JP5470767B2 - マイクロ可動素子製造方法 - Google Patents
マイクロ可動素子製造方法 Download PDFInfo
- Publication number
- JP5470767B2 JP5470767B2 JP2008193189A JP2008193189A JP5470767B2 JP 5470767 B2 JP5470767 B2 JP 5470767B2 JP 2008193189 A JP2008193189 A JP 2008193189A JP 2008193189 A JP2008193189 A JP 2008193189A JP 5470767 B2 JP5470767 B2 JP 5470767B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- comb
- micro movable
- electrode
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00777—Preserve existing structures from alteration, e.g. temporary protection during manufacturing
- B81C1/00825—Protect against mechanical threats, e.g. against shocks, or residues
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
- G02B6/3512—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
- G02B6/3518—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/354—Switching arrangements, i.e. number of input/output ports and interconnection types
- G02B6/3554—3D constellations, i.e. with switching elements and switched beams located in a volume
- G02B6/3556—NxM switch, i.e. regular arrays of switches elements of matrix type constellation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/042—Micromirrors, not used as optical switches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0145—Flexible holders
- B81B2203/0154—Torsion bars
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q2213/00—Indexing scheme relating to selecting arrangements in general and for multiplex systems
- H04Q2213/13003—Constructional details of switching devices
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Micromachines (AREA)
- Gyroscopes (AREA)
- Pressure Sensors (AREA)
Description
10,91 揺動部
20,30,92 フレーム
21,31,51,92a 第1層部
22,32,52,92b 第2層部
40,50,93 トーションバー
61〜68,94〜97 櫛歯電極
71,72,98 サポートビーム
A1,A2,B 軸心
Claims (3)
- 可動部と、フレームと、当該可動部およびフレームを連結する連結部とを有するマイクロ可動素子を、材料基板に対して加工を施すことによって製造するための方法であって、
前記材料基板に前記可動部、前記フレーム、および前記連結部を作り込む成形工程と、
前記成形工程の途中において、前記材料基板の表面にフィルム材料を貼り合せ、当該フィルム材料をパターニングすることにより、前記可動部および前記フレームを架橋するための絶縁材料よりなるサポート構造体を形成する工程と、
前記サポート構造体の少なくとも一部をレーザを照射することにより除去する除去工程と、
を含むマイクロ可動素子製造方法。 - 前記サポート構造体の幅は前記可動部と前記フレームとの間隔より小さい、請求項1に記載のマイクロ可動素子製造方法。
- 前記除去工程は、サポート構造体付きマイクロ可動素子を基材に組み込むアセンブリ工程の後に行う、請求項1または2に記載のマイクロ可動素子製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008193189A JP5470767B2 (ja) | 2008-07-28 | 2008-07-28 | マイクロ可動素子製造方法 |
US12/509,584 US8202382B2 (en) | 2008-07-28 | 2009-07-27 | Method for manufacturing micro movable element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008193189A JP5470767B2 (ja) | 2008-07-28 | 2008-07-28 | マイクロ可動素子製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010029966A JP2010029966A (ja) | 2010-02-12 |
JP5470767B2 true JP5470767B2 (ja) | 2014-04-16 |
Family
ID=41567568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008193189A Expired - Fee Related JP5470767B2 (ja) | 2008-07-28 | 2008-07-28 | マイクロ可動素子製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8202382B2 (ja) |
JP (1) | JP5470767B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008059634B4 (de) * | 2008-11-28 | 2012-12-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mikromechanischer Aktuator mit elektrostatischem Kamm-Antrieb |
DE102009026507A1 (de) * | 2009-05-27 | 2010-12-02 | Robert Bosch Gmbh | Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil |
JP5423577B2 (ja) * | 2010-05-13 | 2014-02-19 | 株式会社豊田中央研究所 | 可動体、2軸角速度センサおよび3軸加速度センサ |
JP5527019B2 (ja) * | 2010-05-28 | 2014-06-18 | セイコーエプソン株式会社 | 物理量センサーおよび電子機器 |
JP6175868B2 (ja) * | 2013-04-03 | 2017-08-09 | 株式会社豊田中央研究所 | Mems装置 |
JP6020392B2 (ja) * | 2013-09-03 | 2016-11-02 | 株式会社デンソー | 加速度センサ |
JP5696756B2 (ja) * | 2013-09-12 | 2015-04-08 | 株式会社豊田中央研究所 | Memsセンサ |
JP5831582B2 (ja) * | 2014-04-17 | 2015-12-09 | セイコーエプソン株式会社 | 物理量センサーおよび電子機器 |
DE102014211546B4 (de) * | 2014-06-17 | 2022-08-25 | Robert Bosch Gmbh | Mikrospiegelanordnung |
DE102015204874A1 (de) * | 2015-03-18 | 2016-09-22 | Carl Zeiss Smt Gmbh | Einrichtung zur Verschwenkung eines Spiegel-Elements mit zwei Schwenk-Freiheitsgraden |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69916782D1 (de) * | 1999-02-26 | 2004-06-03 | St Microelectronics Srl | Verfahren zur Herstellung mechanischer, elektromechanischer und opto-elektromechanischer Mikrostrukturen mit aufgehängten Regionen welche während des Zusammenbaus mechanischen Spannungen ausgesetzt sind |
JP3577693B2 (ja) * | 2000-03-14 | 2004-10-13 | 日本航空電子工業株式会社 | 微小可動デバイスおよびその製造方法 |
JP2003019700A (ja) | 2001-07-06 | 2003-01-21 | Canon Inc | マイクロ構造体、およびその作製方法 |
JP2004066379A (ja) | 2002-08-05 | 2004-03-04 | Denso Corp | マイクロ構造体の製造方法 |
US7168318B2 (en) * | 2002-08-12 | 2007-01-30 | California Institute Of Technology | Isolated planar mesogyroscope |
JP2004341364A (ja) | 2003-05-16 | 2004-12-02 | Ricoh Co Ltd | 振動ミラーとその製造方法、光走査モジュール、光書込装置、画像形成装置 |
US7458263B2 (en) * | 2003-10-20 | 2008-12-02 | Invensense Inc. | Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
US6939473B2 (en) * | 2003-10-20 | 2005-09-06 | Invensense Inc. | Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
JP4536462B2 (ja) | 2004-09-06 | 2010-09-01 | 日本信号株式会社 | プレーナ型アクチュエータ及びその製造方法 |
US20070209437A1 (en) * | 2005-10-18 | 2007-09-13 | Seagate Technology Llc | Magnetic MEMS device |
US7621183B2 (en) * | 2005-11-18 | 2009-11-24 | Invensense Inc. | X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
CN101133332B (zh) * | 2005-11-22 | 2011-01-26 | 凯奥尼克公司 | 三轴加速度计 |
US7469588B2 (en) * | 2006-05-16 | 2008-12-30 | Honeywell International Inc. | MEMS vertical comb drive with improved vibration performance |
JP4919750B2 (ja) * | 2006-09-27 | 2012-04-18 | 富士通株式会社 | マイクロ構造体製造方法およびマイクロ構造体 |
-
2008
- 2008-07-28 JP JP2008193189A patent/JP5470767B2/ja not_active Expired - Fee Related
-
2009
- 2009-07-27 US US12/509,584 patent/US8202382B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8202382B2 (en) | 2012-06-19 |
US20100018635A1 (en) | 2010-01-28 |
JP2010029966A (ja) | 2010-02-12 |
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