KR101376459B1 - 단일 사이딩된 라우팅 및 더블 사이딩된 부착을 가지는 플렉스 회로 - Google Patents

단일 사이딩된 라우팅 및 더블 사이딩된 부착을 가지는 플렉스 회로 Download PDF

Info

Publication number
KR101376459B1
KR101376459B1 KR1020107028185A KR20107028185A KR101376459B1 KR 101376459 B1 KR101376459 B1 KR 101376459B1 KR 1020107028185 A KR1020107028185 A KR 1020107028185A KR 20107028185 A KR20107028185 A KR 20107028185A KR 101376459 B1 KR101376459 B1 KR 101376459B1
Authority
KR
South Korea
Prior art keywords
conductors
attachment
conductive
flex circuit
touch sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020107028185A
Other languages
English (en)
Korean (ko)
Other versions
KR20110020826A (ko
Inventor
마틴 폴 그룬태너
Original Assignee
애플 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 애플 인크. filed Critical 애플 인크.
Publication of KR20110020826A publication Critical patent/KR20110020826A/ko
Application granted granted Critical
Publication of KR101376459B1 publication Critical patent/KR101376459B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/053—Tails
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Position Input By Displaying (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Push-Button Switches (AREA)
KR1020107028185A 2008-05-16 2009-05-12 단일 사이딩된 라우팅 및 더블 사이딩된 부착을 가지는 플렉스 회로 Expired - Fee Related KR101376459B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/122,441 2008-05-16
US12/122,441 US8456851B2 (en) 2008-05-16 2008-05-16 Flex circuit with single sided routing and double sided attach
PCT/US2009/043592 WO2009140258A1 (en) 2008-05-16 2009-05-12 Flex circuit with single sided routing and double sided attach

Publications (2)

Publication Number Publication Date
KR20110020826A KR20110020826A (ko) 2011-03-03
KR101376459B1 true KR101376459B1 (ko) 2014-03-19

Family

ID=40886444

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107028185A Expired - Fee Related KR101376459B1 (ko) 2008-05-16 2009-05-12 단일 사이딩된 라우팅 및 더블 사이딩된 부착을 가지는 플렉스 회로

Country Status (6)

