WO2012044070A3 - Photosensitive resin composition for organic insulator - Google Patents

Photosensitive resin composition for organic insulator Download PDF

Info

Publication number
WO2012044070A3
WO2012044070A3 PCT/KR2011/007156 KR2011007156W WO2012044070A3 WO 2012044070 A3 WO2012044070 A3 WO 2012044070A3 KR 2011007156 W KR2011007156 W KR 2011007156W WO 2012044070 A3 WO2012044070 A3 WO 2012044070A3
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
organic insulator
introducing
silsesquioxane compound
Prior art date
Application number
PCT/KR2011/007156
Other languages
French (fr)
Other versions
WO2012044070A2 (en
Inventor
Yun Jae Lee
Chung Seock Kang
Pil Rye Yang
Kyung Keun Yoon
Original Assignee
Kolon Industries, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kolon Industries, Inc. filed Critical Kolon Industries, Inc.
Priority to JP2013531489A priority Critical patent/JP5699219B2/en
Publication of WO2012044070A2 publication Critical patent/WO2012044070A2/en
Publication of WO2012044070A3 publication Critical patent/WO2012044070A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Epoxy Resins (AREA)

Abstract

Provided is a photosensitive resin composition capable of acquiring high flatness, sensitivity, heat resistance, transparency, and a low residual film ratio and significantly improving adhesion between substrates and particularly, minimizing loss of the film during a developing process by increasing crosslink density during an exposing process by introducing a silsesquioxane compound having a photosensitive functional group in order to minimize excessive loss of the film during the developing process in an organic insulator introducing a known silsesquioxane compound having an epoxy group, in which the photosensitive resin composition is suitable for being applied to the organic insulator in various display processes.
PCT/KR2011/007156 2010-09-30 2011-09-28 Photosensitive resin composition for organic insulator WO2012044070A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013531489A JP5699219B2 (en) 2010-09-30 2011-09-28 Photosensitive resin composition for organic insulating film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0095636 2010-09-30
KR20100095636A KR101427445B1 (en) 2010-09-30 2010-09-30 Photosensitive resin composition for organic insulator

Publications (2)

Publication Number Publication Date
WO2012044070A2 WO2012044070A2 (en) 2012-04-05
WO2012044070A3 true WO2012044070A3 (en) 2012-05-31

Family

ID=45893658

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/007156 WO2012044070A2 (en) 2010-09-30 2011-09-28 Photosensitive resin composition for organic insulator

Country Status (4)

Country Link
JP (1) JP5699219B2 (en)
KR (1) KR101427445B1 (en)
TW (1) TWI557502B (en)
WO (1) WO2012044070A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9341946B2 (en) 2012-05-25 2016-05-17 Lg Chem, Ltd. Photosensitive resin composition, pattern formed using same and display panel comprising same
KR102002984B1 (en) * 2012-12-28 2019-07-23 코오롱인더스트리 주식회사 Photosensitive Resin Composition for Hard Coating
KR102250453B1 (en) * 2014-11-11 2021-05-11 에스케이이노베이션 주식회사 Composition for making hard coating layer
KR20180129867A (en) * 2016-03-31 2018-12-05 다이요 잉키 세이조 가부시키가이샤 Curable resin composition, dry film, cured product and printed wiring board
US10533127B2 (en) 2017-08-17 2020-01-14 Samsung Electronics Co., Ltd. Compositions, quantum dot polymer composite and layered structure produced therefrom, and electronic device including the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990030073A (en) * 1997-09-24 1999-04-26 사사키 요시오 Formation method of negative photosensitive resin composition and resist pattern
JP2001181546A (en) * 1999-12-22 2001-07-03 Nippon Shokubai Co Ltd Photosensitive colored resin composition
KR20060101811A (en) * 2005-03-21 2006-09-26 동우 화인켐 주식회사 Negative type liquid photoresist composition for display electrode
KR20100081931A (en) * 2009-01-06 2010-07-15 스미또모 가가꾸 가부시끼가이샤 Photosensitive resin composition

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3797288B2 (en) * 2002-07-23 2006-07-12 Ｊｓｒ株式会社 Resin composition and protective film
JP4711208B2 (en) * 2006-03-17 2011-06-29 山栄化学株式会社 Photosensitive thermosetting resin composition, resist film-coated smoothed printed wiring board, and method for producing the same.
KR101759929B1 (en) * 2009-11-20 2017-07-20 코오롱인더스트리 주식회사 Photosensitive resin composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990030073A (en) * 1997-09-24 1999-04-26 사사키 요시오 Formation method of negative photosensitive resin composition and resist pattern
JP2001181546A (en) * 1999-12-22 2001-07-03 Nippon Shokubai Co Ltd Photosensitive colored resin composition
KR20060101811A (en) * 2005-03-21 2006-09-26 동우 화인켐 주식회사 Negative type liquid photoresist composition for display electrode
KR20100081931A (en) * 2009-01-06 2010-07-15 스미또모 가가꾸 가부시끼가이샤 Photosensitive resin composition

Also Published As

Publication number Publication date
TW201214043A (en) 2012-04-01
KR20120033895A (en) 2012-04-09
KR101427445B1 (en) 2014-08-11
TWI557502B (en) 2016-11-11
WO2012044070A2 (en) 2012-04-05
JP2013541733A (en) 2013-11-14
JP5699219B2 (en) 2015-04-08

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