TWI451910B - Paste coating device - Google Patents
Paste coating device Download PDFInfo
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- TWI451910B TWI451910B TW099122679A TW99122679A TWI451910B TW I451910 B TWI451910 B TW I451910B TW 099122679 A TW099122679 A TW 099122679A TW 99122679 A TW99122679 A TW 99122679A TW I451910 B TWI451910 B TW I451910B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
- B05C11/1018—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to distance of target
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Coating Apparatus (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
本發明係有關於一種糊狀物塗佈裝置,該糊狀物塗佈裝置係具有相對配置於載置在平台之基板、並將糊狀物向前述基板之表面吐出的糊狀物吐出機構,且可將來自於該糊狀物吐出機構之糊狀物塗佈於前述基板表面的預定部位者。The present invention relates to a paste application device having a paste discharge mechanism that is disposed opposite to a substrate placed on a stage and that discharges a paste onto a surface of the substrate. Further, a paste from the paste discharge mechanism may be applied to a predetermined portion of the surface of the substrate.
迄今,已提出一種糊狀物塗佈裝置,具有分配器(糊狀物吐出機構),該分配器係安裝於相對於平台升降移動之升降頭並具備可收納糊狀物、同時可吐出該糊狀物的噴嘴者,且前述糊狀物塗佈裝置可將來自於噴嘴之糊狀物塗佈於載置於前述平台之基板表面(參照特許文獻1)。該糊狀物塗佈裝置更具備雷射感測器(距離檢測機構),其係可在對於從噴嘴吐出之糊狀物的塗佈位置呈預定之附近位置關係的測定位置,測定前述分配器之噴嘴與基板表面的距離者。而且,使升降頭升降移動,以使前述雷射感測器所測定之前述噴嘴與基板表面之距離值為一定值(目標值),而將噴嘴所吐出之糊狀物塗佈於基板的表面。Heretofore, there has been proposed a paste application device having a dispenser (a paste discharge mechanism) which is attached to a lifting head that moves up and down with respect to a platform and is provided with a accommodating paste and can discharge the paste. In the nozzle of the object, the paste coating device can apply a paste from the nozzle to the surface of the substrate placed on the stage (see Patent Document 1). The paste application device further includes a laser sensor (distance detecting means) for measuring the dispenser at a measurement position in a predetermined positional relationship with respect to a coating position of the paste discharged from the nozzle. The distance between the nozzle and the surface of the substrate. Further, the lifting head is moved up and down so that the distance between the nozzle and the substrate surface measured by the laser sensor is a constant value (target value), and the paste discharged from the nozzle is applied to the surface of the substrate. .
根據上述塗佈裝置,即使因為平台的凹凸或基板的翹曲等使載置於平台之基板表面的垂直方向位置有部分的變動,仍可使吐出糊狀物之噴嘴前端與基板表面間的距離保 持為一定。結果,可防止糊狀物之寬度或高度增減或者不均,而可以均一地狀態塗佈糊狀物。According to the above coating apparatus, even if the vertical position of the surface of the substrate placed on the stage is partially changed by the unevenness of the stage or the warpage of the substrate or the like, the distance between the tip end of the nozzle for discharging the paste and the surface of the substrate can be made. Guarantee Hold it for a certain amount. As a result, the width or height of the paste can be prevented from increasing or decreasing or uneven, and the paste can be uniformly applied.
但是,塗佈糊狀物之基板表面可能會形成段差。例如,在有機EL顯示元件的製造步驟中,在形成於密封基板表面之溝部塗佈有作為糊狀物之乾燥劑(參照特許文獻2)。藉由使如上所述於溝部塗佈乾燥劑的密封基板與陣列基板貼合,形成除去內部溼氣狀態的有機EL元件。However, the surface of the substrate on which the paste is applied may form a step. For example, in the manufacturing step of the organic EL display device, a desiccant as a paste is applied to the groove portion formed on the surface of the sealing substrate (see Patent Document 2). By laminating the sealing substrate coated with the desiccant in the groove portion as described above and the array substrate, an organic EL element in which the internal moisture state is removed is formed.