Country Link
US (2) US8456851B2 (enExample)
EP (2) EP2277102B1 (enExample)
JP (1) JP5118100B2 (enExample)
KR (1) KR101376459B1 (enExample)
CN (2) CN201540549U (enExample)
WO (1) WO2009140258A1 (enExample)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8456851B2 (en) * 2008-05-16 2013-06-04 Apple Inc. Flex circuit with single sided routing and double sided attach
CN102802497B (zh) * 2009-06-25 2015-03-25 奥林巴斯医疗株式会社 摄像单元
JP5300684B2 (ja) * 2009-10-27 2013-09-25 株式会社ジャパンディスプレイウェスト 静電容量型入力装置、静電容量型入力装置の製造方法、および入力機能付き電気光学装置
JP5455034B2 (ja) * 2009-12-09 2014-03-26 ホシデン株式会社 フレキシブル配線基板
KR101083084B1 (ko) * 2009-12-14 2011-11-16 (주)필스 전극 접속 부재 및 필름형 스피커
TWI450237B (zh) * 2010-01-14 2014-08-21 Wintek Corp 觸控顯示裝置
EP4104752A1 (en) 2010-05-12 2022-12-21 Irhythm Technologies, Inc. Device features and design elements for long-term adhesion
KR101703503B1 (ko) * 2010-07-13 2017-02-08 (주)멜파스 회로기판을 이용하여 터치센서 칩에 감지 신호를 전달하는 접촉 감지 패널 및 접촉 감지 장치
KR101373047B1 (ko) * 2010-09-07 2014-03-11 삼성디스플레이 주식회사 연성회로기판 및 이를 구비한 터치스크린패널장치
US8982062B2 (en) * 2011-05-09 2015-03-17 Blackberry Limited Multi-modal user input device
US8711570B2 (en) 2011-06-21 2014-04-29 Apple Inc. Flexible circuit routing
US8337216B1 (en) * 2011-07-26 2012-12-25 Apple Inc. Touch sensor back plane ground connection
US9024891B2 (en) 2011-11-03 2015-05-05 Synaptics Incorporated Single substrate touch sensor
CN103135826B (zh) * 2011-11-27 2015-10-21 宸鸿科技(厦门)有限公司 触控感测装置及其制造方法
US9083344B2 (en) * 2012-02-01 2015-07-14 Apple Inc. Touch sensor with integrated signal bus extensions
US9316677B2 (en) * 2012-02-29 2016-04-19 Apple Inc. Devices and methods for testing flex cable shielding
US9210810B2 (en) * 2012-07-12 2015-12-08 Universal Display Corporation Method of fabricating flexible devices
US8907231B2 (en) 2012-07-18 2014-12-09 Nokia Corporation Display arrangement
KR20140026129A (ko) * 2012-08-24 2014-03-05 삼성전기주식회사 연성회로기판과 이를 구비한 터치패널
US20140069696A1 (en) * 2012-09-11 2014-03-13 Apple Inc. Methods and apparatus for attaching multi-layer flex circuits to substrates
CN103780803A (zh) * 2012-10-23 2014-05-07 鸿富锦精密工业（深圳）有限公司 取像模组
JP6301056B2 (ja) * 2012-12-21 2018-03-28 三菱電機株式会社 電子機器
WO2014116825A1 (en) 2013-01-24 2014-07-31 Irhythm Technologies, Inc. Physiological monitoring device
CN103246399A (zh) * 2013-05-07 2013-08-14 深圳欧菲光科技股份有限公司 印制电路板及包含该印制电路板的触摸屏感应模组
CN103338582A (zh) * 2013-05-20 2013-10-02 业成光电（深圳）有限公司 软性电路板以及使用该软性电路板的电子装置
CN104185367A (zh) * 2013-05-24 2014-12-03 英业达科技有限公司 软板及应用软板的电路板结构
US9448666B2 (en) 2013-06-08 2016-09-20 Microsoft Technology Licensing, Llc Dark film lamination for a touch sensor
CN103309537A (zh) * 2013-06-18 2013-09-18 苏州市健邦触摸屏技术有限公司 电容式触摸屏
WO2015041688A1 (en) 2013-09-20 2015-03-26 Apple Inc. Pressure-sensing stages for lamination systems
CN104635968A (zh) * 2013-11-09 2015-05-20 宝宸（厦门）光学科技有限公司 触控面板及触控模块
US9372587B2 (en) 2013-11-26 2016-06-21 Synaptics Incorporated Methods and apparatus for arranging electrode layers and associated routing traces in a sensor device
CN203775513U (zh) * 2013-12-30 2014-08-13 昆山维信诺显示技术有限公司 一种柔性电路板
JP5813799B2 (ja) * 2014-02-13 2015-11-17 株式会社ジャパンディスプレイ タッチパネルおよびタッチパネル付き表示装置
KR20170075012A (ko) 2014-10-31 2017-06-30 아이리듬 테크놀로지스, 아이엔씨 무선 생리학적 모니터링 기기 및 시스템
WO2016174983A1 (ja) * 2015-04-28 2016-11-03 シャープ株式会社 フレキシブル基板、タッチパネルセンサシートモジュール、およびフレキシブル基板の製造方法
