KR101441532B1 - 연속 도금 장치 - Google Patents

연속 도금 장치 Download PDF

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Publication number
KR101441532B1
KR101441532B1 KR1020120049803A KR20120049803A KR101441532B1 KR 101441532 B1 KR101441532 B1 KR 101441532B1 KR 1020120049803 A KR1020120049803 A KR 1020120049803A KR 20120049803 A KR20120049803 A KR 20120049803A KR 101441532 B1 KR101441532 B1 KR 101441532B1
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KR
South Korea
Prior art keywords
roller
plated
negative electrode
frame
plating
Prior art date
Application number
KR1020120049803A
Other languages
English (en)
Korean (ko)
Other versions
KR20130126050A (ko
Inventor
정광춘
유명봉
한영구
온웅구
Original Assignee
주식회사 잉크테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 잉크테크 filed Critical 주식회사 잉크테크
Priority to KR1020120049803A priority Critical patent/KR101441532B1/ko
Priority to CN201380023789.6A priority patent/CN104271814B/zh
Priority to PCT/KR2013/004051 priority patent/WO2013169015A1/ko
Priority to TW102116734A priority patent/TWI486489B/zh
Publication of KR20130126050A publication Critical patent/KR20130126050A/ko
Application granted granted Critical
Publication of KR101441532B1 publication Critical patent/KR101441532B1/ko

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0628In vertical cells
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02Tanks; Installations therefor
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0642Anodes
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0657Conducting rolls
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0685Spraying of electrolyte

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020120049803A 2012-05-10 2012-05-10 연속 도금 장치 KR101441532B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020120049803A KR101441532B1 (ko) 2012-05-10 2012-05-10 연속 도금 장치
CN201380023789.6A CN104271814B (zh) 2012-05-10 2013-05-09 连续电镀装置
PCT/KR2013/004051 WO2013169015A1 (ko) 2012-05-10 2013-05-09 연속 도금 장치
TW102116734A TWI486489B (zh) 2012-05-10 2013-05-10 連續電鍍裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120049803A KR101441532B1 (ko) 2012-05-10 2012-05-10 연속 도금 장치

Publications (2)

Publication Number Publication Date
KR20130126050A KR20130126050A (ko) 2013-11-20
KR101441532B1 true KR101441532B1 (ko) 2014-09-17

Family

ID=49550979

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120049803A KR101441532B1 (ko) 2012-05-10 2012-05-10 연속 도금 장치

Country Status (4)

Country Link
KR (1) KR101441532B1 (zh)
CN (1) CN104271814B (zh)
TW (1) TWI486489B (zh)
WO (1) WO2013169015A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140094061A (ko) * 2013-01-16 2014-07-30 주식회사 잉크테크 연속 도금 장치 및 연속 도금 방법
KR101594840B1 (ko) * 2013-11-22 2016-02-26 한국생산기술연구원 초전도선재 두께 균일도가 개선된 초전도선재의 제조방법과 전기 도금 방법 및 그 방법에 이용되는 초전도선재 전기 도금 장치.
KR101575068B1 (ko) * 2014-09-16 2015-12-07 주식회사 호진플라텍 광유도 도금 및 순방향 바이어스 도금을 병행하는 태양전지 기판용 도금장치
KR101593887B1 (ko) * 2015-10-23 2016-02-12 선호경 Pcb 도금액 분사장치
CN107761144A (zh) * 2017-11-03 2018-03-06 宁波康强电子股份有限公司 一种带杯led引线框架的连续电镀装置
KR101993769B1 (ko) * 2019-01-21 2019-07-01 주식회사 태성 롤투롤 공정의 인쇄회로기판 수평 도금라인에서 캐소드롤러의 역 도금 방지 장치
KR102288006B1 (ko) * 2020-02-07 2021-08-09 주식회사 포스코 수평셀 전기도금라인의 프리웨팅장치
KR102363541B1 (ko) * 2021-08-23 2022-02-16 (주)아이케이텍 연속 표면처리 도금 라인용 상하행 위치조절 제어 장치
KR102387315B1 (ko) * 2021-10-01 2022-04-15 (주)태성이에스 상하이동되는 도금용 지그 장치
CN114808090B (zh) * 2022-06-10 2023-06-27 江西勇骏实业有限公司 一种用电设备生产用铜板带双镀机组镀锡设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06212492A (ja) * 1993-01-12 1994-08-02 Nkk Corp 連続電気めっき装置
US5658441A (en) 1995-12-18 1997-08-19 Cfc, Inc. Conveyorized spray plating machine
KR20080079963A (ko) * 2007-02-28 2008-09-02 삼성테크윈 주식회사 연속 도금장치