特許文獻1:特開2007-222762號公報Patent Document 1: Special Publication No. 2007-222762
特許文獻2:特開2008-146992號公報Patent Document 2: JP-A-2008-146992
但是,在如前所述之有機EL顯示元件的情況下,在表面形成有上側的面(溝部的外側面)與下側的面(溝部的底面)所構成之段差的基板之該表面塗佈糊狀物時,使用前述(參照特許文獻1)可使噴嘴與基板之距離保持為一定的糊狀物塗佈裝置。然而,由於該糊狀物塗佈裝置中,糊狀物之塗佈位置與測定噴嘴與基板表面距離之測定位置雖為附近位置關係、但卻不會一致,因此於前述段差之下側的面塗佈糊狀物時,該測定位置可能會在段差的上側的面。此時,由於無法正確地測定噴嘴與應塗佈糊狀物之基板表面的距離,故無法使噴嘴與基板表面之間的距離保持為一定,反 而會無法確實地塗佈糊狀物。However, in the case of the organic EL display device as described above, the surface of the substrate on which the upper surface (the outer surface of the groove portion) and the lower surface (the bottom surface of the groove portion) are formed is coated on the surface. In the case of a paste, the above-described (refer to Patent Document 1) can be used to keep the distance between the nozzle and the substrate constant. However, in the paste application device, the measurement position of the paste application position and the distance between the measurement nozzle and the substrate surface are not in the same position, but the surface below the step is not uniform. When the paste is applied, the measurement position may be on the upper side of the step. At this time, since the distance between the nozzle and the surface of the substrate to which the paste should be applied cannot be accurately measured, the distance between the nozzle and the surface of the substrate cannot be kept constant. However, the paste cannot be reliably applied.
本發明係有鑑於以上課題而成者,提供一種可確實地在表面形成有段差之基板表面塗佈糊狀物的糊狀物塗佈裝置。The present invention has been made in view of the above problems, and provides a paste coating device capable of reliably applying a paste to a surface of a substrate having a step formed on a surface thereof.
本發明之糊狀物塗佈裝置,係具有相對於載置在平台之基板而配置且可向前述基板之表面吐出糊狀物的噴嘴,並且將來自於前述噴嘴之糊狀物以事先設定好之圖樣(pattern)塗佈於前述基板表面者,且該糊狀物塗佈裝置具有:垂直移動機構,係可使前述噴嘴相對於前述基板於垂直於前述基板表面的方向相對移動者;距離檢測機構,係在對於相對於前述噴嘴之前述基板上之位置的塗佈位置為附近位置關係的測定位置,檢測出至前述基板表面為止的距離者;控制機構,係根據前述距離檢測機構之檢測值,控制前述垂直移動機構,調整前述噴嘴之前端與前述基板之間的間隔者;及記憶機構,係將糊狀物塗佈於在表面形成有上側的面與下側的面所構成之段差的基板時,可記憶前述上側的面與前述下側的面之間之高低差的深度值者,且前述控制機構在以前述所設定之圖樣塗佈前述糊狀物於前述基板上的過程中,當前述測定位置位於前述上側的面與前述下側的面中與前述塗佈位置不同的面上時,根據前述記憶機構所記憶之前述深度值,控制根據前述距離檢測機構之檢測值而得之前述垂直移動機構的移動量。The paste application device of the present invention has a nozzle which is disposed on a substrate placed on a stage and which can discharge a paste to the surface of the substrate, and the paste from the nozzle is set in advance. Applying a pattern to the surface of the substrate, and the paste applying device has a vertical moving mechanism for relatively moving the nozzle relative to the substrate in a direction perpendicular to the surface of the substrate; The mechanism detects a distance to the surface of the substrate at a measurement position in a positional relationship with respect to a position on the substrate on the substrate, and a control mechanism is based on a detection value of the distance detecting mechanism. Controlling the vertical movement mechanism to adjust a gap between the front end of the nozzle and the substrate; and the memory mechanism for applying the paste to the step formed by the upper surface and the lower surface of the surface. In the case of the substrate, the depth value of the difference between the upper surface and the lower surface can be memorized, and the control mechanism is set as described above. In the process of applying the paste to the substrate, when the measurement position is located on a surface of the upper surface and the lower surface of the lower surface than the coating position, the memory is memorized by the memory mechanism. The depth value controls the amount of movement of the vertical movement mechanism obtained based on the detected value of the distance detecting means.
藉由以上構造,以事先設定好之圖樣在表面形成有上 側的面與下側的面形成之段差的基板塗佈糊狀物時,當測定位置位於前述上側的面與前述下側的面中與前述塗佈位置不同的面上時,控制機構根據由記憶機構所記憶之上側的面與下側的面之間之高低差的深度值,控制基於前述距離檢測機構之檢測值而得之前述垂直移動機構的移動量。藉此,可保持噴嘴與塗佈糊狀物之基板的間隔為一定。With the above configuration, the pattern set in advance is formed on the surface. When the paste is applied to the substrate having a step formed by the side surface and the lower surface, when the measurement position is on the surface of the upper surface and the lower surface of the surface opposite to the coating position, the control mechanism is The depth value of the difference between the upper surface and the lower surface of the memory mechanism is controlled, and the amount of movement of the vertical movement mechanism obtained based on the detected value of the distance detecting means is controlled. Thereby, the interval between the nozzle and the substrate on which the paste is applied can be kept constant.
