KR101354578B1 - 배리어 박막을 모서리 밀봉하는 방법 - Google Patents

배리어 박막을 모서리 밀봉하는 방법 Download PDF

Info

Publication number
KR101354578B1
KR101354578B1 KR1020117014924A KR20117014924A KR101354578B1 KR 101354578 B1 KR101354578 B1 KR 101354578B1 KR 1020117014924 A KR1020117014924 A KR 1020117014924A KR 20117014924 A KR20117014924 A KR 20117014924A KR 101354578 B1 KR101354578 B1 KR 101354578B1
Authority
KR
South Korea
Prior art keywords
layer
decoupling
barrier
barrier layer
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020117014924A
Other languages
English (en)
Korean (ko)
Other versions
KR20110091568A (ko
Inventor
씨 츄
펄 이. 버로즈
에릭 에스. 마스트
피터 엠. 마틴
골든 엘. 그라프
마크 이. 그로스
찰스 씨. 본햄
웬디 디. 베넷
마틴 필립 로젠블럼
Original Assignee
삼성디스플레이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성디스플레이 주식회사 filed Critical 삼성디스플레이 주식회사
Publication of KR20110091568A publication Critical patent/KR20110091568A/ko
Application granted granted Critical
Publication of KR101354578B1 publication Critical patent/KR101354578B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020117014924A 2008-12-30 2009-12-03 배리어 박막을 모서리 밀봉하는 방법 Active KR101354578B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/345,787 US20090191342A1 (en) 1999-10-25 2008-12-30 Method for edge sealing barrier films
US12/345,787 2008-12-30
PCT/US2009/066518 WO2010077544A1 (en) 2008-12-30 2009-12-03 Method for edge sealing barrier films

Publications (2)

Publication Number Publication Date
KR20110091568A KR20110091568A (ko) 2011-08-11
KR101354578B1 true KR101354578B1 (ko) 2014-01-22

Family

ID=41626976

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117014924A Active KR101354578B1 (ko) 2008-12-30 2009-12-03 배리어 박막을 모서리 밀봉하는 방법

Country Status (7)

Country Link
US (1) US20090191342A1 (enExample)
EP (2) EP2373487B1 (enExample)
JP (1) JP5882060B2 (enExample)
KR (1) KR101354578B1 (enExample)
CN (2) CN105609659A (enExample)
TW (1) TWI490953B (enExample)
WO (1) WO2010077544A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190079349A (ko) * 2017-12-27 2019-07-05 삼성에스디아이 주식회사 유기막 조성물 및 패턴 형성 방법
US11950444B2 (en) 2019-05-03 2024-04-02 Samsung Display Co., Ltd. Display device and method of manufacturing the same

