KR101458771B1 - 발광 장치 - Google Patents
발광 장치 Download PDFInfo
- Publication number
- KR101458771B1 KR101458771B1 KR1020080061671A KR20080061671A KR101458771B1 KR 101458771 B1 KR101458771 B1 KR 101458771B1 KR 1020080061671 A KR1020080061671 A KR 1020080061671A KR 20080061671 A KR20080061671 A KR 20080061671A KR 101458771 B1 KR101458771 B1 KR 101458771B1
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor film
- film
- electrode
- thin film
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0316—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
- H10D30/6739—Conductor-insulator-semiconductor electrodes
Landscapes
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Recrystallisation Techniques (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2007-00173539 | 2007-06-29 | ||
| JP2007173539 | 2007-06-29 | ||
| JPJP-P-2007-00185057 | 2007-07-13 | ||
| JP2007185057 | 2007-07-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20090004587A KR20090004587A (ko) | 2009-01-12 |
| KR101458771B1 true KR101458771B1 (ko) | 2014-11-07 |
Family
ID=40159289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020080061671A Active KR101458771B1 (ko) | 2007-06-29 | 2008-06-27 | 발광 장치 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8921858B2 (enExample) |
| JP (1) | JP5542269B2 (enExample) |
| KR (1) | KR101458771B1 (enExample) |
| TW (1) | TWI466299B (enExample) |
Families Citing this family (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9176353B2 (en) * | 2007-06-29 | 2015-11-03 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device |
| US8334537B2 (en) * | 2007-07-06 | 2012-12-18 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device |
| TWI456663B (zh) | 2007-07-20 | 2014-10-11 | Semiconductor Energy Lab | 顯示裝置之製造方法 |
| TWI575293B (zh) | 2007-07-20 | 2017-03-21 | 半導體能源研究所股份有限公司 | 液晶顯示裝置 |
| JP2009049384A (ja) | 2007-07-20 | 2009-03-05 | Semiconductor Energy Lab Co Ltd | 発光装置 |
| US7897971B2 (en) * | 2007-07-26 | 2011-03-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| US8330887B2 (en) | 2007-07-27 | 2012-12-11 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device |
| US8101444B2 (en) | 2007-08-17 | 2012-01-24 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| KR101484297B1 (ko) * | 2007-08-31 | 2015-01-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 및 표시장치의 제작방법 |
| JP5395384B2 (ja) * | 2007-09-07 | 2014-01-22 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタの作製方法 |
| JP5371341B2 (ja) * | 2007-09-21 | 2013-12-18 | 株式会社半導体エネルギー研究所 | 電気泳動方式の表示装置 |
| US8030655B2 (en) | 2007-12-03 | 2011-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor, display device having thin film transistor |
| KR101446249B1 (ko) | 2007-12-03 | 2014-10-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 제조방법 |
| TWI521712B (zh) * | 2007-12-03 | 2016-02-11 | 半導體能源研究所股份有限公司 | 薄膜電晶體,包括該薄膜電晶體的顯示裝置,和其製造方法 |
| JP5527966B2 (ja) | 2007-12-28 | 2014-06-25 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタ |
| US8314765B2 (en) * | 2008-06-17 | 2012-11-20 | Semiconductor Energy Laboratory Co., Ltd. | Driver circuit, display device, and electronic device |
| JP5627071B2 (ja) | 2008-09-01 | 2014-11-19 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| KR101999970B1 (ko) | 2008-09-19 | 2019-07-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP5361651B2 (ja) | 2008-10-22 | 2013-12-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN102246310B (zh) * | 2008-12-11 | 2013-11-06 | 株式会社半导体能源研究所 | 薄膜晶体管及显示装置 |
