JP5585238B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP5585238B2
JP5585238B2 JP2010144125A JP2010144125A JP5585238B2 JP 5585238 B2 JP5585238 B2 JP 5585238B2 JP 2010144125 A JP2010144125 A JP 2010144125A JP 2010144125 A JP2010144125 A JP 2010144125A JP 5585238 B2 JP5585238 B2 JP 5585238B2
Authority
JP
Japan
Prior art keywords
lid
chamber
guide rail
vacuum transfer
transfer chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010144125A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012009620A (ja
Inventor
善嗣 田中
一成 羽鳥
稔大 笠原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2010144125A priority Critical patent/JP5585238B2/ja
Priority to KR1020110058552A priority patent/KR101326992B1/ko
Priority to CN201110177543.7A priority patent/CN102299046B/zh
Priority to TW100121991A priority patent/TW201205711A/zh
Publication of JP2012009620A publication Critical patent/JP2012009620A/ja
Application granted granted Critical
Publication of JP5585238B2 publication Critical patent/JP5585238B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
JP2010144125A 2010-06-24 2010-06-24 基板処理装置 Expired - Fee Related JP5585238B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010144125A JP5585238B2 (ja) 2010-06-24 2010-06-24 基板処理装置
KR1020110058552A KR101326992B1 (ko) 2010-06-24 2011-06-16 기판 처리 장치
CN201110177543.7A CN102299046B (zh) 2010-06-24 2011-06-22 基板处理装置
TW100121991A TW201205711A (en) 2010-06-24 2011-06-23 Substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010144125A JP5585238B2 (ja) 2010-06-24 2010-06-24 基板処理装置

Publications (2)

Publication Number Publication Date
JP2012009620A JP2012009620A (ja) 2012-01-12
JP5585238B2 true JP5585238B2 (ja) 2014-09-10

Family

ID=45359373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010144125A Expired - Fee Related JP5585238B2 (ja) 2010-06-24 2010-06-24 基板処理装置

Country Status (4)

Country Link
JP (1) JP5585238B2 (zh)
KR (1) KR101326992B1 (zh)
CN (1) CN102299046B (zh)
TW (1) TW201205711A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5575558B2 (ja) * 2010-06-30 2014-08-20 東京エレクトロン株式会社 処理装置
JP6596372B2 (ja) * 2016-03-22 2019-10-23 株式会社荏原製作所 基板ホルダ及びめっき装置
WO2018008113A1 (ja) * 2016-07-06 2018-01-11 富士機械製造株式会社 回路形成装置
JP7090469B2 (ja) * 2018-05-15 2022-06-24 東京エレクトロン株式会社 基板処理装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745684A (ja) * 1993-07-27 1995-02-14 Kokusai Electric Co Ltd 半導体製造装置の処理室
JP3694388B2 (ja) * 1997-05-26 2005-09-14 株式会社日立国際電気 半導体製造装置
JPH1140643A (ja) * 1997-07-22 1999-02-12 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000021946A (ja) * 1998-06-29 2000-01-21 C Bui Res:Kk 半導体製造装置
JP3527450B2 (ja) 1999-12-22 2004-05-17 東京エレクトロン株式会社 処理装置
US7211461B2 (en) * 2003-02-14 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
JP4302575B2 (ja) * 2003-05-30 2009-07-29 東京エレクトロン株式会社 基板搬送装置および真空処理装置
JP4285642B2 (ja) * 2003-08-12 2009-06-24 東京エレクトロン株式会社 真空容器
KR20050086265A (ko) * 2004-02-25 2005-08-30 주식회사 에이디피엔지니어링 분리형 진공챔버
KR100661752B1 (ko) * 2005-02-04 2006-12-27 주식회사 에이디피엔지니어링 운반용 호이스트 지그
JP4642608B2 (ja) * 2005-08-31 2011-03-02 東京エレクトロン株式会社 基板処理装置および基板処理システム
JP4355314B2 (ja) * 2005-12-14 2009-10-28 東京エレクトロン株式会社 基板処理装置、及び該装置の蓋釣支装置
US8758514B2 (en) * 2007-03-02 2014-06-24 Asm Japan K.K. Cluster type semiconductor processing apparatus
KR101036186B1 (ko) * 2008-04-22 2011-05-23 엘아이지에이디피 주식회사 기판처리장치
KR101446225B1 (ko) * 2008-07-11 2014-10-01 주식회사 원익아이피에스 진공처리시스템의 반송챔버
JP5526988B2 (ja) * 2010-04-28 2014-06-18 東京エレクトロン株式会社 基板処理装置及び基板処理システム
JP5488227B2 (ja) * 2010-06-07 2014-05-14 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
KR20110140084A (ko) 2011-12-30
TW201205711A (en) 2012-02-01
CN102299046A (zh) 2011-12-28
KR101326992B1 (ko) 2013-11-13
CN102299046B (zh) 2014-07-30
JP2012009620A (ja) 2012-01-12

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