CN104869752A (zh) * 2015-06-02 2015-08-26 合肥京东方光电科技有限公司 一种柔性电路板及其检测设备、检测方法和显示设备
KR102394723B1 (ko) 2015-09-30 2022-05-09 엘지디스플레이 주식회사 터치 스크린 패널 및 이를 포함하는 표시 장치
US10331934B2 (en) * 2015-11-20 2019-06-25 Idex Asa Electronic sensor supported on rigid substrate
KR102446999B1 (ko) * 2016-02-01 2022-09-22 엘지이노텍 주식회사 인쇄회로기판 및 이를 포함하는 터치 윈도우
US10162194B2 (en) * 2016-03-01 2018-12-25 Verily Life Sciences Llc Eye mountable device and flexible assembly for fabrication thereof
JP6199471B1 (ja) * 2016-10-31 2017-09-20 日本航空電子工業株式会社 コネクタ組立体
KR102316563B1 (ko) * 2017-05-22 2021-10-25 엘지디스플레이 주식회사 금속으로 형성된 상부 기판을 포함하는 유기 발광 표시 장치 및 이의 제조 방법
JP6548703B2 (ja) * 2017-09-08 2019-07-24 三菱電機株式会社 電子機器
DE102017220105A1 (de) * 2017-11-10 2019-05-16 Mahle International Gmbh Elektromagnetisches Steuerungssystem
EP3602236B1 (en) * 2017-12-05 2024-10-02 Google LLC Shielding a bending portion of a flexible display
KR102481250B1 (ko) * 2018-03-08 2022-12-26 삼성디스플레이 주식회사 표시 장치
CN108551721A (zh) * 2018-06-20 2018-09-18 业成科技（成都）有限公司 可挠式电路板及其应用之弯曲式电子模组
US11107841B2 (en) * 2018-07-04 2021-08-31 Samsung Electronics Co., Ltd. Display panel and large format display apparatus using the same
KR102517268B1 (ko) 2018-07-16 2023-04-03 삼성전자주식회사 디스플레이 패널
US11119616B2 (en) * 2018-11-01 2021-09-14 Apple Inc. Trace transfer techniques for touch sensor panels with flex circuits
US11853515B2 (en) 2018-12-19 2023-12-26 Apple Inc. Ultra-thin touch sensors
CN117055757A (zh) 2018-12-19 2023-11-14 苹果公司 超薄触摸传感器
CN110636688B (zh) * 2019-08-21 2020-10-16 武汉华星光电半导体显示技术有限公司 柔性显示装置
JP2021086380A (ja) * 2019-11-27 2021-06-03 双葉電子工業株式会社 タッチパネル
KR102563372B1 (ko) 2020-02-12 2023-08-03 아이리듬 테크놀로지스, 아이엔씨 비-침습적 심장 모니터 및 기록된 심장 데이터를 사용하여 환자의 생리학적 특성을 추론하는 방법
US11552344B2 (en) * 2020-02-28 2023-01-10 Gentherm Gmbh Flex foil substrate connector for sensing battery voltage and temperature
JP2021153116A (ja) * 2020-03-24 2021-09-30 株式会社写真化学 配線基板および配線方法
US12472085B2 (en) 2020-07-24 2025-11-18 Hollister Incorporated Double-sided sensor device for ostomy leak detection system
AU2021320404B2 (en) * 2020-08-06 2025-03-20 Irhythm Technologies, Inc. Electrical components for physiological monitoring device
EP4192334A1 (en) 2020-08-06 2023-06-14 Irhythm Technologies, Inc. Adhesive physiological monitoring device
US12204717B2 (en) 2020-12-09 2025-01-21 Apple Inc. Systems and methods for flex circuit connections in touch screens
WO2022201224A1 (ja) * 2021-03-22 2022-09-29 株式会社ワコム 基板アセンブリ、基板、及び電子機器
US11650704B2 (en) 2021-08-02 2023-05-16 Tpk Advanced Solutions Inc. Bonding structure and electronic device
USD1063079S1 (en) 2021-08-06 2025-02-18 Irhythm Technologies, Inc. Physiological monitoring device
US11880521B2 (en) 2021-08-17 2024-01-23 Tpk Touch Solutions (Xiamen) Inc. Electronic device and method of manufacturing the same
CN119012516A (zh) * 2024-10-25 2024-11-22 荣耀终端有限公司 电路板组件及其制作方法、电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121892A (ja) * 1997-10-14 1999-04-30 Sony Chem Corp 可撓性回路基板
JP2003108302A (ja) * 2001-10-01 2003-04-11 Matsushita Electric Ind Co Ltd 透明タッチパネル
JP2003110207A (ja) * 2001-09-28 2003-04-11 Alps Electric Co Ltd フレキシブル基板
JP2004247352A (ja) * 2003-02-10 2004-09-02 Sumitomo Electric Printed Circuit Inc フレキシブルプリント基板