| JP5590868B2 (ja) * | 2008-12-11 | 2014-09-17 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR20100067612A (ko) | 2008-12-11 | 2010-06-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박막 트랜지스터 및 표시 장치 |
| JP4737309B2 (ja) | 2009-02-26 | 2011-07-27 | 株式会社デンソー | 放電灯ユニット |
| WO2011010542A1 (en) * | 2009-07-23 | 2011-01-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| WO2011027656A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and display device |
| KR101730347B1 (ko) * | 2009-09-16 | 2017-04-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| WO2011048925A1 (en) | 2009-10-21 | 2011-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| WO2011052437A1 (en) | 2009-10-30 | 2011-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Non-linear element, display device including non-linear element, and electronic device including display device |
| TWI535028B (zh) * | 2009-12-21 | 2016-05-21 | 半導體能源研究所股份有限公司 | 薄膜電晶體 |
| KR101836067B1 (ko) * | 2009-12-21 | 2018-03-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박막 트랜지스터와 그 제작 방법 |
| US8476744B2 (en) | 2009-12-28 | 2013-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor with channel including microcrystalline and amorphous semiconductor regions |
| KR20120120458A (ko) | 2010-02-26 | 2012-11-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 액정 표시 장치 |
| US8624239B2 (en) * | 2010-05-20 | 2014-01-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8704230B2 (en) | 2010-08-26 | 2014-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9230826B2 (en) | 2010-08-26 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Etching method using mixed gas and method for manufacturing semiconductor device |
| KR101720533B1 (ko) * | 2010-08-31 | 2017-04-03 | 삼성디스플레이 주식회사 | 다결정 실리콘층의 제조 방법, 상기 다결정 실리콘층 제조 방법을 포함하는 박막 트랜지스터의 제조 방법, 상기 방법에 의해 제조된 박막 트랜지스터, 및 상기 박막 트랜지스터를 포함하는 유기 발광 디스플레이 장치 |
| US9178071B2 (en) | 2010-09-13 | 2015-11-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US8629445B2 (en) | 2011-02-21 | 2014-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, and electronic appliance |
| JP2012182385A (ja) * | 2011-03-02 | 2012-09-20 | Japan Display East Co Ltd | 表示装置及び表示装置の製造方法 |
| US8772752B2 (en) | 2011-05-24 | 2014-07-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US9660092B2 (en) | 2011-08-31 | 2017-05-23 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor thin film transistor including oxygen release layer |
| KR101949225B1 (ko) | 2012-04-16 | 2019-04-26 | 삼성디스플레이 주식회사 | 박막 트랜지스터 및 이를 포함하는 표시 장치 |
| JP2015115469A (ja) * | 2013-12-12 | 2015-06-22 | ソニー株式会社 | 薄膜トランジスタ、表示装置、電子機器、および薄膜トランジスタの製造方法 |
| KR102270036B1 (ko) * | 2015-01-02 | 2021-06-28 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
| JP2018182305A (ja) * | 2017-04-17 | 2018-11-15 | Jsr株式会社 | 薄膜トランジスタ基板、液晶表示素子、有機el素子、感放射線性樹脂組成物および薄膜トランジスタ基板の製造方法 |
| WO2020217396A1 (ja) * | 2019-04-25 | 2020-10-29 | 株式会社ソシオネクスト | 半導体装置 |
| KR20230085264A (ko) * | 2021-12-06 | 2023-06-14 | 삼성디스플레이 주식회사 | 박막 트랜지스터 및 그 제조 방법 |