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9853245B2 (en) 2011-10-14 2017-12-26 Samsung Display Co., Ltd. Organic light emitting diode display and method for manufacturing the same
KR101809659B1 (ko) * 2011-10-14 2017-12-18 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
DE102011086689B4 (de) * 2011-11-21 2017-02-16 Osram Oled Gmbh Verfahren zum Herstellen eines opto-elektronischen Bauelements
KR101900362B1 (ko) 2012-01-16 2018-11-09 삼성디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조방법
KR20130089039A (ko) 2012-02-01 2013-08-09 삼성디스플레이 주식회사 증착 소스, 증착 장치 및 유기 발광 표시 장치 제조 방법
CN104115300B (zh) * 2012-02-15 2017-02-22 应用材料公司 沉积包封膜的方法
US9312511B2 (en) * 2012-03-16 2016-04-12 Universal Display Corporation Edge barrier film for electronic devices
KR101937258B1 (ko) 2012-09-04 2019-01-11 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102777021B1 (ko) 2012-12-27 2025-03-05 카티바, 인크. 정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피 제어를 위한 기법
US12330178B2 (en) 2012-12-27 2025-06-17 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
US11141752B2 (en) 2012-12-27 2021-10-12 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
US11673155B2 (en) 2012-12-27 2023-06-13 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
US9352561B2 (en) 2012-12-27 2016-05-31 Kateeva, Inc. Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances
US9700908B2 (en) 2012-12-27 2017-07-11 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
KR101980769B1 (ko) * 2012-12-28 2019-05-21 엘지디스플레이 주식회사 유기 발광 다이오드 표시 장치 및 이의 제조 방법
US9368749B2 (en) 2013-03-12 2016-06-14 Samsung Sdi Co., Ltd. Patterned multilayered stack, and system and method for making the same
KR102096054B1 (ko) * 2013-08-14 2020-04-02 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
KR102141205B1 (ko) * 2013-08-16 2020-08-05 삼성디스플레이 주식회사 박막 봉지 제조 장치 및 이를 이용한 표시 장치의 제조 방법
CN107825886B (zh) 2013-12-12 2020-04-14 科迪华公司 制造电子设备的方法
KR20170036701A (ko) 2014-07-25 2017-04-03 카티바, 인크. 유기 박막 잉크 조성물 및 방법
US9594287B2 (en) * 2014-08-24 2017-03-14 Royole Corporation Substrate-less flexible display and method of manufacturing the same
EP3344712A4 (en) 2015-08-31 2019-05-15 Kateeva, Inc. DI AND MONO (METH) ACRYLATE BASED ORGANIC THIN LAYER INK COMPOSITIONS
US10303031B2 (en) * 2015-11-18 2019-05-28 Gentex Corporation Electro-optic gas barrier
KR102508672B1 (ko) * 2016-06-15 2023-03-13 삼성디스플레이 주식회사 표시 장치
KR102607711B1 (ko) 2017-04-21 2023-11-28 카티바, 인크. 유기 박막을 형성하기 위한 조성물 및 기술
CN111129031A (zh) * 2019-12-18 2020-05-08 武汉华星光电半导体显示技术有限公司 显示面板及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005504652A (ja) * 2001-09-28 2005-02-17 ヴィテックス・システムズ・インコーポレーテッド バリア薄膜の縁部密封の方法
US6949389B2 (en) * 2002-05-02 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic light emitting diodes devices
US20070105473A1 (en) * 2005-11-09 2007-05-10 Lee Chung J Method of encapsulating an organic light-emitting device

