KR101442523B1 - 반도체 장치, 및 그 제작 방법 - Google Patents
반도체 장치, 및 그 제작 방법 Download PDFInfo
- Publication number
- KR101442523B1 KR101442523B1 KR1020080050003A KR20080050003A KR101442523B1 KR 101442523 B1 KR101442523 B1 KR 101442523B1 KR 1020080050003 A KR1020080050003 A KR 1020080050003A KR 20080050003 A KR20080050003 A KR 20080050003A KR 101442523 B1 KR101442523 B1 KR 101442523B1
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- South Korea
- Prior art keywords
- film
- layer
- substrate
- semiconductor
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- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0214—Manufacture or treatment of multiple TFTs using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/125—Active-matrix OLED [AMOLED] displays including organic TFTs [OTFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007144360 | 2007-05-31 | ||
| JPJP-P-2007-00144360 | 2007-05-31 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140062292A Division KR101442522B1 (ko) | 2007-05-31 | 2014-05-23 | 반도체 장치, 및 그 제작 방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080106048A KR20080106048A (ko) | 2008-12-04 |
| KR101442523B1 true KR101442523B1 (ko) | 2014-09-22 |
Family
ID=40325087
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020080050003A Expired - Fee Related KR101442523B1 (ko) | 2007-05-31 | 2008-05-29 | 반도체 장치, 및 그 제작 방법 |
| KR1020140062292A Active KR101442522B1 (ko) | 2007-05-31 | 2014-05-23 | 반도체 장치, 및 그 제작 방법 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140062292A Active KR101442522B1 (ko) | 2007-05-31 | 2014-05-23 | 반도체 장치, 및 그 제작 방법 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US7897482B2 (enExample) |
| JP (2) | JP5305737B2 (enExample) |
| KR (2) | KR101442523B1 (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7897482B2 (en) * | 2007-05-31 | 2011-03-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| EP2202802B1 (en) * | 2008-12-24 | 2012-09-26 | Semiconductor Energy Laboratory Co., Ltd. | Driver circuit and semiconductor device |
| KR101613865B1 (ko) * | 2009-03-26 | 2016-04-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 그 제작 방법 |
| US9647239B2 (en) | 2009-05-08 | 2017-05-09 | Koninklijke Philips N.V. | Electroluminescent device |
| KR101097311B1 (ko) * | 2009-06-24 | 2011-12-21 | 삼성모바일디스플레이주식회사 | 유기 발광 디스플레이 장치 및 이를 제조하기 위한 유기막 증착 장치 |
| KR101069679B1 (ko) | 2009-06-26 | 2011-10-04 | 주식회사 하이닉스반도체 | 상변화 메모리 장치 및 그 제조방법 |
| US20110169641A1 (en) * | 2010-01-14 | 2011-07-14 | Rfmarq, Inc. | System and Method To Embed A Wireless Communication Device Into Semiconductor Packages |
| WO2011108382A1 (en) * | 2010-03-05 | 2011-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP5771968B2 (ja) * | 2010-04-09 | 2015-09-02 | 住友電気工業株式会社 | 半導体デバイスの製造方法、エピ成長用積層支持基板およびデバイス用積層支持基板 |
| JPWO2011142088A1 (ja) * | 2010-05-14 | 2013-07-22 | パナソニック株式会社 | フレキシブル半導体装置およびその製造方法ならびに画像表示装置 |
| WO2012038876A1 (en) | 2010-09-22 | 2012-03-29 | Koninklijke Philips Electronics N.V. | Multi-view display device |
| TWI527207B (zh) | 2011-10-21 | 2016-03-21 | 友達光電股份有限公司 | 可撓式有機發光裝置及其製作方法 |
| JP2013251255A (ja) * | 2012-05-04 | 2013-12-12 | Semiconductor Energy Lab Co Ltd | 発光装置の作製方法 |
| KR102039685B1 (ko) * | 2013-04-17 | 2019-11-04 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| JP6280109B2 (ja) | 2013-05-24 | 2018-02-21 | パナソニック株式会社 | 封止膜、有機elデバイス、可撓性基板、および、封止膜の製造方法 |
| US9981457B2 (en) * | 2013-09-18 | 2018-05-29 | Semiconductor Emergy Laboratory Co., Ltd. | Manufacturing apparatus of stack |