| GB202217962D0 (en) * | 2022-11-29 | 2023-01-11 | Pragmatic Semiconductor Ltd | Electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0645354A (ja) * | 1991-06-19 | 1994-02-18 | Semiconductor Energy Lab Co Ltd | 薄膜トランジスタ及びその作製方法 |
| KR20050109086A (ko) * | 2004-05-13 | 2005-11-17 | 엘지.필립스 엘시디 주식회사 | 박막트랜지스터 및 그 제조방법 |
| JP2007035964A (ja) * | 2005-07-27 | 2007-02-08 | Sony Corp | 薄膜トランジスタとその製造方法、及び表示装置 |
| KR20070023103A (ko) * | 2005-08-23 | 2007-02-28 | 삼성전자주식회사 | 포토레지스트 조성물 및 이를 이용한 박막 트랜지스터기판의 제조방법 |
Family Cites Families (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122123A (en) | 1980-03-03 | 1981-09-25 | Shunpei Yamazaki | Semiamorphous semiconductor |
| JPS6098680A (ja) | 1983-11-04 | 1985-06-01 | Seiko Instr & Electronics Ltd | 電界効果型薄膜トランジスタ |
| JPS6187371A (ja) | 1984-10-05 | 1986-05-02 | Hitachi Ltd | 薄膜半導体装置 |
| JPS61138285A (ja) | 1984-12-10 | 1986-06-25 | ホシデン株式会社 | 液晶表示素子 |
| JPH01309378A (ja) | 1988-06-07 | 1989-12-13 | Sumitomo Metal Ind Ltd | 薄膜半導体素子 |
| US5084777A (en) | 1989-11-14 | 1992-01-28 | Greyhawk Systems, Inc. | Light addressed liquid crystal light valve incorporating electrically insulating light blocking material of a-SiGe:H |
| EP0473988A1 (en) | 1990-08-29 | 1992-03-11 | International Business Machines Corporation | Method of fabricating a thin film transistor having amorphous/polycrystalline semiconductor channel region |
| US5849601A (en) | 1990-12-25 | 1998-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
| US7115902B1 (en) | 1990-11-20 | 2006-10-03 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
| JP2791422B2 (ja) | 1990-12-25 | 1998-08-27 | 株式会社 半導体エネルギー研究所 | 電気光学装置およびその作製方法 |
| US7098479B1 (en) | 1990-12-25 | 2006-08-29 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
| US7576360B2 (en) | 1990-12-25 | 2009-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device which comprises thin film transistors and method for manufacturing the same |
| EP0499979A3 (en) | 1991-02-16 | 1993-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device |
| JPH05175503A (ja) | 1991-10-23 | 1993-07-13 | Kyocera Corp | 薄膜トランジスタおよびその製造方法 |
| TW222345B (en) | 1992-02-25 | 1994-04-11 | Semicondustor Energy Res Co Ltd | Semiconductor and its manufacturing method |
| TW303526B (enExample) | 1994-12-27 | 1997-04-21 | Matsushita Electric Industrial Co Ltd | |
| JPH08195492A (ja) | 1995-01-13 | 1996-07-30 | Matsushita Electric Ind Co Ltd | 多結晶薄膜の形成方法および薄膜トランジスタの製造方法 |
| JP2661594B2 (ja) | 1995-05-25 | 1997-10-08 | 日本電気株式会社 | 薄膜トランジスタおよびその製造方法 |
| JPH1116835A (ja) * | 1997-06-25 | 1999-01-22 | Matsushita Electric Ind Co Ltd | 多結晶シリコン薄膜及び薄膜トランジスタの製造方法 |
| KR100257158B1 (ko) | 1997-06-30 | 2000-05-15 | 김영환 | 박막 트랜지스터 및 그의 제조 방법 |
| JP2001077366A (ja) | 1999-08-20 | 2001-03-23 | Internatl Business Mach Corp <Ibm> | 薄膜トランジスタ、液晶表示装置、及び薄膜トランジスタの製造方法 |
| JP3538088B2 (ja) | 1999-10-25 | 2004-06-14 | Nec液晶テクノロジー株式会社 | 薄膜トランジスタおよびその製造方法 |
| JP2001311963A (ja) | 2000-04-27 | 2001-11-09 | Toshiba Corp | 液晶表示装置および液晶表示装置の製造方法 |
| JP2002246605A (ja) | 2001-02-20 | 2002-08-30 | Matsushita Electric Ind Co Ltd | 液晶表示用薄膜トランジスタの製造方法 |
| TW541584B (en) * | 2001-06-01 | 2003-07-11 | Semiconductor Energy Lab | Semiconductor film, semiconductor device and method for manufacturing same |
| JP5072157B2 (ja) * | 2001-09-27 | 2012-11-14 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4004835B2 (ja) | 2002-04-02 | 2007-11-07 | 株式会社アドバンスト・ディスプレイ | 薄膜トランジスタアレイ基板の製造方法 |