Family Cites Families (108)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266223A (en) * 1978-12-08 1981-05-05 W. H. Brady Co. Thin panel display
US4313254A (en) * 1979-10-30 1982-02-02 The Johns Hopkins University Thin-film silicon solar cell with metal boride bottom electrode
US4581337A (en) * 1983-07-07 1986-04-08 E. I. Du Pont De Nemours And Company Polyether polyamines as linking agents for particle reagents useful in immunoassays
US4426275A (en) * 1981-11-27 1984-01-17 Deposition Technology, Inc. Sputtering device adaptable for coating heat-sensitive substrates
DE3324106A1 (de) * 1983-07-05 1985-01-17 Draiswerke Gmbh, 6800 Mannheim Verfahren zum beleimen von holz-spaenen und dergl. mit fluessigleim und vorrichtung zur durchfuehrung des verfahrens
US4722515A (en) * 1984-11-06 1988-02-02 Spectrum Control, Inc. Atomizing device for vaporization
JPH0193129A (ja) * 1987-10-02 1989-04-12 Mitsubishi Electric Corp 化学気相成長装置
US5189405A (en) * 1989-01-26 1993-02-23 Sharp Kabushiki Kaisha Thin film electroluminescent panel
US5204314A (en) * 1990-07-06 1993-04-20 Advanced Technology Materials, Inc. Method for delivering an involatile reagent in vapor form to a CVD reactor
US5711816A (en) * 1990-07-06 1998-01-27 Advanced Technolgy Materials, Inc. Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same
US5203898A (en) * 1991-12-16 1993-04-20 Corning Incorporated Method of making fluorine/boron doped silica tubes
US5393607A (en) * 1992-01-13 1995-02-28 Mitsui Toatsu Chemiclas, Inc. Laminated transparent plastic material and polymerizable monomer
US5402314A (en) * 1992-02-10 1995-03-28 Sony Corporation Printed circuit board having through-hole stopped with photo-curable solder resist
JPH0683403A (ja) 1992-07-17 1994-03-25 Fanuc Ltd 適応ｐｉ制御方式
GB9215928D0 (en) * 1992-07-27 1992-09-09 Cambridge Display Tech Ltd Manufacture of electroluminescent devices
US5260095A (en) 1992-08-21 1993-11-09 Battelle Memorial Institute Vacuum deposition and curing of liquid monomers
GB9311092D0 (en) * 1993-01-28 1993-07-14 Du Pont Int Extrusion process
EP0608620B1 (en) * 1993-01-28 1996-08-14 Applied Materials, Inc. Vacuum Processing apparatus having improved throughput
US5510173A (en) * 1993-08-20 1996-04-23 Southwall Technologies Inc. Multiple layer thin films with improved corrosion resistance
ATE233939T1 (de) * 1993-10-04 2003-03-15 3M Innovative Properties Co Vernetztes acrylatbeschichtungsmaterial zur herstellung von kondensatordielektrika und sauerstoffbarrieren
US5440446A (en) 1993-10-04 1995-08-08 Catalina Coatings, Inc. Acrylate coating material
JP2846571B2 (ja) * 1994-02-25 1999-01-13 出光興産株式会社 有機エレクトロルミネッセンス素子
DE4438359C2 (de) * 1994-10-27 2001-10-04 Schott Glas Behälter aus Kunststoff mit einer Sperrbeschichtung
US6083628A (en) * 1994-11-04 2000-07-04 Sigma Laboratories Of Arizona, Inc. Hybrid polymer film
US5607789A (en) * 1995-01-23 1997-03-04 Duracell Inc. Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same
US5620524A (en) * 1995-02-27 1997-04-15 Fan; Chiko Apparatus for fluid delivery in chemical vapor deposition systems
GB9507817D0 (en) * 1995-04-18 1995-05-31 Philips Electronics Uk Ltd Touch sensing devices and methods of making such
US5629389A (en) * 1995-06-06 1997-05-13 Hewlett-Packard Company Polymer-based electroluminescent device with improved stability
US5686360A (en) * 1995-11-30 1997-11-11 Motorola Passivation of organic devices
US6195142B1 (en) * 1995-12-28 2001-02-27 Matsushita Electrical Industrial Company, Ltd. Organic electroluminescence element, its manufacturing method, and display device using organic electroluminescence element
US5738920A (en) * 1996-01-30 1998-04-14 Becton, Dickinson And Company Blood collection tube assembly
US5734225A (en) * 1996-07-10 1998-03-31 International Business Machines Corporation Encapsulation of organic light emitting devices using siloxane or siloxane derivatives
US5731661A (en) * 1996-07-15 1998-03-24 Motorola, Inc. Passivation of electroluminescent organic devices
US5902688A (en) * 1996-07-16 1999-05-11 Hewlett-Packard Company Electroluminescent display device
US5895228A (en) * 1996-11-14 1999-04-20 International Business Machines Corporation Encapsulation of organic light emitting devices using Siloxane or Siloxane derivatives
US5872355A (en) * 1997-04-09 1999-02-16 Hewlett-Packard Company Electroluminescent device and fabrication method for a light detection system
JP3290375B2 (ja) * 1997-05-12 2002-06-10 松下電器産業株式会社 有機電界発光素子
