KR101300576B1 - 물리량 센서 및 전자 기기 - Google Patents

물리량 센서 및 전자 기기 Download PDF

Info

Publication number
KR101300576B1
KR101300576B1 KR1020110048430A KR20110048430A KR101300576B1 KR 101300576 B1 KR101300576 B1 KR 101300576B1 KR 1020110048430 A KR1020110048430 A KR 1020110048430A KR 20110048430 A KR20110048430 A KR 20110048430A KR 101300576 B1 KR101300576 B1 KR 101300576B1
Authority
KR
South Korea
Prior art keywords
oscillator
region
electrode
axis
movable electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020110048430A
Other languages
English (en)
Korean (ko)
Other versions
KR20110131106A (ko
Inventor
케이 가네모토
Original Assignee
세이코 엡슨 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세이코 엡슨 가부시키가이샤 filed Critical 세이코 엡슨 가부시키가이샤
Publication of KR20110131106A publication Critical patent/KR20110131106A/ko
Application granted granted Critical
Publication of KR101300576B1 publication Critical patent/KR101300576B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
    • G01P2015/0831—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
KR1020110048430A 2010-05-28 2011-05-23 물리량 센서 및 전자 기기 Expired - Fee Related KR101300576B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010122959A JP5527019B2 (ja) 2010-05-28 2010-05-28 物理量センサーおよび電子機器
JPJP-P-2010-122959 2010-05-28

Publications (2)

Publication Number Publication Date
KR20110131106A KR20110131106A (ko) 2011-12-06
KR101300576B1 true KR101300576B1 (ko) 2013-08-27

Family

ID=44117957

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110048430A Expired - Fee Related KR101300576B1 (ko) 2010-05-28 2011-05-23 물리량 센서 및 전자 기기

Country Status (6)