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU525633B2 (en) * 1980-03-07 1982-11-18 Nippon Steel Corporation Metal strip treated by moving electrolyte
JPS6096797A (ja) * 1983-10-31 1985-05-30 Nippon Steel Corp 電気メツキ通電ロ−ルへのメツキ金属付着防止方法
FR2653787B1 (fr) * 1989-10-27 1992-02-14 Lorraine Laminage Installation et procede de revetement electrolytique d'une bande metallique.
JPH06228791A (ja) * 1992-12-07 1994-08-16 Ebara Yuujiraito Kk 電気めっき装置
US5510171A (en) * 1995-01-19 1996-04-23 Minnesota Mining And Manufacturing Company Durable security laminate with hologram
JPH10183391A (ja) * 1996-12-19 1998-07-14 Dainippon Printing Co Ltd メッキ方法および装置
IT1298150B1 (it) * 1998-01-19 1999-12-20 Occleppo Di Francesco Occleppo Dispositivo per la deposizione elettrolitica su lastre metalliche traslanti in specie per circuiti stampati, mediante la chiusura di un
JP4156086B2 (ja) * 1998-08-07 2008-09-24 大日本印刷株式会社 電着処理装置
US6589413B2 (en) * 2001-08-09 2003-07-08 Gould Electronics Inc. Method of making a copper on INVAR® composite
CN1788324A (zh) * 2003-05-12 2006-06-14 日本油漆株式会社 方形导线的涂布方法和方形导线的绝缘导线
JP2005029820A (ja) * 2003-07-09 2005-02-03 Toshiba Corp めっき方法、半導体装置の製造方法、及びめっき装置
JP4586423B2 (ja) * 2004-02-27 2010-11-24 Jfeスチール株式会社 電気めっき鋼板の製造方法
KR100647805B1 (ko) * 2005-05-06 2006-11-23 (주) 에스엠씨 음극롤러를 이용한 수평식 연속도금장치
JP4694282B2 (ja) * 2005-06-23 2011-06-08 富士フイルム株式会社 めっき被膜付きフィルムの製造装置及び方法
KR100748793B1 (ko) * 2006-01-25 2007-08-13 엘에스전선 주식회사 고속 도금 장치 및 고속 도금 방법
KR100748791B1 (ko) * 2006-01-25 2007-08-13 엘에스전선 주식회사 수직 도금 장치 및 도금 방법
KR100776180B1 (ko) * 2006-08-07 2007-11-16 주식회사 잉크테크 금속적층판의 제조방법
KR100842043B1 (ko) * 2006-12-15 2008-06-30 엘지전자 주식회사 유-무기 하이브리드 전도성 초극박 필름 제조시스템
KR101087077B1 (ko) * 2008-12-09 2011-11-25 삼일금속주식회사 바렐 도금 장치
CN101985767A (zh) * 2010-11-29 2011-03-16 奥特斯维能源(太仓)有限公司 一种可实现不同沉积速率的电镀槽
CN102220621B (zh) * 2011-06-08 2013-04-17 太原西科纳米技术有限公司 一种连续在碳纤维表面进行碳化硅涂层的方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06212492A (ja) * 1993-01-12 1994-08-02 Nkk Corp 連続電気めっき装置
US5658441A (en) 1995-12-18 1997-08-19 Cfc, Inc. Conveyorized spray plating machine
KR20080079963A (ko) * 2007-02-28 2008-09-02 삼성테크윈 주식회사 연속 도금장치

Also Published As

Publication number Publication date
CN104271814A (zh) 2015-01-07
CN104271814B (zh) 2016-12-14
KR20130126050A (ko) 2013-11-20
WO2013169015A1 (ko) 2013-11-14
TWI486489B (zh) 2015-06-01
TW201404947A (zh) 2014-02-01

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