US6198220B1 (en) * 1997-07-11 2001-03-06 Emagin Corporation Sealing structure for organic light emitting devices
EP2098906A1 (en) * 1997-08-29 2009-09-09 Sharp Kabushiki Kaisha Liquid crystal display device
US6203898B1 (en) * 1997-08-29 2001-03-20 3M Innovatave Properties Company Article comprising a substrate having a silicone coating
US6224948B1 (en) * 1997-09-29 2001-05-01 Battelle Memorial Institute Plasma enhanced chemical deposition with low vapor pressure compounds
US5902641A (en) * 1997-09-29 1999-05-11 Battelle Memorial Institute Flash evaporation of liquid monomer particle mixture
US6045864A (en) * 1997-12-01 2000-04-04 3M Innovative Properties Company Vapor coating method
JP2001526984A (ja) * 1997-12-31 2001-12-25 キンバリー クラーク ワールドワイド インコーポレイテッド 分解性ポリマーおよび熱可塑性エラストマーのマイクロ層通気性フィルム
US6569515B2 (en) * 1998-01-13 2003-05-27 3M Innovative Properties Company Multilayered polymer films with recyclable or recycled layers
US6178082B1 (en) * 1998-02-26 2001-01-23 International Business Machines Corporation High temperature, conductive thin film diffusion barrier for ceramic/metal systems
US6066826A (en) * 1998-03-16 2000-05-23 Yializis; Angelo Apparatus for plasma treatment of moving webs
US5904958A (en) * 1998-03-20 1999-05-18 Rexam Industries Corp. Adjustable nozzle for evaporation or organic monomers
US6361885B1 (en) * 1998-04-10 2002-03-26 Organic Display Technology Organic electroluminescent materials and device made from such materials
US6352777B1 (en) * 1998-08-19 2002-03-05 The Trustees Of Princeton University Organic photosensitive optoelectronic devices with transparent electrodes
US6040017A (en) * 1998-10-02 2000-03-21 Sigma Laboratories, Inc. Formation of multilayered photonic polymer composites
WO2000026973A1 (en) * 1998-11-02 2000-05-11 Presstek, Inc. Transparent conductive oxides for plastic flat panel displays
US6837950B1 (en) * 1998-11-05 2005-01-04 Interface, Inc. Separation of floor covering components for recycling
US6207239B1 (en) * 1998-12-16 2001-03-27 Battelle Memorial Institute Plasma enhanced chemical deposition of conjugated polymer
US6217947B1 (en) * 1998-12-16 2001-04-17 Battelle Memorial Institute Plasma enhanced polymer deposition onto fixtures
US6207238B1 (en) * 1998-12-16 2001-03-27 Battelle Memorial Institute Plasma enhanced chemical deposition for high and/or low index of refraction polymers
US6228436B1 (en) * 1998-12-16 2001-05-08 Battelle Memorial Institute Method of making light emitting polymer composite material
US6228434B1 (en) * 1998-12-16 2001-05-08 Battelle Memorial Institute Method of making a conformal coating of a microtextured surface
US6268695B1 (en) * 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
WO2000036665A1 (en) * 1998-12-16 2000-06-22 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
US6250747B1 (en) * 1999-01-28 2001-06-26 Hewlett-Packard Company Print cartridge with improved back-pressure regulation
JP3817081B2 (ja) * 1999-01-29 2006-08-30 パイオニア株式会社 有機ｅｌ素子の製造方法
US6172810B1 (en) * 1999-02-26 2001-01-09 3M Innovative Properties Company Retroreflective articles having polymer multilayer reflective coatings
US6358570B1 (en) * 1999-03-31 2002-03-19 Battelle Memorial Institute Vacuum deposition and curing of oligomers and resins
US7198832B2 (en) * 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US7394153B2 (en) * 1999-12-17 2008-07-01 Osram Opto Semiconductors Gmbh Encapsulation of electronic devices
US6867539B1 (en) * 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
JP4374765B2 (ja) * 2000-11-09 2009-12-02 株式会社デンソー 有機ｅｌ素子の製造方法
US6537688B2 (en) * 2000-12-01 2003-03-25 Universal Display Corporation Adhesive sealed organic optoelectronic structures
US6541098B2 (en) * 2000-12-22 2003-04-01 Avery Dennison Corporation Three-dimensional flexible adhesive film structures
TWI222838B (en) * 2001-04-10 2004-10-21 Chi Mei Optoelectronics Corp Packaging method of organic electroluminescence light-emitting display device
US6397776B1 (en) * 2001-06-11 2002-06-04 General Electric Company Apparatus for large area chemical vapor deposition using multiple expanding thermal plasma generators
US6888307B2 (en) * 2001-08-21 2005-05-03 Universal Display Corporation Patterned oxygen and moisture absorber for organic optoelectronic device structures
TW519853B (en) * 2001-10-17 2003-02-01 Chi Mei Electronic Corp Organic electro-luminescent display and its packaging method
US6888305B2 (en) * 2001-11-06 2005-05-03 Universal Display Corporation Encapsulation structure that acts as a multilayer mirror
