KR101273871B1 - 다이싱ㆍ다이본딩 테이프 및 반도체칩의 제조 방법 - Google Patents

다이싱ㆍ다이본딩 테이프 및 반도체칩의 제조 방법 Download PDF

Info

Publication number
KR101273871B1
KR101273871B1 KR1020097021623A KR20097021623A KR101273871B1 KR 101273871 B1 KR101273871 B1 KR 101273871B1 KR 1020097021623 A KR1020097021623 A KR 1020097021623A KR 20097021623 A KR20097021623 A KR 20097021623A KR 101273871 B1 KR101273871 B1 KR 101273871B1
Authority
KR
South Korea
Prior art keywords
film
die
dicing
bonding
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020097021623A
Other languages
English (en)
Korean (ko)
Other versions
KR20100015636A (ko
Inventor
고우지 와따나베
마사떼루 후꾸오까
쇼따 마쯔다
요시유끼 다께베
Original Assignee
세키스이가가쿠 고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20100015636A publication Critical patent/KR20100015636A/ko
Application granted granted Critical
Publication of KR101273871B1 publication Critical patent/KR101273871B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
KR1020097021623A 2007-04-19 2008-01-16 다이싱ㆍ다이본딩 테이프 및 반도체칩의 제조 방법 Expired - Fee Related KR101273871B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2007-110270 2007-04-19
JP2007110270 2007-04-19
JPJP-P-2007-188004 2007-07-19
JP2007188004 2007-07-19
PCT/JP2008/050407 WO2008132852A1 (ja) 2007-04-19 2008-01-16 ダイシング・ダイボンディングテープ及び半導体チップの製造方法

Publications (2)

Publication Number Publication Date
KR20100015636A KR20100015636A (ko) 2010-02-12
KR101273871B1 true KR101273871B1 (ko) 2013-06-11

Family

ID=39925323

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097021623A Expired - Fee Related KR101273871B1 (ko) 2007-04-19 2008-01-16 다이싱ㆍ다이본딩 테이프 및 반도체칩의 제조 방법

Country Status (4)

Country Link
JP (3) JPWO2008132852A1 (https=)
KR (1) KR101273871B1 (https=)
TW (1) TWI414010B (https=)
WO (1) WO2008132852A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192856A (ja) * 2009-02-20 2010-09-02 Furukawa Electric Co Ltd:The ウエハ加工用フィルム
US9305769B2 (en) 2009-06-30 2016-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. Thin wafer handling method
US8871609B2 (en) * 2009-06-30 2014-10-28 Taiwan Semiconductor Manufacturing Company, Ltd. Thin wafer handling structure and method
JP5512262B2 (ja) * 2009-12-26 2014-06-04 株式会社朝日ラバー レンズアレイシート及びそれのダイシング方法
JP5566141B2 (ja) * 2010-03-15 2014-08-06 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP2012129473A (ja) * 2010-12-17 2012-07-05 Sekisui Chem Co Ltd ダイシング−ダイボンディングテープ
JP5946650B2 (ja) * 2012-02-21 2016-07-06 積水化学工業株式会社 ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法
JP6107230B2 (ja) * 2013-02-28 2017-04-05 住友ベークライト株式会社 ダイシングフィルム
US10030174B2 (en) 2013-03-27 2018-07-24 Lintec Corporation Composite sheet for forming protective film
CN113715458A (zh) * 2014-08-05 2021-11-30 库利克和索夫工业公司 用于传送分立元件的方法和装置
KR20160095526A (ko) 2015-02-03 2016-08-11 도레이첨단소재 주식회사 반도체용 다이싱 다이본딩 필름
SG11201808291YA (en) * 2016-03-30 2018-10-30 Lintec Corp Semiconductor processing sheet
KR102445025B1 (ko) * 2016-04-28 2022-09-20 린텍 가부시키가이샤 보호막 형성용 필름 및 보호막 형성용 복합 시트
JP7280661B2 (ja) * 2017-12-28 2023-05-24 日東電工株式会社 ダイシングダイボンドフィルム
JP6719489B2 (ja) * 2018-01-31 2020-07-08 古河電気工業株式会社 マスク一体型表面保護テープおよびマスク一体型表面保護テープを用いる半導体チップの製造方法
KR102898634B1 (ko) * 2021-05-25 2025-12-09 삼성전자주식회사 디본딩 테이프 및 이를 이용한 반도체 웨이퍼의 가공 방법
TW202521657A (zh) * 2023-10-04 2025-06-01 日商力森諾科股份有限公司 聚合物、固化性樹脂組成物、樹脂固化物、接著劑組成物、膜狀接著劑及接著片

