제조방법

Also Published As

Publication number Publication date
TW200930565A (en) 2009-07-16
WO2009082101A3 (en) 2009-08-13
JP2011508685A (ja) 2011-03-17
US20100255324A1 (en) 2010-10-07
CN101903169B (zh) 2013-09-04
WO2009082101A2 (en) 2009-07-02
US8318315B2 (en) 2012-11-27
KR20090066399A (ko) 2009-06-24
CN101903169A (zh) 2010-12-01
JP5425093B2 (ja) 2014-02-26
TWI474921B (zh) 2015-03-01

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