US6948448B2 (en) * 2001-11-27 2005-09-27 General Electric Company Apparatus and method for depositing large area coatings on planar surfaces
US6681716B2 (en) * 2001-11-27 2004-01-27 General Electric Company Apparatus and method for depositing large area coatings on non-planar surfaces
US6597111B2 (en) * 2001-11-27 2003-07-22 Universal Display Corporation Protected organic optoelectronic devices
US6765351B2 (en) * 2001-12-20 2004-07-20 The Trustees Of Princeton University Organic optoelectronic device structures
US7012363B2 (en) * 2002-01-10 2006-03-14 Universal Display Corporation OLEDs having increased external electroluminescence quantum efficiencies
US7109653B2 (en) * 2002-01-15 2006-09-19 Seiko Epson Corporation Sealing structure with barrier membrane for electronic element, display device, electronic apparatus, and fabrication method for electronic element
JP2003258189A (ja) * 2002-03-01 2003-09-12 Toshiba Corp 半導体装置及びその製造方法
JP2003292394A (ja) * 2002-03-29 2003-10-15 Canon Inc 液相成長方法および液相成長装置
US8808457B2 (en) * 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
TWI336905B (en) * 2002-05-17 2011-02-01 Semiconductor Energy Lab Evaporation method, evaporation device and method of fabricating light emitting device
NL1020634C2 (nl) * 2002-05-21 2003-11-24 Otb Group Bv Werkwijze voor het passiveren van een halfgeleider substraat.
US7015640B2 (en) * 2002-09-11 2006-03-21 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same
US7056584B2 (en) * 2002-10-11 2006-06-06 General Electric Company Bond layer for coatings on plastic substrates
JP2004294601A (ja) * 2003-03-26 2004-10-21 Nitto Denko Corp 反射防止フィルム、光学素子および画像表示装置
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
JP2004309932A (ja) * 2003-04-09 2004-11-04 Dainippon Printing Co Ltd 表示素子用基材、表示パネル、表示装置及び表示素子用基材の製造方法
US7029765B2 (en) * 2003-04-22 2006-04-18 Universal Display Corporation Organic light emitting devices having reduced pixel shrinkage
US7820255B2 (en) * 2003-05-29 2010-10-26 Konica Minolta Holdings, Inc. Transparent film for display substrate, display substrate using the film and method of manufacturing the same, liquid crystal display, organic electroluminescence display, and touch panel
JP2005011793A (ja) * 2003-05-29 2005-01-13 Sony Corp 積層構造の製造方法および積層構造、表示素子ならびに表示装置
US6998648B2 (en) * 2003-08-25 2006-02-14 Universal Display Corporation Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant
US7282244B2 (en) * 2003-09-05 2007-10-16 General Electric Company Replaceable plate expanded thermal plasma apparatus and method
US7635525B2 (en) * 2003-09-30 2009-12-22 Fujifilm Corporation Gas barrier laminate film and method for producing the same
JP2005251671A (ja) * 2004-03-08 2005-09-15 Fuji Photo Film Co Ltd 表示装置
US7033850B2 (en) * 2004-06-30 2006-04-25 Eastman Kodak Company Roll-to-sheet manufacture of OLED materials
US7342356B2 (en) * 2004-09-23 2008-03-11 3M Innovative Properties Company Organic electroluminescent device having protective structure with boron oxide layer and inorganic barrier layer
US20060063015A1 (en) * 2004-09-23 2006-03-23 3M Innovative Properties Company Protected polymeric film
DE102004063619A1 (de) * 2004-12-27 2006-07-06 Cfs Kempten Gmbh Schrumpfbare Mehrschichtfolie mit einer Releaseschicht
US20060198986A1 (en) * 2005-03-01 2006-09-07 Keckeisen Michael S Multilayer packaging with peelable coupon
EP1719809A3 (en) * 2005-05-06 2007-05-30 Eastman Chemical Company Pressure sensitive adhesive (PSA) laminates
KR100699254B1 (ko) * 2006-02-14 2007-03-28 삼성전자주식회사 표시장치의 제조방법과 이에 의한 표시장치
EP1857270B1 (en) * 2006-05-17 2013-04-17 Curwood, Inc. Myoglobin blooming agent, films, packages and methods for packaging
JP4245032B2 (ja) * 2006-10-03 2009-03-25 セイコーエプソン株式会社 発光装置および電子機器
JP5151234B2 (ja) * 2007-04-26 2013-02-27 凸版印刷株式会社 加飾成形品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005504652A (ja) * 2001-09-28 2005-02-17 ヴィテックス・システムズ・インコーポレーテッド バリア薄膜の縁部密封の方法
US6949389B2 (en) * 2002-05-02 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic light emitting diodes devices
US20070105473A1 (en) * 2005-11-09 2007-05-10 Lee Chung J Method of encapsulating an organic light-emitting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190079349A (ko) * 2017-12-27 2019-07-05 삼성에스디아이 주식회사 유기막 조성물 및 패턴 형성 방법
KR102296795B1 (ko) * 2017-12-27 2021-08-31 삼성에스디아이 주식회사 유기막 조성물 및 패턴 형성 방법
US11950444B2 (en) 2019-05-03 2024-04-02 Samsung Display Co., Ltd. Display device and method of manufacturing the same