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165074A (ja) 2004-12-03 2006-06-22 Sumitomo Bakelite Co Ltd ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法
JP2007012670A (ja) 2005-06-28 2007-01-18 Furukawa Electric Co Ltd:The 粘接着テープ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3280876B2 (ja) * 1996-01-22 2002-05-13 日本テキサス・インスツルメンツ株式会社 ウェハダイシング・接着用シートおよび半導体装置の製造方法
JP4623694B2 (ja) * 2000-12-28 2011-02-02 日東電工株式会社 ダイシング用粘着シート
JP2003142505A (ja) * 2001-10-31 2003-05-16 Lintec Corp ウエハダイシング・接着用シートおよび半導体装置の製造方法
JP4107417B2 (ja) * 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
JP2005019841A (ja) * 2003-06-27 2005-01-20 Nitto Denko Corp 紫外線硬化型粘着テープの貼付け方法およびその装置並びにそれを用いて形成した物品
JP4934284B2 (ja) * 2004-03-15 2012-05-16 日立化成工業株式会社 ダイシングダイボンドシート
JP4443962B2 (ja) * 2004-03-17 2010-03-31 日東電工株式会社 ダイシング・ダイボンドフィルム
WO2005103180A1 (ja) * 2004-04-20 2005-11-03 Hitachi Chemical Co., Ltd. 接着シート、半導体装置、及び半導体装置の製造方法
JP2006203000A (ja) * 2005-01-20 2006-08-03 Sekisui Chem Co Ltd ダイシング用粘着テープおよび半導体チップの製造方法
JP2006216773A (ja) * 2005-02-03 2006-08-17 Lintec Corp ダイシングシートおよび電子部品の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165074A (ja) 2004-12-03 2006-06-22 Sumitomo Bakelite Co Ltd ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法
JP2007012670A (ja) 2005-06-28 2007-01-18 Furukawa Electric Co Ltd:The 粘接着テープ

Also Published As

Publication number Publication date
JPWO2008132852A1 (ja) 2010-07-22
KR20100015636A (ko) 2010-02-12
TW200842957A (en) 2008-11-01
WO2008132852A1 (ja) 2008-11-06
TWI414010B (zh) 2013-11-01
JP5268575B2 (ja) 2013-08-21
JP2011176327A (ja) 2011-09-08
JP2009065191A (ja) 2009-03-26

Similar Documents

Publication Publication Date Title
KR101273871B1 (ko) 다이싱ㆍ다이본딩 테이프 및 반도체칩의 제조 방법
KR101461243B1 (ko) 다이싱·다이본딩 테이프 및 반도체 칩의 제조 방법
KR101488047B1 (ko) 다이싱-다이본딩 테이프 및 반도체 칩의 제조 방법
JP2009065191A5 (https=)
TWI592458B (zh) A dicing sheet having a protective film forming layer, and a method of manufacturing the wafer
CN107075322A (zh) 半导体晶片表面保护用胶带和半导体晶片的加工方法
JP5303330B2 (ja) ダイシングテープ及び半導体チップの製造方法
CN101669194A (zh) 切片及芯片接合带和半导体芯片的制造方法
JP5319993B2 (ja) ダイシング−ダイボンディングテープ及び半導体チップの製造方法
JP2009239190A (ja) ダイシング・ダイボンディングテープ
CN105658422A (zh) 树脂膜形成用片材
JP5486831B2 (ja) ダイシングテープ及び半導体チップの製造方法
JP2011023692A (ja) ダイシング−ダイボンディングテープ及びその製造方法、並びに半導体チップの製造方法
JP2011199015A (ja) ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法
JP2011054707A (ja) ダイシング−ダイボンディングテープ及び半導体チップの製造方法
JP2010287848A (ja) ダイシング−ダイボンディングテープ及び半導体チップの製造方法
JP5486829B2 (ja) ダイシングテープ及びその製造方法、並びに半導体チップの製造方法
JP2009295864A (ja) 基材フィルムの製造方法及びダイシング・ダイボンディングテープ
JP2010067772A (ja) ダイシング−ダイボンディングテープ及び半導体チップの製造方法
KR102791056B1 (ko) 신규한 웨이퍼 백그라인딩 테이프와 이의 제조방법
JP5486830B2 (ja) ダイシングテープ及び半導体チップの製造方法
CN116891614A (zh) 保护膜形成膜、保护膜形成用复合片、半导体装置的制造方法及保护膜形成膜的用途
JP2009295863A (ja) ダイシング・ダイボンディングテープ

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20160517

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20170522

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20180517

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20190515

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20230605

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20230605

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000