TWI451910B - Paste coating device - Google Patents

Paste coating device Download PDF

Info

Publication number
TWI451910B
TWI451910B TW099122679A TW99122679A TWI451910B TW I451910 B TWI451910 B TW I451910B TW 099122679 A TW099122679 A TW 099122679A TW 99122679 A TW99122679 A TW 99122679A TW I451910 B TWI451910 B TW I451910B
Authority
TW
Taiwan
Prior art keywords
paste
substrate
nozzle
value
measurement position
Prior art date
Application number
TW099122679A
Other languages
English (en)
Chinese (zh)
Other versions
TW201114504A (en
Inventor
Akira Hiraoka
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW201114504A publication Critical patent/TW201114504A/zh
Application granted granted Critical
Publication of TWI451910B publication Critical patent/TWI451910B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B05C11/1018—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to distance of target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
TW099122679A 2009-07-17 2010-07-09 Paste coating device TWI451910B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009168404A JP5459833B2 (ja) 2009-07-17 2009-07-17 ペースト塗布装置

Publications (2)

Publication Number Publication Date
TW201114504A TW201114504A (en) 2011-05-01
TWI451910B true TWI451910B (zh) 2014-09-11

Family

ID=43482061

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099122679A TWI451910B (zh) 2009-07-17 2010-07-09 Paste coating device

Country Status (4)

Country Link
JP (1) JP5459833B2 (enrdf_load_stackoverflow)
KR (1) KR101264968B1 (enrdf_load_stackoverflow)
CN (1) CN101954329B (enrdf_load_stackoverflow)
TW (1) TWI451910B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102655331B1 (ko) * 2016-11-30 2024-04-08 주식회사 탑 엔지니어링 토출 헤드의 변위 모니터링이 가능한 도포장치 및 그의 제어방법
JP7347908B2 (ja) * 2019-06-26 2023-09-20 ダイハツ工業株式会社 高粘度材料の塗布方法、及び高粘度材料塗布装置の制御点自動生成プログラム
CN115889082A (zh) * 2022-12-01 2023-04-04 深圳德森精密设备有限公司 Pcb板点胶控制方法、装置、pcb板点胶设备及存储介质

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200505584A (en) * 2003-08-01 2005-02-16 Hitachi Ind Co Ltd Fabrication method and device of liquid crystal panel, and solder paste coating device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11262711A (ja) * 1998-03-18 1999-09-28 Murata Mfg Co Ltd 塗布装置
JP4743957B2 (ja) * 2000-12-22 2011-08-10 東レ株式会社 塗液の塗布方法及び装置並びにプラズマディスプレイ部材の製造装置および製造方法
JP2002316082A (ja) * 2001-04-20 2002-10-29 Shibaura Mechatronics Corp ペースト塗布装置
JP4601914B2 (ja) * 2003-04-24 2010-12-22 芝浦メカトロニクス株式会社 接着剤の塗布装置及び接着剤の塗布方法
KR100696932B1 (ko) * 2005-04-15 2007-03-20 주식회사 탑 엔지니어링 페이스트 도포기 및 그 제어방법
JP4668023B2 (ja) * 2005-09-15 2011-04-13 芝浦メカトロニクス株式会社 ペースト塗布装置及びペースト塗布方法
JP2007152261A (ja) 2005-12-06 2007-06-21 Shibaura Mechatronics Corp ペースト塗布装置、ペースト塗布方法及びこれを用いた表示パネルの製造装置
JP2007222762A (ja) * 2006-02-22 2007-09-06 Shibaura Mechatronics Corp ペースト塗布装置
KR100649962B1 (ko) * 2006-06-28 2006-11-29 주식회사 탑 엔지니어링 페이스트 디스펜서의 헤드 유닛
JP4758326B2 (ja) * 2006-11-21 2011-08-24 株式会社アルバック 塗布装置
JP2008146992A (ja) * 2006-12-08 2008-06-26 Toshiba Matsushita Display Technology Co Ltd 表示装置の製造方法
CN101239349A (zh) * 2007-02-06 2008-08-13 芝浦机械电子装置股份有限公司 浆料涂敷装置及浆料涂敷方法
JP2009066576A (ja) 2007-09-18 2009-04-02 Toshiba Corp 塗布装置及び表示装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200505584A (en) * 2003-08-01 2005-02-16 Hitachi Ind Co Ltd Fabrication method and device of liquid crystal panel, and solder paste coating device

Also Published As

Publication number Publication date
JP2011020073A (ja) 2011-02-03
KR20110007952A (ko) 2011-01-25
KR101264968B1 (ko) 2013-05-15
CN101954329A (zh) 2011-01-26
JP5459833B2 (ja) 2014-04-02
CN101954329B (zh) 2013-05-08
TW201114504A (en) 2011-05-01

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