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6144494A (ja) * 1984-08-09 1986-03-04 ソニー株式会社 電気的接続体
US4715928A (en) * 1985-09-27 1987-12-29 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein
US4902236A (en) 1988-11-14 1990-02-20 E. I. Du Pont De Nemours And Company Flex circuit and cable assembly
JPH0521901Y2 (enExample) 1990-05-28 1993-06-04
US5483261A (en) 1992-02-14 1996-01-09 Itu Research, Inc. Graphical input controller and method with rear screen image detection
US5880411A (en) 1992-06-08 1999-03-09 Synaptics, Incorporated Object position detector with edge motion feature and gesture recognition
US5488204A (en) 1992-06-08 1996-01-30 Synaptics, Incorporated Paintbrush stylus for capacitive touch sensor pad
US5461202A (en) * 1992-10-05 1995-10-24 Matsushita Electric Industrial Co., Ltd. Flexible wiring board and its fabrication method
JPH0945183A (ja) * 1995-08-01 1997-02-14 Hitachi Aic Inc タッチパネル
US5825352A (en) 1996-01-04 1998-10-20 Logitech, Inc. Multiple fingers contact sensing method for emulating mouse buttons and mouse operations on a touch sensor pad
US5835079A (en) 1996-06-13 1998-11-10 International Business Machines Corporation Virtual pointing device for touchscreens
US6310610B1 (en) 1997-12-04 2001-10-30 Nortel Networks Limited Intelligent touch display
US6235551B1 (en) * 1997-12-31 2001-05-22 Micron Technology, Inc. Semiconductor device including edge bond pads and methods
JP2002501271A (ja) 1998-01-26 2002-01-15 ウェスターマン，ウェイン 手操作入力を統合する方法および装置
US8479122B2 (en) 2004-07-30 2013-07-02 Apple Inc. Gestures for touch sensitive input devices
US7663607B2 (en) 2004-05-06 2010-02-16 Apple Inc. Multipoint touchscreen
DE19820414A1 (de) * 1998-05-07 1999-11-18 Carmen Diessner Kontaktierungsvorrichtung
US6188391B1 (en) 1998-07-09 2001-02-13 Synaptics, Inc. Two-layer capacitive touchpad and method of making same
JP4542637B2 (ja) 1998-11-25 2010-09-15 セイコーエプソン株式会社 携帯情報機器及び情報記憶媒体
US6449836B1 (en) * 1999-07-30 2002-09-17 Denso Corporation Method for interconnecting printed circuit boards and interconnection structure
US6747290B2 (en) 2000-12-12 2004-06-08 Semiconductor Energy Laboratory Co., Ltd. Information device
TW508562B (en) 2001-01-10 2002-11-01 Atouch Co Ltd A contact structure of touch panel
WO2002089664A2 (en) * 2001-05-03 2002-11-14 Masimo Corporation Flex circuit shielded optical sensor and method of fabricating the same
JP3800984B2 (ja) 2001-05-21 2006-07-26 ソニー株式会社 ユーザ入力装置
JP2003173237A (ja) 2001-09-28 2003-06-20 Ricoh Co Ltd 情報入出力システム、プログラム及び記憶媒体
CN1205555C (zh) 2001-11-12 2005-06-08 联想(北京)有限公司 硬盘数据备份与恢复方法
US6690387B2 (en) 2001-12-28 2004-02-10 Koninklijke Philips Electronics N.V. Touch-screen image scrolling system and method
EP1469383A4 (en) * 2001-12-29 2006-05-10 Taiguen Tech Shenzhen Co Ltd TOUCH DISPLAY SHIELD WITH BUILT-IN ELECTROMAGNETIC INDUCTION LAYER OF SEPTUM ARRAY GRIDS
US6969806B2 (en) * 2002-05-28 2005-11-29 Lockheed Martin Corporation Cable and method
JP4090939B2 (ja) 2002-05-29 2008-05-28 ニッタ株式会社 静電容量式センサおよびその製造方法
US11275405B2 (en) 2005-03-04 2022-03-15 Apple Inc. Multi-functional hand-held device
KR100480154B1 (ko) 2002-08-30 2005-04-06 엘지.필립스 엘시디 주식회사 터치패널
CN2567694Y (zh) 2002-09-16 2003-08-20 台均实业有限公司 内置导线网格电磁感应层的触摸控制显示屏
JP3871991B2 (ja) * 2002-09-30 2007-01-24 Ｓｍｋ株式会社 タッチパネル
KR100451775B1 (ko) 2002-12-31 2004-10-08 엘지.필립스 엘시디 주식회사 터치 패널
JP4163054B2 (ja) * 2003-06-23 2008-10-08 アルプス電気株式会社 入力装置
CA2528889C (en) * 2003-06-26 2010-05-11 Formation, Inc. Environmental protection of serial ata and other electronic devices
JP2005158811A (ja) * 2003-11-20 2005-06-16 Alps Electric Co Ltd 無線ｌａｎユニット
US7108515B2 (en) * 2004-02-26 2006-09-19 Matsushita Electric Industrial Co., Ltd. Wiring board with bending section
JP3857278B2 (ja) * 2004-04-06 2006-12-13 Ｓｍｋ株式会社 タッチパネル入力装置
JP4306590B2 (ja) * 2004-11-05 2009-08-05 セイコーエプソン株式会社 電気光学装置及び電子機器
JP4591157B2 (ja) * 2005-03-31 2010-12-01 パナソニック株式会社 配線基板及びこれを用いた入力装置とその製造方法
JP2007088129A (ja) * 2005-09-21 2007-04-05 Citizen Watch Co Ltd フレキシブル回路基板実装体
JP2007165707A (ja) * 2005-12-15 2007-06-28 Nitto Denko Corp フレキシブル配線回路基板
US7645941B2 (en) * 2006-05-02 2010-01-12 Multi-Fineline Electronix, Inc. Shielded flexible circuits and methods for manufacturing same
AU2007257866B2 (en) 2006-06-09 2011-03-03 Apple Inc. Touch screen liquid crystal display
JP5273330B2 (ja) * 2006-08-04 2013-08-28 株式会社ジャパンディスプレイ 表示装置
JP2008052874A (ja) 2006-08-28 2008-03-06 Sony Corp 磁気テープドライブ装置
KR100821043B1 (ko) * 2006-09-22 2008-04-08 삼성에스디아이 주식회사 연성인쇄회로기판
JP2008091797A (ja) * 2006-10-04 2008-04-17 Olympus Corp フレキシブル基板の接合装置
US8026903B2 (en) 2007-01-03 2011-09-27 Apple Inc. Double-sided touch sensitive panel and flex circuit bonding
US7920129B2 (en) 2007-01-03 2011-04-05 Apple Inc. Double-sided touch-sensitive panel with shield and drive combined layer
US8456851B2 (en) * 2008-05-16 2013-06-04 Apple Inc. Flex circuit with single sided routing and double sided attach
JP5455034B2 (ja) * 2009-12-09 2014-03-26 ホシデン株式会社 フレキシブル配線基板
CN103246399A (zh) * 2013-05-07 2013-08-14 深圳欧菲光科技股份有限公司 印制电路板及包含该印制电路板的触摸屏感应模组

