KR101264968B1 - 페이스트 도포 장치 - Google Patents

페이스트 도포 장치 Download PDF

Info

Publication number
KR101264968B1
KR101264968B1 KR1020100066737A KR20100066737A KR101264968B1 KR 101264968 B1 KR101264968 B1 KR 101264968B1 KR 1020100066737 A KR1020100066737 A KR 1020100066737A KR 20100066737 A KR20100066737 A KR 20100066737A KR 101264968 B1 KR101264968 B1 KR 101264968B1
Authority
KR
South Korea
Prior art keywords
paste
substrate
value
nozzle
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020100066737A
Other languages
English (en)
Korean (ko)
Other versions
KR20110007952A (ko
Inventor
아키라 히라오카
Original Assignee
시바우라 메카트로닉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시키가이샤 filed Critical 시바우라 메카트로닉스 가부시키가이샤
Publication of KR20110007952A publication Critical patent/KR20110007952A/ko
Application granted granted Critical
Publication of KR101264968B1 publication Critical patent/KR101264968B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B05C11/1018—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to distance of target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
KR1020100066737A 2009-07-17 2010-07-12 페이스트 도포 장치 Expired - Fee Related KR101264968B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009168404A JP5459833B2 (ja) 2009-07-17 2009-07-17 ペースト塗布装置
JPJP-P-2009-168404 2009-07-17

Publications (2)

Publication Number Publication Date
KR20110007952A KR20110007952A (ko) 2011-01-25
KR101264968B1 true KR101264968B1 (ko) 2013-05-15

Family

ID=43482061

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100066737A Expired - Fee Related KR101264968B1 (ko) 2009-07-17 2010-07-12 페이스트 도포 장치

Country Status (4)

Country Link
JP (1) JP5459833B2 (enrdf_load_stackoverflow)
KR (1) KR101264968B1 (enrdf_load_stackoverflow)
CN (1) CN101954329B (enrdf_load_stackoverflow)
TW (1) TWI451910B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102655331B1 (ko) * 2016-11-30 2024-04-08 주식회사 탑 엔지니어링 토출 헤드의 변위 모니터링이 가능한 도포장치 및 그의 제어방법
JP7347908B2 (ja) * 2019-06-26 2023-09-20 ダイハツ工業株式会社 高粘度材料の塗布方法、及び高粘度材料塗布装置の制御点自動生成プログラム
CN115889082A (zh) * 2022-12-01 2023-04-04 深圳德森精密设备有限公司 Pcb板点胶控制方法、装置、pcb板点胶设备及存储介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002316082A (ja) * 2001-04-20 2002-10-29 Shibaura Mechatronics Corp ペースト塗布装置
JP2007152261A (ja) 2005-12-06 2007-06-21 Shibaura Mechatronics Corp ペースト塗布装置、ペースト塗布方法及びこれを用いた表示パネルの製造装置
JP2009066576A (ja) 2007-09-18 2009-04-02 Toshiba Corp 塗布装置及び表示装置の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11262711A (ja) * 1998-03-18 1999-09-28 Murata Mfg Co Ltd 塗布装置
JP4743957B2 (ja) * 2000-12-22 2011-08-10 東レ株式会社 塗液の塗布方法及び装置並びにプラズマディスプレイ部材の製造装置および製造方法
JP4601914B2 (ja) * 2003-04-24 2010-12-22 芝浦メカトロニクス株式会社 接着剤の塗布装置及び接着剤の塗布方法
JP4341324B2 (ja) * 2003-08-01 2009-10-07 株式会社日立プラントテクノロジー 液晶パネルの製造方法及びペースト塗布装置
KR100696932B1 (ko) * 2005-04-15 2007-03-20 주식회사 탑 엔지니어링 페이스트 도포기 및 그 제어방법
JP4668023B2 (ja) * 2005-09-15 2011-04-13 芝浦メカトロニクス株式会社 ペースト塗布装置及びペースト塗布方法
JP2007222762A (ja) * 2006-02-22 2007-09-06 Shibaura Mechatronics Corp ペースト塗布装置
KR100649962B1 (ko) * 2006-06-28 2006-11-29 주식회사 탑 엔지니어링 페이스트 디스펜서의 헤드 유닛
JP4758326B2 (ja) * 2006-11-21 2011-08-24 株式会社アルバック 塗布装置
JP2008146992A (ja) * 2006-12-08 2008-06-26 Toshiba Matsushita Display Technology Co Ltd 表示装置の製造方法
CN101239349A (zh) * 2007-02-06 2008-08-13 芝浦机械电子装置股份有限公司 浆料涂敷装置及浆料涂敷方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002316082A (ja) * 2001-04-20 2002-10-29 Shibaura Mechatronics Corp ペースト塗布装置
JP2007152261A (ja) 2005-12-06 2007-06-21 Shibaura Mechatronics Corp ペースト塗布装置、ペースト塗布方法及びこれを用いた表示パネルの製造装置
JP2009066576A (ja) 2007-09-18 2009-04-02 Toshiba Corp 塗布装置及び表示装置の製造方法

Also Published As

Publication number Publication date
JP2011020073A (ja) 2011-02-03
TWI451910B (zh) 2014-09-11
KR20110007952A (ko) 2011-01-25
CN101954329A (zh) 2011-01-26
JP5459833B2 (ja) 2014-04-02
CN101954329B (zh) 2013-05-08
TW201114504A (en) 2011-05-01

Similar Documents

Publication Publication Date Title
JP4824698B2 (ja) 液体塗布装置のノズルクリアランス調整方法および液体塗布装置
JP6876470B2 (ja) ワーク加工装置、ワーク加工方法、プログラム及びコンピュータ記憶媒体
KR102162232B1 (ko) 위치 보정 기능을 가지는 작업 장치 및 작업 방법
JP4419764B2 (ja) 塗布装置と塗布方法
KR101264968B1 (ko) 페이스트 도포 장치
US9778647B2 (en) Working machine and positional deviation data acquisition method
TWI531417B (zh) Paste method of paste
US20130074329A1 (en) Mounting apparatus, electronic component mounting method, substrate production method, and program
KR101614425B1 (ko) 기판 처리 장치 및 헤드블럭의 좌표 보정 방법
KR101981516B1 (ko) 부품 실장 장치
JP2010099597A (ja) 塗布装置および塗布方法
KR101196099B1 (ko) 페이스트 도포 장치 및 페이스트 도포 방법
KR20170137253A (ko) 위치 조절 장치 및 이를 구비한 페이스트 디스펜서
JP5550409B2 (ja) シール塗布装置
JP4291313B2 (ja) ヘッド作動制御装置及び制御方法及びステージ装置
KR20170080980A (ko) 페이스트 디스펜서
JP2009066576A (ja) 塗布装置及び表示装置の製造方法
KR20070016098A (ko) 부품 실장 방법 및 장치
JPH1126999A (ja) 電子部品装着装置およびその方法
KR20190134184A (ko) 실 디스펜서 및 그것의 갭 제어 방법

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901

PX0701 Decision of registration after re-examination

St.27 status event code: A-3-4-F10-F13-rex-PX0701

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20160419

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20170420

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20180417

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20190417

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20220510

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20220510