KR101350125B1 - 레이저 어셈블리와 이를 포함하는 장치 및 레이저어셈블리의 형성 방법 - Google Patents

레이저 어셈블리와 이를 포함하는 장치 및 레이저어셈블리의 형성 방법 Download PDF

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KR101350125B1
KR101350125B1 KR1020070071917A KR20070071917A KR101350125B1 KR 101350125 B1 KR101350125 B1 KR 101350125B1 KR 1020070071917 A KR1020070071917 A KR 1020070071917A KR 20070071917 A KR20070071917 A KR 20070071917A KR 101350125 B1 KR101350125 B1 KR 101350125B1
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laser
surface area
planar surface
lasers
angle
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KR20080007531A (ko
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조셉 마이클 프런드
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에이저 시스템즈 엘엘시
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Assigned to 아바고 테크놀로지스 제너럴 아이피 (싱가포르) 피티이 리미티드 reassignment 아바고 테크놀로지스 제너럴 아이피 (싱가포르) 피티이 리미티드 권리의 전부이전등록 Assignors: 에이저 시스템즈 엘엘시
Assigned to 아바고 테크놀로지스 인터내셔널 세일즈 피티이 리미티드 reassignment 아바고 테크놀로지스 인터내셔널 세일즈 피티이 리미티드 권리의 전부이전등록 Assignors: 아바고 테크놀로지스 제너럴 아이피 (싱가포르) 피티이 리미티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4056—Edge-emitting structures emitting light in more than one direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
KR1020070071917A 2006-07-17 2007-07-18 레이저 어셈블리와 이를 포함하는 장치 및 레이저어셈블리의 형성 방법 Active KR101350125B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/457,850 2006-07-17
US11/457,850 US7675955B2 (en) 2006-07-17 2006-07-17 Laser assembly for multi-laser applications

Publications (2)

Publication Number Publication Date
KR20080007531A KR20080007531A (ko) 2008-01-22
KR101350125B1 true KR101350125B1 (ko) 2014-01-15

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KR1020070071917A Active KR101350125B1 (ko) 2006-07-17 2007-07-18 레이저 어셈블리와 이를 포함하는 장치 및 레이저어셈블리의 형성 방법

Country Status (4)

Country Link
US (1) US7675955B2 (https=)
JP (1) JP5646130B2 (https=)
KR (1) KR101350125B1 (https=)
TW (1) TWI412195B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102370853B1 (ko) * 2020-10-26 2022-03-07 (주)큐에스아이 다채널 및 다중빔 구동 표면실장형 레이저 다이오드

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013104728A1 (de) * 2013-05-07 2014-11-13 Osram Opto Semiconductors Gmbh Laserdiodenvorrichtung
DE102015108117A1 (de) * 2015-05-22 2016-11-24 Osram Opto Semiconductors Gmbh Bauelement
WO2017098689A1 (ja) * 2015-12-09 2017-06-15 パナソニック株式会社 半導体発光装置
JP6759714B2 (ja) * 2016-05-26 2020-09-23 セイコーエプソン株式会社 光源装置およびプロジェクター
JP6631502B2 (ja) 2016-12-27 2020-01-15 日亜化学工業株式会社 レーザパッケージの製造方法
WO2019116547A1 (ja) * 2017-12-15 2019-06-20 三菱電機株式会社 半導体レーザ装置および半導体レーザ装置の製造方法
WO2020218595A1 (ja) * 2019-04-25 2020-10-29 京セラ株式会社 発光素子搭載用基板および発光装置
JP7332860B2 (ja) * 2019-05-29 2023-08-24 日亜化学工業株式会社 発光装置
US20220166185A1 (en) * 2019-08-06 2022-05-26 Mitsubishi Electric Corporation Semiconductor laser device
CN112234429B (zh) * 2020-12-10 2021-07-09 武汉乾希科技有限公司 多通道激光发射器和光通信器件
JP7820648B2 (ja) 2020-12-24 2026-02-26 日亜化学工業株式会社 発光装置
WO2024058088A1 (ja) * 2022-09-12 2024-03-21 ローム株式会社 半導体発光装置
CN120419062A (zh) * 2022-12-21 2025-08-01 华为技术有限公司 双波长激光器

Citations (2)

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US6038204A (en) * 1997-07-10 2000-03-14 Lg Electronics Inc. Optical source module for generating beams with different wavelengths
US6937405B2 (en) * 2000-03-03 2005-08-30 Ricoh Company, Ltd. Optical pickup projecting two laser beams from apparently approximated light-emitting points

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US4137123A (en) * 1975-12-31 1979-01-30 Motorola, Inc. Texture etching of silicon: method
JPS61153360U (https=) * 1985-03-14 1986-09-22
US4995045A (en) * 1990-02-01 1991-02-19 Northern Telecom Limited Laser control circuit
JPH06318339A (ja) * 1993-05-07 1994-11-15 Hitachi Ltd 光ピックアップ及び光ディスク装置
US6151342A (en) * 1997-12-08 2000-11-21 Coherent, Inc. Bright diode-laser light-source
JP2000114655A (ja) * 1998-09-30 2000-04-21 Toshiba Corp サブマウントミラー方式面型レーザ
EP1209671A4 (en) * 1999-08-04 2005-05-04 Hitachi Ltd LASER MODULE AND OPTICAL HEAD
JP2001217500A (ja) * 1999-11-25 2001-08-10 Matsushita Electric Ind Co Ltd 半導体装置及び光ピックアップ装置
JP3732993B2 (ja) * 2000-02-09 2006-01-11 シャープ株式会社 太陽電池セルおよびその製造方法
JP2002117566A (ja) * 2000-10-03 2002-04-19 Teac Corp 光ピックアップ装置
JP2002133869A (ja) * 2000-10-30 2002-05-10 Mitsubishi Electric Corp 半導体記憶装置
US6469843B2 (en) * 2000-12-14 2002-10-22 Agere Systems Guardian Corp. Optical bench assembly and fabrication method
JP4271993B2 (ja) * 2003-05-29 2009-06-03 株式会社日立製作所 光モジュール

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6038204A (en) * 1997-07-10 2000-03-14 Lg Electronics Inc. Optical source module for generating beams with different wavelengths
US6937405B2 (en) * 2000-03-03 2005-08-30 Ricoh Company, Ltd. Optical pickup projecting two laser beams from apparently approximated light-emitting points

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102370853B1 (ko) * 2020-10-26 2022-03-07 (주)큐에스아이 다채널 및 다중빔 구동 표면실장형 레이저 다이오드

Also Published As

Publication number Publication date
KR20080007531A (ko) 2008-01-22
US20080013584A1 (en) 2008-01-17
TW200807830A (en) 2008-02-01
JP5646130B2 (ja) 2014-12-24
TWI412195B (zh) 2013-10-11
US7675955B2 (en) 2010-03-09
JP2008028391A (ja) 2008-02-07

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