KR101326992B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR101326992B1
KR101326992B1 KR1020110058552A KR20110058552A KR101326992B1 KR 101326992 B1 KR101326992 B1 KR 101326992B1 KR 1020110058552 A KR1020110058552 A KR 1020110058552A KR 20110058552 A KR20110058552 A KR 20110058552A KR 101326992 B1 KR101326992 B1 KR 101326992B1
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KR
South Korea
Prior art keywords
chamber
guide rail
lid
cover
vacuum
Prior art date
Application number
KR1020110058552A
Other languages
English (en)
Korean (ko)
Other versions
KR20110140084A (ko
Inventor
요시투구 다나카
가즈나리 하토리
도시히로 가사하라
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20110140084A publication Critical patent/KR20110140084A/ko
Application granted granted Critical
Publication of KR101326992B1 publication Critical patent/KR101326992B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
KR1020110058552A 2010-06-24 2011-06-16 기판 처리 장치 KR101326992B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-144125 2010-06-24
JP2010144125A JP5585238B2 (ja) 2010-06-24 2010-06-24 基板処理装置

Publications (2)

Publication Number Publication Date
KR20110140084A KR20110140084A (ko) 2011-12-30
KR101326992B1 true KR101326992B1 (ko) 2013-11-13

Family

ID=45359373

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110058552A KR101326992B1 (ko) 2010-06-24 2011-06-16 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP5585238B2 (zh)
KR (1) KR101326992B1 (zh)
CN (1) CN102299046B (zh)
TW (1) TW201205711A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5575558B2 (ja) * 2010-06-30 2014-08-20 東京エレクトロン株式会社 処理装置
JP6596372B2 (ja) * 2016-03-22 2019-10-23 株式会社荏原製作所 基板ホルダ及びめっき装置
WO2018008113A1 (ja) * 2016-07-06 2018-01-11 富士機械製造株式会社 回路形成装置
JP7090469B2 (ja) * 2018-05-15 2022-06-24 東京エレクトロン株式会社 基板処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6565662B2 (en) 1999-12-22 2003-05-20 Tokyo Electron Limited Vacuum processing apparatus for semiconductor process
KR20060025214A (ko) * 2003-05-30 2006-03-20 동경 엘렉트론 주식회사 진공 처리실의 덮개 개폐 기구 및 덮개 개폐 방법
KR20080080923A (ko) * 2007-03-02 2008-09-05 에이에스엠 저펜 가부시기가이샤 클러스터형 반도체 처리 장치
KR20090111585A (ko) * 2008-04-22 2009-10-27 주식회사 에이디피엔지니어링 기판처리장치 및 기판처리장치 내부의 공정공간을 개폐하는방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745684A (ja) * 1993-07-27 1995-02-14 Kokusai Electric Co Ltd 半導体製造装置の処理室
JP3694388B2 (ja) * 1997-05-26 2005-09-14 株式会社日立国際電気 半導体製造装置
JPH1140643A (ja) * 1997-07-22 1999-02-12 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000021946A (ja) * 1998-06-29 2000-01-21 C Bui Res:Kk 半導体製造装置
US7211461B2 (en) * 2003-02-14 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
JP4285642B2 (ja) * 2003-08-12 2009-06-24 東京エレクトロン株式会社 真空容器
KR20050086265A (ko) * 2004-02-25 2005-08-30 주식회사 에이디피엔지니어링 분리형 진공챔버
KR100661752B1 (ko) * 2005-02-04 2006-12-27 주식회사 에이디피엔지니어링 운반용 호이스트 지그
JP4642608B2 (ja) * 2005-08-31 2011-03-02 東京エレクトロン株式会社 基板処理装置および基板処理システム
JP4355314B2 (ja) * 2005-12-14 2009-10-28 東京エレクトロン株式会社 基板処理装置、及び該装置の蓋釣支装置
KR101446225B1 (ko) * 2008-07-11 2014-10-01 주식회사 원익아이피에스 진공처리시스템의 반송챔버
JP5526988B2 (ja) * 2010-04-28 2014-06-18 東京エレクトロン株式会社 基板処理装置及び基板処理システム
JP5488227B2 (ja) * 2010-06-07 2014-05-14 東京エレクトロン株式会社 基板処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6565662B2 (en) 1999-12-22 2003-05-20 Tokyo Electron Limited Vacuum processing apparatus for semiconductor process
KR20060025214A (ko) * 2003-05-30 2006-03-20 동경 엘렉트론 주식회사 진공 처리실의 덮개 개폐 기구 및 덮개 개폐 방법
KR20080080923A (ko) * 2007-03-02 2008-09-05 에이에스엠 저펜 가부시기가이샤 클러스터형 반도체 처리 장치
KR20090111585A (ko) * 2008-04-22 2009-10-27 주식회사 에이디피엔지니어링 기판처리장치 및 기판처리장치 내부의 공정공간을 개폐하는방법

Also Published As

Publication number Publication date
KR20110140084A (ko) 2011-12-30
TW201205711A (en) 2012-02-01
CN102299046A (zh) 2011-12-28
CN102299046B (zh) 2014-07-30
JP2012009620A (ja) 2012-01-12
JP5585238B2 (ja) 2014-09-10

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