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121892A (ja) * 1997-10-14 1999-04-30 Sony Chem Corp 可撓性回路基板
JP2003110207A (ja) * 2001-09-28 2003-04-11 Alps Electric Co Ltd フレキシブル基板
JP2003108302A (ja) * 2001-10-01 2003-04-11 Matsushita Electric Ind Co Ltd 透明タッチパネル
JP2004247352A (ja) * 2003-02-10 2004-09-02 Sumitomo Electric Printed Circuit Inc フレキシブルプリント基板

Also Published As

Publication number Publication date
US8549738B2 (en) 2013-10-08
CN101581995B (zh) 2013-03-27
JP2010009594A (ja) 2010-01-14
HK1153558A1 (en) 2012-03-30
EP2930598A1 (en) 2015-10-14
JP5118100B2 (ja) 2013-01-16
US20110094670A1 (en) 2011-04-28
US8456851B2 (en) 2013-06-04
KR20110020826A (ko) 2011-03-03
WO2009140258A1 (en) 2009-11-19
US20090283300A1 (en) 2009-11-19
EP2277102B1 (en) 2016-11-02
EP2277102A1 (en) 2011-01-26
CN201540549U (zh) 2010-08-04
CN101581995A (zh) 2009-11-18

Similar Documents

Publication Publication Date Title
KR101376459B1 (ko) 단일 사이딩된 라우팅 및 더블 사이딩된 부착을 가지는 플렉스 회로
US10474268B2 (en) Reducing the border area of a device
US9098159B2 (en) Direct connect single layer touch panel
US9626061B2 (en) PET-based touch pad
CN101566895B (zh) 用于触摸屏的砖块形布局和叠层
US8446386B2 (en) Double-sided touch sensitive panel and flex circuit bonding
AU2009256350B2 (en) High resistivity metal fan out
HK1153558B (en) Flex circuit with single sided routing and double sided attach

Legal Events

Date Code Title Description
A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20170220

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20180219

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20200218

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20240314

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240314