| TW577176B (en) | 2003-03-31 | 2004-02-21 | Ind Tech Res Inst | Structure of thin-film transistor, and the manufacturing method thereof |
| JP4748954B2 (ja) | 2003-07-14 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
| TWI368774B (en) | 2003-07-14 | 2012-07-21 | Semiconductor Energy Lab | Light-emitting device |
| JP4393812B2 (ja) | 2003-07-18 | 2010-01-06 | 株式会社半導体エネルギー研究所 | 表示装置及び電子機器 |
| JP2005167051A (ja) | 2003-12-04 | 2005-06-23 | Sony Corp | 薄膜トランジスタおよび薄膜トランジスタの製造方法 |
| JP2005322845A (ja) | 2004-05-11 | 2005-11-17 | Sekisui Chem Co Ltd | 半導体デバイスと、その製造装置、および製造方法 |
| JP4577114B2 (ja) | 2005-06-23 | 2010-11-10 | ソニー株式会社 | 薄膜トランジスタの製造方法および表示装置の製造方法 |
| US8212953B2 (en) | 2005-12-26 | 2012-07-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US8022466B2 (en) | 2006-10-27 | 2011-09-20 | Macronix International Co., Ltd. | Non-volatile memory cells having a polysilicon-containing, multi-layer insulating structure, memory arrays including the same and methods of operating the same |
| JP4420032B2 (ja) * | 2007-01-31 | 2010-02-24 | ソニー株式会社 | 薄膜半導体装置の製造方法 |
| JP5364293B2 (ja) | 2007-06-01 | 2013-12-11 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法およびプラズマcvd装置 |
| JP5331389B2 (ja) | 2007-06-15 | 2013-10-30 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| US9176353B2 (en) | 2007-06-29 | 2015-11-03 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device |
| US8334537B2 (en) | 2007-07-06 | 2012-12-18 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device |
| US7738050B2 (en) | 2007-07-06 | 2010-06-15 | Semiconductor Energy Laboratory Co., Ltd | Liquid crystal display device |
| US7998800B2 (en) | 2007-07-06 | 2011-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| TWI456663B (zh) | 2007-07-20 | 2014-10-11 | Semiconductor Energy Lab | 顯示裝置之製造方法 |
| TWI575293B (zh) | 2007-07-20 | 2017-03-21 | 半導體能源研究所股份有限公司 | 液晶顯示裝置 |
| JP2009049384A (ja) | 2007-07-20 | 2009-03-05 | Semiconductor Energy Lab Co Ltd | 発光装置 |
| US7897971B2 (en) | 2007-07-26 | 2011-03-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| US20090278121A1 (en) * | 2008-05-08 | 2009-11-12 | Tpo Displays Corp. | System for displaying images and fabrication method thereof |
-
2008
- 2008-06-24 US US12/213,733 patent/US8921858B2/en not_active Expired - Fee Related
- 2008-06-25 TW TW097123744A patent/TWI466299B/zh not_active IP Right Cessation
- 2008-06-27 JP JP2008168648A patent/JP5542269B2/ja not_active Expired - Fee Related
- 2008-06-27 KR KR1020080061671A patent/KR101458771B1/ko active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0645354A (ja) * | 1991-06-19 | 1994-02-18 | Semiconductor Energy Lab Co Ltd | 薄膜トランジスタ及びその作製方法 |
| KR20050109086A (ko) * | 2004-05-13 | 2005-11-17 | 엘지.필립스 엘시디 주식회사 | 박막트랜지스터 및 그 제조방법 |
| JP2007035964A (ja) * | 2005-07-27 | 2007-02-08 | Sony Corp | 薄膜トランジスタとその製造方法、及び表示装置 |
| KR20070023103A (ko) * | 2005-08-23 | 2007-02-28 | 삼성전자주식회사 | 포토레지스트 조성물 및 이를 이용한 박막 트랜지스터기판의 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI466299B (zh) | 2014-12-21 |
| US8921858B2 (en) | 2014-12-30 |
| KR20090004587A (ko) | 2009-01-12 |
| US20090001375A1 (en) | 2009-01-01 |
| TW200917489A (en) | 2009-04-16 |
| JP2009044133A (ja) | 2009-02-26 |
| JP5542269B2 (ja) | 2014-07-09 |
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