Also Published As

Publication number Publication date
JP5882060B2 (ja) 2016-03-09
WO2010077544A1 (en) 2010-07-08
TWI490953B (zh) 2015-07-01
JP2012512527A (ja) 2012-05-31
EP2481578A1 (en) 2012-08-01
EP2373487A1 (en) 2011-10-12
CN105609659A (zh) 2016-05-25
EP2481578B1 (en) 2014-08-13
KR20110091568A (ko) 2011-08-11
TW201034093A (en) 2010-09-16
EP2373487B1 (en) 2014-07-16
CN102256786A (zh) 2011-11-23
US20090191342A1 (en) 2009-07-30

Similar Documents

Publication Publication Date Title
KR101354578B1 (ko) 배리어 박막을 모서리 밀봉하는 방법
JP2012512527A5 (enExample)
US7727601B2 (en) Method for edge sealing barrier films
US6866901B2 (en) Method for edge sealing barrier films
US20090208754A1 (en) Method for edge sealing barrier films
US6570325B2 (en) Environmental barrier material for organic light emitting device and method of making
JP4750339B2 (ja) 封入されたマイクロ電子デバイス
JP5497787B2 (ja) 環境感応性素子をカプセル化する方法
EP2341566B1 (en) Method of manufacturing a display apparatus including a barrier film composite
JP5367531B2 (ja) Ｔｇ基体上の平滑層及びバリア層
WO2008094352A1 (en) Three dimensional multilayer barrier and method of making
US20230420573A1 (en) Thin film transistor and method of manufactruting thin film transistor

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20170102

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20180102

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20190102

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20191223

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000