KR101392535B1 - 반도체 웨이퍼 표면 보호용 점착테이프 및 그것을 이용한 반도체 웨이퍼의 제조방법 - Google Patents

반도체 웨이퍼 표면 보호용 점착테이프 및 그것을 이용한 반도체 웨이퍼의 제조방법 Download PDF

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Publication number
KR101392535B1
KR101392535B1 KR1020130078375A KR20130078375A KR101392535B1 KR 101392535 B1 KR101392535 B1 KR 101392535B1 KR 1020130078375 A KR1020130078375 A KR 1020130078375A KR 20130078375 A KR20130078375 A KR 20130078375A KR 101392535 B1 KR101392535 B1 KR 101392535B1
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KR
South Korea
Prior art keywords
pressure
sensitive adhesive
semiconductor wafer
mass
adhesive layer
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Application number
KR1020130078375A
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English (en)
Korean (ko)
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KR20140005801A (ko
Inventor
도모미 아라하시
히로토키 요코이
Original Assignee
후루카와 덴키 고교 가부시키가이샤
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Publication of KR20140005801A publication Critical patent/KR20140005801A/ko
Application granted granted Critical
Publication of KR101392535B1 publication Critical patent/KR101392535B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020130078375A 2012-07-06 2013-07-04 반도체 웨이퍼 표면 보호용 점착테이프 및 그것을 이용한 반도체 웨이퍼의 제조방법 KR101392535B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-153088 2012-07-06
JP2012153088A JP5117630B1 (ja) 2012-07-06 2012-07-06 半導体ウェハ表面保護用粘着テープおよびそれを用いた半導体ウェハの製造方法

Publications (2)

Publication Number Publication Date
KR20140005801A KR20140005801A (ko) 2014-01-15
KR101392535B1 true KR101392535B1 (ko) 2014-05-07

Family

ID=47692801

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130078375A KR101392535B1 (ko) 2012-07-06 2013-07-04 반도체 웨이퍼 표면 보호용 점착테이프 및 그것을 이용한 반도체 웨이퍼의 제조방법

Country Status (4)

Country Link
JP (1) JP5117630B1 (zh)
KR (1) KR101392535B1 (zh)
CN (1) CN103525323B (zh)
TW (1) TWI449767B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192464A (ja) * 2013-03-28 2014-10-06 Furukawa Electric Co Ltd:The 半導体ウェハ表面保護用粘着テープ
JP5950869B2 (ja) * 2013-06-20 2016-07-13 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
JP6235893B2 (ja) * 2013-12-19 2017-11-22 リンテック株式会社 バックグラインドシート
JP2015185691A (ja) * 2014-03-24 2015-10-22 古河電気工業株式会社 半導体ウェハ加工用粘着テープ、該粘着テープの製造方法および半導体ウェハの加工方法
JP2015196313A (ja) * 2014-03-31 2015-11-09 ソニー株式会社 保護フィルム、積層体、表示装置および被着体
CN105097431A (zh) * 2014-05-09 2015-11-25 中芯国际集成电路制造(上海)有限公司 一种晶圆正面的保护方法
KR102652507B1 (ko) * 2015-02-09 2024-03-28 세키스이가가쿠 고교가부시키가이샤 반도체 칩의 제조 방법
JP5855299B1 (ja) * 2015-03-02 2016-02-09 古河電気工業株式会社 半導体ウェハ表面保護用粘着テープおよび半導体ウェハの加工方法
WO2016148110A1 (ja) * 2015-03-16 2016-09-22 古河電気工業株式会社 半導体ウェハ加工用粘着テープ
JP6560052B2 (ja) * 2015-08-03 2019-08-14 株式会社ディスコ 密着度合検出方法
WO2018101090A1 (ja) * 2016-11-29 2018-06-07 リンテック株式会社 両面粘着シートおよび半導体装置の製造方法
WO2018181240A1 (ja) * 2017-03-31 2018-10-04 古河電気工業株式会社 半導体ウェハ表面保護用粘着テープ及び半導体ウェハの加工方法
KR102560242B1 (ko) * 2017-10-27 2023-07-26 린텍 가부시키가이샤 보호막 형성용 복합 시트 및 반도체 칩의 제조 방법
JP7162612B2 (ja) * 2017-12-07 2022-10-28 リンテック株式会社 ワーク加工用シートおよび加工済みワークの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011151355A (ja) 2009-12-22 2011-08-04 Furukawa Electric Co Ltd:The 半導体ウエハ表面保護用粘着テープ
JP2011210944A (ja) 2010-03-30 2011-10-20 Furukawa Electric Co Ltd:The 帯電防止性半導体加工用粘着テープ

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4699620B2 (ja) * 2001-03-05 2011-06-15 日立化成工業株式会社 感光性接着フィルムおよびその用途ならびに半導体装置の製造方法
JP4265397B2 (ja) * 2003-12-22 2009-05-20 日立化成工業株式会社 半導体装置および半導体装置の製造方法
CN101019206A (zh) * 2004-08-02 2007-08-15 积水化学工业株式会社 Ic芯片的制造方法
JP4865312B2 (ja) * 2005-12-05 2012-02-01 古河電気工業株式会社 チップ用保護膜形成用シート
JP2011132354A (ja) * 2009-12-24 2011-07-07 Hitachi Maxell Ltd 紫外線硬化型粘着フィルム
JP4988815B2 (ja) * 2009-12-25 2012-08-01 日東電工株式会社 チップ保持用テープ、チップ状ワークの保持方法、チップ保持用テープを用いた半導体装置の製造方法、及び、チップ保持用テープの製造方法
JP4846067B2 (ja) * 2010-03-24 2011-12-28 積水化学工業株式会社 半導体ウエハの処理方法及びｔｓｖウエハの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011151355A (ja) 2009-12-22 2011-08-04 Furukawa Electric Co Ltd:The 半導体ウエハ表面保護用粘着テープ
JP2011210944A (ja) 2010-03-30 2011-10-20 Furukawa Electric Co Ltd:The 帯電防止性半導体加工用粘着テープ

Also Published As

Publication number Publication date
TW201402768A (zh) 2014-01-16
TWI449767B (zh) 2014-08-21
CN103525323B (zh) 2015-07-29
KR20140005801A (ko) 2014-01-15
CN103525323A (zh) 2014-01-22
JP5117630B1 (ja) 2013-01-16
JP2014015521A (ja) 2014-01-30

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