KR101264968B1 - 페이스트 도포 장치 - Google Patents
페이스트 도포 장치 Download PDFInfo
- Publication number
- KR101264968B1 KR101264968B1 KR1020100066737A KR20100066737A KR101264968B1 KR 101264968 B1 KR101264968 B1 KR 101264968B1 KR 1020100066737 A KR1020100066737 A KR 1020100066737A KR 20100066737 A KR20100066737 A KR 20100066737A KR 101264968 B1 KR101264968 B1 KR 101264968B1
- Authority
- KR
- South Korea
- Prior art keywords
- paste
- substrate
- value
- nozzle
- distance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
- B05C11/1018—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to distance of target
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Coating Apparatus (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009168404A JP5459833B2 (ja) | 2009-07-17 | 2009-07-17 | ペースト塗布装置 |
JPJP-P-2009-168404 | 2009-07-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110007952A KR20110007952A (ko) | 2011-01-25 |
KR101264968B1 true KR101264968B1 (ko) | 2013-05-15 |
Family
ID=43482061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100066737A Expired - Fee Related KR101264968B1 (ko) | 2009-07-17 | 2010-07-12 | 페이스트 도포 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5459833B2 (enrdf_load_stackoverflow) |
KR (1) | KR101264968B1 (enrdf_load_stackoverflow) |
CN (1) | CN101954329B (enrdf_load_stackoverflow) |
TW (1) | TWI451910B (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102655331B1 (ko) * | 2016-11-30 | 2024-04-08 | 주식회사 탑 엔지니어링 | 토출 헤드의 변위 모니터링이 가능한 도포장치 및 그의 제어방법 |
JP7347908B2 (ja) * | 2019-06-26 | 2023-09-20 | ダイハツ工業株式会社 | 高粘度材料の塗布方法、及び高粘度材料塗布装置の制御点自動生成プログラム |
CN115889082A (zh) * | 2022-12-01 | 2023-04-04 | 深圳德森精密设备有限公司 | Pcb板点胶控制方法、装置、pcb板点胶设备及存储介质 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002316082A (ja) * | 2001-04-20 | 2002-10-29 | Shibaura Mechatronics Corp | ペースト塗布装置 |
JP2007152261A (ja) | 2005-12-06 | 2007-06-21 | Shibaura Mechatronics Corp | ペースト塗布装置、ペースト塗布方法及びこれを用いた表示パネルの製造装置 |
JP2009066576A (ja) | 2007-09-18 | 2009-04-02 | Toshiba Corp | 塗布装置及び表示装置の製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11262711A (ja) * | 1998-03-18 | 1999-09-28 | Murata Mfg Co Ltd | 塗布装置 |
JP4743957B2 (ja) * | 2000-12-22 | 2011-08-10 | 東レ株式会社 | 塗液の塗布方法及び装置並びにプラズマディスプレイ部材の製造装置および製造方法 |
JP4601914B2 (ja) * | 2003-04-24 | 2010-12-22 | 芝浦メカトロニクス株式会社 | 接着剤の塗布装置及び接着剤の塗布方法 |
JP4341324B2 (ja) * | 2003-08-01 | 2009-10-07 | 株式会社日立プラントテクノロジー | 液晶パネルの製造方法及びペースト塗布装置 |
KR100696932B1 (ko) * | 2005-04-15 | 2007-03-20 | 주식회사 탑 엔지니어링 | 페이스트 도포기 및 그 제어방법 |
JP4668023B2 (ja) * | 2005-09-15 | 2011-04-13 | 芝浦メカトロニクス株式会社 | ペースト塗布装置及びペースト塗布方法 |
JP2007222762A (ja) * | 2006-02-22 | 2007-09-06 | Shibaura Mechatronics Corp | ペースト塗布装置 |
KR100649962B1 (ko) * | 2006-06-28 | 2006-11-29 | 주식회사 탑 엔지니어링 | 페이스트 디스펜서의 헤드 유닛 |
JP4758326B2 (ja) * | 2006-11-21 | 2011-08-24 | 株式会社アルバック | 塗布装置 |
JP2008146992A (ja) * | 2006-12-08 | 2008-06-26 | Toshiba Matsushita Display Technology Co Ltd | 表示装置の製造方法 |
CN101239349A (zh) * | 2007-02-06 | 2008-08-13 | 芝浦机械电子装置股份有限公司 | 浆料涂敷装置及浆料涂敷方法 |
-
2009
- 2009-07-17 JP JP2009168404A patent/JP5459833B2/ja not_active Expired - Fee Related
-
2010
- 2010-07-09 TW TW099122679A patent/TWI451910B/zh not_active IP Right Cessation
- 2010-07-12 KR KR1020100066737A patent/KR101264968B1/ko not_active Expired - Fee Related
- 2010-07-16 CN CN2010102320468A patent/CN101954329B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002316082A (ja) * | 2001-04-20 | 2002-10-29 | Shibaura Mechatronics Corp | ペースト塗布装置 |
JP2007152261A (ja) | 2005-12-06 | 2007-06-21 | Shibaura Mechatronics Corp | ペースト塗布装置、ペースト塗布方法及びこれを用いた表示パネルの製造装置 |
JP2009066576A (ja) | 2007-09-18 | 2009-04-02 | Toshiba Corp | 塗布装置及び表示装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2011020073A (ja) | 2011-02-03 |
TWI451910B (zh) | 2014-09-11 |
KR20110007952A (ko) | 2011-01-25 |
CN101954329A (zh) | 2011-01-26 |
JP5459833B2 (ja) | 2014-04-02 |
CN101954329B (zh) | 2013-05-08 |
TW201114504A (en) | 2011-05-01 |
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