Country Link
US (2) US8736254B2 (enExample)
EP (1) EP2390671A3 (enExample)
JP (1) JP5527019B2 (enExample)
KR (1) KR101300576B1 (enExample)
CN (1) CN102313821B (enExample)
TW (2) TWI471567B (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5527019B2 (ja) * 2010-05-28 2014-06-18 セイコーエプソン株式会社 物理量センサーおよび電子機器
US8539836B2 (en) * 2011-01-24 2013-09-24 Freescale Semiconductor, Inc. MEMS sensor with dual proof masses
TWI616395B (zh) * 2012-01-12 2018-03-01 村田電子公司 加速度感測器結構和其之使用
JP5999302B2 (ja) 2012-02-09 2016-09-28 セイコーエプソン株式会社 電子デバイスおよびその製造方法、並びに電子機器
JP5983912B2 (ja) 2012-02-09 2016-09-06 セイコーエプソン株式会社 電子デバイスおよびその製造方法、並びに電子機器
JP2013181855A (ja) * 2012-03-02 2013-09-12 Seiko Epson Corp 物理量センサーおよび電子機器
TWI547808B (zh) 2012-04-20 2016-09-01 緯創資通股份有限公司 資訊交換方法及資訊交換系統
JP6002481B2 (ja) * 2012-07-06 2016-10-05 日立オートモティブシステムズ株式会社 慣性センサ
JP6230285B2 (ja) * 2012-08-24 2017-11-15 セイコーインスツル株式会社 電子デバイス、ｍｅｍｓセンサ及び電子デバイスの製造方法
JP5799929B2 (ja) * 2012-10-02 2015-10-28 株式会社村田製作所 加速度センサ
US9316666B2 (en) * 2012-11-27 2016-04-19 Murata Manufacturing Co., Ltd. Acceleration sensor having a capacitor array located in the center of an inertial mass
DE102013208534A1 (de) * 2012-12-27 2014-07-03 Robert Bosch Gmbh Verfahren zum Herstellen eines Sensorgehäuses sowie entsprechendes Sensorgehäuse
US10046964B2 (en) 2013-03-07 2018-08-14 MCube Inc. MEMS structure with improved shielding and method
US9075079B2 (en) * 2013-03-07 2015-07-07 MCube Inc. Method and structure of an integrated MEMS inertial sensor device using electrostatic quadrature-cancellation
US10309997B2 (en) * 2013-03-15 2019-06-04 Infineon Technologies Ag Apparatus and a method for generating a sensor signal indicating information on a capacitance of a variable capacitor comprising a variable capacitance
ITTO20130237A1 (it) * 2013-03-22 2014-09-23 St Microelectronics Srl Struttura microelettromeccanica di rilevamento ad asse z ad elevata sensibilita', in particolare per un accelerometro mems
JP6150056B2 (ja) * 2013-07-24 2017-06-21 セイコーエプソン株式会社 機能素子、電子機器、および移動体
JP6146566B2 (ja) * 2013-08-06 2017-06-14 セイコーエプソン株式会社 物理量センサー、電子機器、および移動体
US9695515B2 (en) * 2013-08-30 2017-07-04 Hewlett-Packard Development Company, L.P. Substrate etch
US9551730B2 (en) 2014-07-02 2017-01-24 Merlin Technology, Inc. Mechanical shock resistant MEMS accelerometer arrangement, associated method, apparatus and system
RU2580637C1 (ru) * 2014-12-16 2016-04-10 Открытое акционерное общество Арзамасское научно-производственное предприятие "ТЕМП-АВИА" (ОАО АНПП "ТЕМП-АВИА") Емкостный датчик перемещений
JP2016176834A (ja) * 2015-03-20 2016-10-06 セイコーエプソン株式会社 ジャイロセンサー、電子機器、および移動体
US10234476B2 (en) 2015-05-20 2019-03-19 Google Llc Extracting inertial information from nonlinear periodic signals
US9797921B2 (en) * 2015-09-03 2017-10-24 Nxp Usa, Inc. Compensation and calibration of multiple mass MEMS sensor
CN108450010B (zh) * 2015-09-25 2021-01-05 株式会社村田制作所 改进的微机电加速计装置
JP6468167B2 (ja) * 2015-11-03 2019-02-13 株式会社デンソー 力学量センサ
JP6705168B2 (ja) * 2015-12-28 2020-06-03 セイコーエプソン株式会社 センサー用基板、物理量検出センサー、加速度センサー、電子機器、および移動体
DE102016207866B4 (de) * 2016-05-09 2025-02-27 Robert Bosch Gmbh Mikromechanischer Sensor und Verfahren zum Herstellen eines mikromechanischen Sensors
US10234477B2 (en) 2016-07-27 2019-03-19 Google Llc Composite vibratory in-plane accelerometer
US10239746B2 (en) 2016-11-11 2019-03-26 Analog Devices, Inc. Vertical stopper for capping MEMS devices
JP6897224B2 (ja) * 2017-03-27 2021-06-30 セイコーエプソン株式会社 物理量センサー、電子機器、および移動体
CN107421526B (zh) * 2017-07-04 2020-05-05 东南大学 一种仿生双轴毛发传感器装置
EP3794356B1 (en) * 2018-05-15 2023-05-10 Murata Manufacturing Co., Ltd. Vibration damping in mems acceleration sensors
RU204922U1 (ru) * 2019-03-19 2021-06-17 Российская Федерация, От Имени Которой Выступает Министерство Промышленности И Торговли Российской Федерации Чувствительный элемент трехосевого микромеханического акселерометра
EP4116718A1 (en) 2021-07-05 2023-01-11 Murata Manufacturing Co., Ltd. Seesaw accelerometer
JP2023146375A (ja) 2022-03-29 2023-10-12 セイコーエプソン株式会社 物理量センサー及び慣性計測装置
CN115453146B (zh) * 2022-09-23 2025-12-19 瑞声开泰科技(武汉)有限公司 电容式微机械加速度计

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070220973A1 (en) * 2005-08-12 2007-09-27 Cenk Acar Multi-axis micromachined accelerometer and rate sensor
JP2008292451A (ja) * 2007-01-19 2008-12-04 Stmicroelectronics Srl 酸素吸収剤及び耐膨潤性、耐剥離性及び表面平滑性に優れた脱酸素性容器

