JP6876470B2 - ワーク加工装置、ワーク加工方法、プログラム及びコンピュータ記憶媒体 - Google Patents
ワーク加工装置、ワーク加工方法、プログラム及びコンピュータ記憶媒体 Download PDFInfo
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- JP6876470B2 JP6876470B2 JP2017042750A JP2017042750A JP6876470B2 JP 6876470 B2 JP6876470 B2 JP 6876470B2 JP 2017042750 A JP2017042750 A JP 2017042750A JP 2017042750 A JP2017042750 A JP 2017042750A JP 6876470 B2 JP6876470 B2 JP 6876470B2
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Description
先ず、本実施の形態に係る液滴吐出装置の構成について、図1及び図2を参照して説明する。図1は、液滴吐出装置1の構成の概略を示す側面図である。図2は、液滴吐出装置1の構成の概略を示す平面図である。なお、以下においては、ワークWの主走査方向をY軸方向、主走査方向に直交する副走査方向をX軸方向、Y軸方向及びX軸方向に直交する鉛直方向をZ軸方向、Z軸方向回りの回転方向をθ方向とする。
以上の液滴吐出装置1には、制御部150が設けられている。制御部150は、例えばコンピュータであり、データ格納部(図示せず)を有している。データ格納部には、例えばワークWに吐出される液滴を制御し、当該ワークWに所定のパターンを描画するための描画データ(ビットマップデータ)などが格納されている。また、制御部150は、プログラム格納部(図示せず)を有している。プログラム格納部には、液滴吐出装置1における各種処理を制御するプログラムなどが格納されている。
検出器160における基準マーク102の位置(中心位置)の検出方法は任意であるが、例えば特開2017−13011号公報に記載の方法を用いることができる。そして、検出器160は、複数の基準マーク102の位置を検出することで、ワークWの位置を検出する。また、第1の撮像部41は、液滴吐出ヘッド34が取り付けられるX軸ステージ11に設けられるので、検出器160では、液滴吐出ヘッド34に対するワークWの位置を検出する。なお、第1の撮像部41で取得された撮像画像は、Y軸成分、X軸成分及びθ成分を含んでおり、検出器160で検出されるワークWの位置もY軸方向位置、X軸方向位置及びθ方向位置を含んでいる。
補正器161は、Y軸リニアスケール16からのパルス信号と、検出器160からの信号とに基づき、補正テーブルを用いてワークテーブル20の位置の補正量を算出する。そして、この補正量をモーションコントローラ162にフィードバックする。具体的には、以下のステップS1〜S3を行う。
モーションコントローラ162は、補正器161から受信したY軸方向のパルス信号(変換後のパルス信号)に基づいて、Y軸リニアモータ13に対して指令信号(パルス列)を出力して、Y軸リニアモータ13(ワークテーブル20)の移動を制御する。また、モーションコントローラ162は、補正器161から受信したX軸方向及びθ方向のパルス信号(変換後のパルス信号)に基づいて、テーブル移動機構21に対して指令信号(パルス列)を出力して、テーブル移動機構21の移動を制御する。なお、モーションコントローラ162は、Y軸、X軸、θ等に関するパルス信号を受信して、フルクローズ制御を構成している。
インクジェットコントローラ163は、補正器161から受信したY軸方向のパルス信号(変換後のパルス信号)に基づいて、液滴吐出ヘッド34に対して指令信号(パルス列)を出力して、液滴吐出ヘッド34における液滴の吐出タイミングを制御する。
次に、以上のように構成された液滴吐出装置1を用いて行われるワーク処理について説明する。
次に、本発明の他の実施の形態について説明する。
以上のように構成された液滴吐出装置1は、例えば特開2017−13011号公報に記載された、有機発光ダイオードの有機EL層を形成する基板処理システムに適用される。具体的に液滴吐出装置1は、ワークWとしてのガラス基板上に正孔注入層を形成するための有機材料を塗布する塗布装置、ガラス基板(正孔注入層)上に正孔輸送層を形成するための有機材料を塗布する塗布装置、ガラス基板(正孔輸送層)上に発光層を形成するための有機材料を塗布する塗布装置に適用される。なお、基板処理システムにおいて、有機発光ダイオードの正孔注入層、正孔輸送層及び発光層を形成する他に、電子輸送層と電子注入層も形成する場合、液滴吐出装置1は、これら電子輸送層と電子注入層の塗布処理にも適用できる。
