KR101427445B1 - 유기 절연막용 감광성 수지 조성물 - Google Patents

유기 절연막용 감광성 수지 조성물 Download PDF

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Publication number
KR101427445B1
KR101427445B1 KR20100095636A KR20100095636A KR101427445B1 KR 101427445 B1 KR101427445 B1 KR 101427445B1 KR 20100095636 A KR20100095636 A KR 20100095636A KR 20100095636 A KR20100095636 A KR 20100095636A KR 101427445 B1 KR101427445 B1 KR 101427445B1
Authority
KR
South Korea
Prior art keywords
resin composition
insulating film
photosensitive resin
organic insulating
carboxylic acid
Prior art date
Application number
KR20100095636A
Other languages
English (en)
Korean (ko)
Other versions
KR20120033895A (ko
Inventor
이윤재
강충석
양필례
윤경근
Original Assignee
코오롱인더스트리 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코오롱인더스트리 주식회사 filed Critical 코오롱인더스트리 주식회사
Priority to KR20100095636A priority Critical patent/KR101427445B1/ko
Priority to TW100135062A priority patent/TWI557502B/zh
Priority to PCT/KR2011/007156 priority patent/WO2012044070A2/en
Priority to JP2013531489A priority patent/JP5699219B2/ja
Publication of KR20120033895A publication Critical patent/KR20120033895A/ko
Application granted granted Critical
Publication of KR101427445B1 publication Critical patent/KR101427445B1/ko

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR20100095636A 2010-09-30 2010-09-30 유기 절연막용 감광성 수지 조성물 KR101427445B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR20100095636A KR101427445B1 (ko) 2010-09-30 2010-09-30 유기 절연막용 감광성 수지 조성물
TW100135062A TWI557502B (zh) 2010-09-30 2011-09-28 用於有機絕緣體的感光性樹脂組成物
PCT/KR2011/007156 WO2012044070A2 (en) 2010-09-30 2011-09-28 Photosensitive resin composition for organic insulator
JP2013531489A JP5699219B2 (ja) 2010-09-30 2011-09-28 有機絶縁膜用感光性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20100095636A KR101427445B1 (ko) 2010-09-30 2010-09-30 유기 절연막용 감광성 수지 조성물

Publications (2)

Publication Number Publication Date
KR20120033895A KR20120033895A (ko) 2012-04-09
KR101427445B1 true KR101427445B1 (ko) 2014-08-11

Family

ID=45893658

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20100095636A KR101427445B1 (ko) 2010-09-30 2010-09-30 유기 절연막용 감광성 수지 조성물

Country Status (4)

Country Link
JP (1) JP5699219B2 (ja)
KR (1) KR101427445B1 (ja)
TW (1) TWI557502B (ja)
WO (1) WO2012044070A2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10533127B2 (en) 2017-08-17 2020-01-14 Samsung Electronics Co., Ltd. Compositions, quantum dot polymer composite and layered structure produced therefrom, and electronic device including the same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130132322A (ko) * 2012-05-25 2013-12-04 주식회사 엘지화학 감광성 수지 조성물, 이를 이용하여 형성된 패턴 및 이를 포함하는 디스플레이 패널
KR102002984B1 (ko) * 2012-12-28 2019-07-23 코오롱인더스트리 주식회사 하드 코팅용 감광성 수지 조성물
KR102250453B1 (ko) * 2014-11-11 2021-05-11 에스케이이노베이션 주식회사 광경화성 하드코팅층 형성용 조성물
CN108885400A (zh) * 2016-03-31 2018-11-23 太阳油墨制造株式会社 固化性树脂组合物、干膜、固化物和印刷电路板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060101811A (ko) * 2005-03-21 2006-09-26 동우 화인켐 주식회사 디스플레이 전극 형성용 액상 음각 포토레지스트 조성물

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3993691B2 (ja) * 1997-09-24 2007-10-17 関西ペイント株式会社 レジストパターン形成方法
JP2001181546A (ja) * 1999-12-22 2001-07-03 Nippon Shokubai Co Ltd 感光性着色樹脂組成物
JP3797288B2 (ja) * 2002-07-23 2006-07-12 Ｊｓｒ株式会社 樹脂組成物および保護膜
JP4711208B2 (ja) * 2006-03-17 2011-06-29 山栄化学株式会社 感光性熱硬化性樹脂組成物、並びにレジスト膜被覆平滑化プリント配線基板及びその製造法。
JP5607346B2 (ja) * 2009-01-06 2014-10-15 住友化学株式会社 感光性樹脂組成物、塗膜、パターン及び表示装置
KR101759929B1 (ko) * 2009-11-20 2017-07-20 코오롱인더스트리 주식회사 감광성 수지 조성물

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060101811A (ko) * 2005-03-21 2006-09-26 동우 화인켐 주식회사 디스플레이 전극 형성용 액상 음각 포토레지스트 조성물

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10533127B2 (en) 2017-08-17 2020-01-14 Samsung Electronics Co., Ltd. Compositions, quantum dot polymer composite and layered structure produced therefrom, and electronic device including the same

Also Published As

Publication number Publication date
WO2012044070A2 (en) 2012-04-05
TW201214043A (en) 2012-04-01
TWI557502B (zh) 2016-11-11
JP5699219B2 (ja) 2015-04-08
WO2012044070A3 (en) 2012-05-31
KR20120033895A (ko) 2012-04-09
JP2013541733A (ja) 2013-11-14

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