| JP6327437B2 (ja) * | 2014-01-10 | 2018-05-23 | 日本電気硝子株式会社 | 電子デバイスの製造方法 |
| KR102292148B1 (ko) * | 2014-03-13 | 2021-08-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치의 제작 방법, 및 전자 기기의 제작 방법 |
| TWI832717B (zh) | 2014-04-25 | 2024-02-11 | 日商半導體能源研究所股份有限公司 | 顯示裝置及電子裝置 |
| JP6636736B2 (ja) | 2014-07-18 | 2020-01-29 | 株式会社半導体エネルギー研究所 | 回路基板の作製方法、発光装置の作製方法、電子機器の作製方法、及び発光装置 |
| DE102014110268B4 (de) * | 2014-07-22 | 2017-11-02 | Osram Oled Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements |
| JP2016066775A (ja) | 2014-09-18 | 2016-04-28 | マイクロン テクノロジー, インク. | 半導体装置及びその製造方法 |
| TWI696108B (zh) | 2015-02-13 | 2020-06-11 | 日商半導體能源研究所股份有限公司 | 功能面板、功能模組、發光模組、顯示模組、位置資料輸入模組、發光裝置、照明設備、顯示裝置、資料處理裝置、功能面板的製造方法 |
| US20160351648A1 (en) * | 2015-05-27 | 2016-12-01 | Sony Mobile Communications Inc. | Dual display technologies display |
| US9496165B1 (en) | 2015-07-09 | 2016-11-15 | International Business Machines Corporation | Method of forming a flexible semiconductor layer and devices on a flexible carrier |
| US10135034B1 (en) * | 2016-03-04 | 2018-11-20 | Apple Inc. | Display device with pixel-integrated black matrix and elliptical polarizer |
| US10522574B2 (en) | 2016-05-16 | 2019-12-31 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of display device and manufacturing method of electronic device |
| CN108878650B (zh) | 2017-05-10 | 2021-12-03 | 元太科技工业股份有限公司 | 有机薄膜晶体管 |
| WO2019049235A1 (ja) * | 2017-09-06 | 2019-03-14 | シャープ株式会社 | 表示デバイスの製造方法及び表示デバイスの製造装置 |
| US10879195B2 (en) * | 2018-02-15 | 2020-12-29 | Micron Technology, Inc. | Method for substrate moisture NCF voiding elimination |
| CN108767127A (zh) * | 2018-05-28 | 2018-11-06 | 武汉华星光电半导体显示技术有限公司 | 一种显示面板的制作方法、显示面板及显示装置 |
| JP6753450B2 (ja) * | 2018-11-12 | 2020-09-09 | セイコーエプソン株式会社 | 電気光学装置用基板、電気光学装置、電子機器 |
| JP7559563B2 (ja) * | 2020-01-28 | 2024-10-02 | 東レ株式会社 | 無線通信デバイス、およびその製造方法 |
| KR102798047B1 (ko) * | 2020-12-04 | 2025-04-22 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
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| JP2006121059A (ja) | 2004-09-24 | 2006-05-11 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
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| CN101663762B (zh) | 2007-04-25 | 2011-09-21 | 佳能株式会社 | 氧氮化物半导体 |
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-
2008
- 2008-05-19 US US12/122,911 patent/US7897482B2/en not_active Expired - Fee Related
- 2008-05-27 JP JP2008137405A patent/JP5305737B2/ja active Active
- 2008-05-29 KR KR1020080050003A patent/KR101442523B1/ko not_active Expired - Fee Related
-
2010
- 2010-12-28 US US12/979,427 patent/US8487342B2/en active Active
-
2013
- 2013-06-25 JP JP2013132333A patent/JP5745723B2/ja not_active Expired - Fee Related
-
2014
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| JP3701549B2 (ja) * | 1991-08-26 | 2005-09-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20140068841A (ko) | 2014-06-09 |
| US7897482B2 (en) | 2011-03-01 |
| JP5305737B2 (ja) | 2013-10-02 |
| KR101442522B1 (ko) | 2014-09-26 |
| KR20080106048A (ko) | 2008-12-04 |
| JP2009010356A (ja) | 2009-01-15 |
| US20110101363A1 (en) | 2011-05-05 |
| US20090114915A1 (en) | 2009-05-07 |
| US8487342B2 (en) | 2013-07-16 |
| JP5745723B2 (ja) | 2015-07-08 |
| JP2013236093A (ja) | 2013-11-21 |
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| KR101514627B1 (ko) | 반도체 장치의 제작 방법 | |
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