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1640726U (de) 1951-12-01 1952-07-10 Ernst Reuss Wagenaufhaltevorrichtung fuer foerderwagen.
US6199874B1 (en) * 1993-05-26 2001-03-13 Cornell Research Foundation Inc. Microelectromechanical accelerometer for automotive applications
US5488864A (en) 1994-12-19 1996-02-06 Ford Motor Company Torsion beam accelerometer with slotted tilt plate
DE19541388A1 (de) 1995-11-07 1997-05-15 Telefunken Microelectron Mikromechanischer Beschleunigungssensor
US6928872B2 (en) * 2001-04-27 2005-08-16 Stmicroelectronics S.R.L. Integrated gyroscope of semiconductor material with at least one sensitive axis in the sensor plane
JP2005221450A (ja) * 2004-02-09 2005-08-18 Yamaha Corp 物理量センサ
DE602004023082D1 (de) * 2004-09-22 2009-10-22 St Microelectronics Srl Mikro-Elektromechanische Struktur mit Selbstkompensation von durch thermomechanische Spannungen hervorgerufenen thermischen Driften
JP4975972B2 (ja) * 2005-03-15 2012-07-11 日立オートモティブシステムズ株式会社 物理量センサ
DE102006058747A1 (de) 2006-12-12 2008-06-19 Robert Bosch Gmbh Mikromechanischer z-Sensor
US7578190B2 (en) * 2007-08-03 2009-08-25 Freescale Semiconductor, Inc. Symmetrical differential capacitive sensor and method of making same
US8079262B2 (en) 2007-10-26 2011-12-20 Rosemount Aerospace Inc. Pendulous accelerometer with balanced gas damping
CN101999081B (zh) * 2008-04-11 2013-01-02 三菱电机株式会社 加速度传感器
JP5470767B2 (ja) * 2008-07-28 2014-04-16 富士通株式会社 マイクロ可動素子製造方法
DE102008040855B4 (de) * 2008-07-30 2022-05-25 Robert Bosch Gmbh Dreiachsiger Beschleunigungssensor
TWI374268B (en) * 2008-09-05 2012-10-11 Ind Tech Res Inst Multi-axis capacitive accelerometer
DE102008042357A1 (de) * 2008-09-25 2010-04-01 Robert Bosch Gmbh Mikromechanischer Sensor mit symmetrischem Flächenaufbau bei asymmetrischer Massenverteilung
JP5527019B2 (ja) * 2010-05-28 2014-06-18 セイコーエプソン株式会社 物理量センサーおよび電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070220973A1 (en) * 2005-08-12 2007-09-27 Cenk Acar Multi-axis micromachined accelerometer and rate sensor
JP2008292451A (ja) * 2007-01-19 2008-12-04 Stmicroelectronics Srl 酸素吸収剤及び耐膨潤性、耐剥離性及び表面平滑性に優れた脱酸素性容器

Also Published As

Publication number Publication date
US20140224017A1 (en) 2014-08-14
US8736254B2 (en) 2014-05-27
CN102313821B (zh) 2013-03-20
TW201514498A (zh) 2015-04-16
US20110291644A1 (en) 2011-12-01
TWI524071B (zh) 2016-03-01
US9157927B2 (en) 2015-10-13
JP2011247812A (ja) 2011-12-08
JP5527019B2 (ja) 2014-06-18
TW201200876A (en) 2012-01-01
EP2390671A2 (en) 2011-11-30
KR20110131106A (ko) 2011-12-06
CN102313821A (zh) 2012-01-11
EP2390671A3 (en) 2011-12-28
TWI471567B (zh) 2015-02-01

Similar Documents

Publication Publication Date Title
KR101300576B1 (ko) 물리량 센서 및 전자 기기
US11808574B2 (en) Micromechanical detection structure of a MEMS multi-axis gyroscope, with reduced drifts of corresponding electrical parameters
US10209269B2 (en) Z-axis microelectromechanical detection structure with reduced drifts
US10598690B2 (en) Microelectromechanical device incorporating a gyroscope and an accelerometer
CN105372451B (zh) 物理量传感器、物理量传感器装置、电子设备以及移动体
US7258011B2 (en) Multiple axis accelerometer
CN102313820A (zh) 元件结构体、惯性传感器以及电子设备
JP5831582B2 (ja) 物理量センサーおよび電子機器
EP2284545A2 (en) Coplanar proofmasses employable to sense acceleration along three axes
EP3951403A1 (en) Microelectromechanical sensor device with improved stability to stress
EP4187258A1 (en) Z-axis microelectromechanical sensor device with improved stress insensitivity
TW201546452A (zh) 電子裝置、電子機器及移動體
CN114485599B (zh) 物理量传感器、物理量传感器器件以及惯性测量装置
JP2001194153A (ja) 角速度センサ、加速度センサおよび製造方法
CN114518471A (zh) 物理量传感器、物理量传感器器件以及惯性测量装置
JP2015125124A (ja) 多軸センサ
JP7188311B2 (ja) ジャイロセンサー、電子機器、及び移動体
JP6544058B2 (ja) 物理量センサー、電子機器および移動体
JP2022022024A (ja) 慣性センサー、慣性計測装置、及び慣性センサーの製造方法
US20240142235A1 (en) Microelectromechanical gyroscope with detection of angular velocity along a vertical axis
CN115727840A (zh) 惯性传感器和电子设备

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20160720

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20170720

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20180801

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20190730

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20200822

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20200822