10 Y軸ステージ
11 X軸ステージ
12 Y軸ガイドレール
13 Y軸リニアモータ
14 X軸ガイドレール
15 X軸リニアモータ
16 Y軸リニアスケール
20 ワークテーブル
21 テーブル移動機構
22 Y軸スライダ
23 X軸リニアスケール
24 ロータリエンコーダ
30 キャリッジユニット
33 キャリッジ
34 液滴吐出ヘッド
40 撮像ユニット
41 第1の撮像部
42 第2の撮像部
100 バンク
101 開口部
102 基準マーク
150 制御部
160 検出器
161 補正器
162 モーションコントローラ
163 インクジェットコントローラ
170 コンピュータ
W ワーク
Claims (14)
- ワークに所定の加工を行うワーク加工装置であって、
前記ワークを載置するワークテーブルと、
前記ワークテーブルに載置された前記ワークを加工する加工機と、
前記ワークテーブルと前記加工機を相対的に移動させる移動機構と、
前記移動機構の位置を測定する位置測定器と、
前記ワークテーブルに載置された前記ワークの位置を検出する検出器と、
前記位置測定器の測定結果と前記検出器の検出結果に基づいて、前記ワークテーブルの位置の補正量を算出する補正器と、を有し、
前記補正器は、前記ワークテーブルと前記加工機の相対的な移動中において、前記移動機構の位置と前記補正量の相関を示す補正テーブルを作成し、作成した補正テーブルを用いて前記ワークテーブルの位置の補正量を算出し、
前記移動機構は、前記移動中のワークテーブルの位置を補正することを特徴とする、ワーク加工装置。 - 前記補正器は、前記補正テーブルを2次元補間又は多次元補間することにより現在位置における補正量を算出することを特徴とする、請求項1に記載のワーク加工装置。
- 前記検出器の検出結果は、前記ワークの位置又は前記補正量であることを特徴とする、請求項1又は2に記載のワーク加工装置。
- 前記検出器は、前記加工機による前記ワークの加工前に、前記ワークの位置を検出することを特徴とする、請求項1〜3のいずれか一項に記載のワーク加工装置。
- 前記移動機構は、前記ワークテーブルと前記加工機を両方移動させることを特徴とする、請求項1〜4のいずれか一項に記載のワーク加工装置。
- 前記所定の加工は、前記ワークに機能液の液滴を吐出して描画する加工であることを特徴とする、請求項1〜5のいずれか一項に記載のワーク加工装置。
- ワークテーブルに載置されたワークに対し、加工機によって所定の加工を行うワーク加工方法であって、
移動機構によって前記ワークテーブルと前記加工機を相対的に移動させる際、位置測定器によって移動機構の位置を測定する第1の工程と、
前記移動機構によって前記ワークテーブルと前記加工機を相対的に移動させる際、検出器によって、前記ワークテーブルに載置された前記ワークの位置を検出する第2の工程と、
補正器によって、前記位置測定器の測定結果と前記検出器の検出結果に基づいて、前記ワークテーブルの位置の補正量を算出する第3の工程と、を有し、
前記第3の工程において、
前記補正器は、前記ワークテーブルと前記加工機の相対的な移動中において、前記移動機構の位置と前記補正量の相関を示す補正テーブルを作成し、作成した補正テーブルを用いて前記ワークテーブルの位置の補正量を算出し、
前記移動機構は、前記移動中のワークテーブルの位置を補正することを特徴とする、ワーク加工方法。 - 前記第3の工程において、前記補正テーブルを2次元補間又は多次元補間することにより現在位置における補正量を算出することを特徴とする、請求項7に記載のワーク加工方法。
- 前記第2の工程において、前記検出器の検出結果は、前記ワークの位置又は前記補正量であることを特徴とする、請求項7又は8に記載のワーク加工方法。
- 前記第2の工程は、前記加工機による前記ワークの加工前に行われることを特徴とする、請求項7〜9のいずれか一項に記載のワーク加工方法。
- 前記移動機構は、前記ワークテーブルと前記加工機を両方移動させることを特徴とする、請求項7〜10のいずれか一項に記載のワーク加工方法。
- 前記所定の加工は、前記ワークに機能液の液滴を吐出して描画する加工であることを特徴とする、請求項7〜11のいずれか一項に記載のワーク加工方法。
- 請求項7〜12のいずれか一項に記載のワーク加工方法をワーク加工装置によって実行させるように、当該ワーク加工装置のコンピュータ上で動作するプログラム。
- 請求項13に記載のプログラムを格納した読み取り可能なコンピュータ記憶媒体。
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