KR101435092B1 - 광전기 혼재 기판 - Google Patents

광전기 혼재 기판 Download PDF

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Publication number
KR101435092B1
KR101435092B1 KR1020080041172A KR20080041172A KR101435092B1 KR 101435092 B1 KR101435092 B1 KR 101435092B1 KR 1020080041172 A KR1020080041172 A KR 1020080041172A KR 20080041172 A KR20080041172 A KR 20080041172A KR 101435092 B1 KR101435092 B1 KR 101435092B1
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KR
South Korea
Prior art keywords
wiring
coating layer
pad
optical waveguide
vias
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KR1020080041172A
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English (en)
Korean (ko)
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KR20080100767A (ko
Inventor
다카노리 야마모토
겐지 야나기사와
Original Assignee
신꼬오덴기 고교 가부시키가이샤
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Structure Of Printed Boards (AREA)
  • Semiconductor Lasers (AREA)
KR1020080041172A 2007-05-14 2008-05-02 광전기 혼재 기판 Active KR101435092B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007127906A JP5155596B2 (ja) 2007-05-14 2007-05-14 光電気混載基板の製造方法
JPJP-P-2007-00127906 2007-05-14

Publications (2)

Publication Number Publication Date
KR20080100767A KR20080100767A (ko) 2008-11-19
KR101435092B1 true KR101435092B1 (ko) 2014-08-27

Family

ID=40027570

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080041172A Active KR101435092B1 (ko) 2007-05-14 2008-05-02 광전기 혼재 기판

Country Status (4)

Country Link
US (1) US7596289B2 (enExample)
JP (1) JP5155596B2 (enExample)
KR (1) KR101435092B1 (enExample)
TW (1) TWI426307B (enExample)

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JP2010139562A (ja) * 2008-12-09 2010-06-24 Shinko Electric Ind Co Ltd 光導波路、光導波路搭載基板及び光送受信装置
TWI406020B (zh) * 2009-01-13 2013-08-21 Mutual Tek Ind Co Ltd 光電混合線路板及其製造方法
JP5461897B2 (ja) * 2009-06-19 2014-04-02 新光電気工業株式会社 光導波路積層配線基板及びその製造方法と実装構造
KR101079867B1 (ko) * 2009-11-13 2011-11-04 삼성전기주식회사 광기판 및 그 제조방법
CN102556889B (zh) * 2011-12-11 2014-04-02 富泰华精密电子（郑州）有限公司 连杆升降机构
JP2013186310A (ja) * 2012-03-08 2013-09-19 Shinko Electric Ind Co Ltd 光電気複合基板及びその製造方法
JP6137777B2 (ja) * 2012-04-17 2017-05-31 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 半導体上の発光素子または受光素子と光導波路との間の光の接続損失を低減させることに役立つ、スペーサ樹脂パターンの設計
JP6080155B2 (ja) * 2012-11-08 2017-02-15 日東電工株式会社 光電気混載基板
JP6474060B2 (ja) * 2013-10-31 2019-02-27 日東電工株式会社 光電気混載基板
WO2015161488A1 (zh) * 2014-04-24 2015-10-29 华为技术有限公司 单模垂直腔面发射激光器收发模块及光信号传播方法
EP2993462B1 (en) * 2014-08-12 2019-05-22 Personal Genomics Inc. Optical sensor comprising a waveguide
JP6469469B2 (ja) * 2015-02-06 2019-02-13 富士通コンポーネント株式会社 光導波路モジュール
US9899355B2 (en) * 2015-09-30 2018-02-20 Taiwan Semiconductor Manufacturing Co., Ltd. Three-dimensional integrated circuit structure
US9721812B2 (en) * 2015-11-20 2017-08-01 International Business Machines Corporation Optical device with precoated underfill
US10209466B2 (en) * 2016-04-02 2019-02-19 Intel IP Corporation Integrated circuit packages including an optical redistribution layer
JP6637368B2 (ja) * 2016-04-06 2020-01-29 新光電気工業株式会社 光導波路装置及びその製造方法
US10168495B1 (en) * 2017-06-28 2019-01-01 Kyocera Corporation Optical waveguide and optical circuit board
JP7118731B2 (ja) * 2018-05-18 2022-08-16 新光電気工業株式会社 光導波路搭載基板、光送受信装置
JP7280031B2 (ja) * 2018-11-14 2023-05-23 新光電気工業株式会社 光導波路搭載基板、光通信装置及び光導波路搭載基板の製造方法
JP7489820B2 (ja) * 2020-04-27 2024-05-24 新光電気工業株式会社 光導波路基板及び光導波路製造方法
US20230341639A1 (en) * 2020-09-30 2023-10-26 Nitto Denko Corporation Opto-electric hybrid board, optical-element-mounted opto-electric hybrid board, and method of manufacturing optical-element-mounted opto-electric hybrid board
WO2024262042A1 (ja) * 2023-06-23 2024-12-26 株式会社レゾナック 光電複合配線板の製造方法、光電複合配線板、半導体パッケージ及び積層フィルム

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KR20020016807A (ko) * 1999-05-28 2002-03-06 후지다 히로미찌 광·전기배선기판, 실장기판 및 광·전기배선기판의제조방법
JP2002277694A (ja) * 2001-03-19 2002-09-25 Mitsubishi Electric Corp 光導波路および電気回路を有する基板およびその製造方法
JP2004146602A (ja) * 2002-10-24 2004-05-20 Sony Corp 光・電気配線混載ハイブリッド回路基板及びその製造方法並びに光・電気配線混載ハイブリット回路モジュール及びその製造方法
JP2006171641A (ja) * 2004-12-20 2006-06-29 Sony Corp 光導波シートのミラー面形成用の加工ヘッド、加工装置および光導波シートのミラー面の形成方法

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KR20020016807A (ko) * 1999-05-28 2002-03-06 후지다 히로미찌 광·전기배선기판, 실장기판 및 광·전기배선기판의제조방법
JP2002277694A (ja) * 2001-03-19 2002-09-25 Mitsubishi Electric Corp 光導波路および電気回路を有する基板およびその製造方法
JP2004146602A (ja) * 2002-10-24 2004-05-20 Sony Corp 光・電気配線混載ハイブリッド回路基板及びその製造方法並びに光・電気配線混載ハイブリット回路モジュール及びその製造方法
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Also Published As

Publication number Publication date
KR20080100767A (ko) 2008-11-19
US20080285911A1 (en) 2008-11-20
JP2008281923A (ja) 2008-11-20
US7596289B2 (en) 2009-09-29
JP5155596B2 (ja) 2013-03-06
TW200848816A (en) 2008-12-16
TWI426307B (zh) 2014-02-11

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