前述深度值可使用固定值,或者也可依噴嘴的各位置而不同。後者的情況下,在本發明之糊狀物塗佈裝置中,前述記憶機構可對應於塗佈於前述基板上之前述圖樣軌跡的各位置,記憶在該位置之有前述塗佈位置之前述基板的表面、與有前述測定位置之前述基板的表面之間的段差深度值,且前述控制機構當前述噴嘴為前述記憶機構所記憶之位置時,根據對應該位置記憶於前述記憶機構之深度值,控制前述垂直移動機構。The aforementioned depth value may be a fixed value or may be different depending on the position of the nozzle. In the latter aspect, in the paste coating apparatus of the present invention, the memory means may correspond to each of the positions of the pattern traces applied to the substrate, and the substrate having the coating position at the position may be stored. a step depth value between the surface and the surface of the substrate having the measurement position, and the control means, when the nozzle is a position memorized by the memory means, is stored in the depth value of the memory means according to the corresponding position. The aforementioned vertical movement mechanism is controlled.
藉由上述構造,即使段差之深度值依噴嘴所配置之各位置而不同,由於各位置之深度值係對應於該位置而記憶於記憶機構,在該各位置係根據所對應之深度值而控制垂直移動機構,故即使是在段差之上側的面與下側的面中為與測定位置之面不同的面,無論在何位置塗佈來自於噴嘴的糊狀物,皆可保持該噴嘴與塗佈糊狀物之基板表面的間隔為一定。With the above configuration, even if the depth value of the step differs depending on the position at which the nozzle is disposed, the depth value of each position is stored in the memory mechanism corresponding to the position, and the position is controlled according to the corresponding depth value. Since the vertical movement mechanism is used, even if the surface on the upper side of the step and the surface on the lower side are surfaces different from the surface of the measurement position, the nozzle and the coating can be held regardless of the position where the paste from the nozzle is applied. The spacing of the substrate surface of the cloth paste is constant.
對應於配置噴嘴之各位置的段差深度值可藉由在糊狀物塗佈動作前進行測定而得,也可由表示基板形狀的資料(例如CAD資料)而得。The step depth value corresponding to each position at which the nozzle is disposed may be obtained by measurement before the paste application operation, or may be obtained from data indicating the shape of the substrate (for example, CAD data).
又,在本發明之糊狀物塗佈裝置中,控制機構可具有可根據前述深度值修正以前述距離檢測機構所得之檢測值的修正機構,並藉由前述修正之檢測值控制前述垂直移動機構。Further, in the paste coating apparatus of the present invention, the control means may have a correction mechanism capable of correcting the detection value obtained by the distance detecting means based on the depth value, and controlling the vertical movement mechanism by the corrected detection value .
藉由上述構造,即使以噴嘴塗佈糊狀物之面與測定位置之面以段差之下側的面與上側的面之間區分開來,由於可根據前述段差之深度值修正由距離檢測機構所得之檢測值,並根據前述經修正之檢測值來控制垂直移動機構,故可保持噴嘴與塗佈糊狀物之基板表面之間的距離為一定。According to the above configuration, even if the surface of the nozzle-coated paste and the surface of the measurement position are distinguished from the surface on the lower side of the step and the upper surface, the distance detecting mechanism can be corrected according to the depth value of the aforementioned step. The obtained detection value is controlled by the above-described corrected detection value, so that the distance between the nozzle and the substrate surface of the application paste can be kept constant.
又,在本發明之糊狀物塗佈裝置中,前述控制機構可控制前述垂直移動機構以使前述距離檢測機構所得之檢測值為事先設定之目標值者,且前述控制機構更具有可根據前述深度值修正前述目標值之修正機構,並控制前述垂直移動機構,以使前述距離檢測機構所得之檢測值為前述經修正之目標值。Further, in the paste coating apparatus of the present invention, the control means may control the vertical movement mechanism such that the detection value obtained by the distance detecting means is a target value set in advance, and the control means further has a The depth value corrects the correction mechanism of the target value, and controls the vertical movement mechanism such that the detection value obtained by the distance detecting means is the corrected target value.
藉由上述構造,即使以噴嘴塗佈糊狀物之面與測定位置之面以段差之下側的面與上側的面之間區分開來,由於可根據段差之深度值修正由距離檢測機構所得之測定位置檢測值的目標值,並控制垂直移動機構使前述檢測值為前述經修正之目標值,故可保持噴嘴與塗佈糊狀物之基板表面的距離為一定。According to the above configuration, even if the surface of the nozzle-coated paste and the surface of the measurement position are distinguished from the surface on the lower side of the step and the upper surface, the distance detection mechanism can be corrected according to the depth value of the step difference. The target value of the position detection value is measured, and the vertical movement mechanism is controlled so that the detection value is the corrected target value, so that the distance between the nozzle and the substrate surface of the application paste can be kept constant.
此外,本發明之糊狀物塗佈裝置中,前述控制機構可根據前述距離檢測機構所得之檢測值與事先設定之目標值的差值而控制前述垂直移動機構者,且前述控制機構更具 有可根據前述深度值修正前述差值之修正機構,並根據前述經修正之差值控制前述垂直移動機構。Further, in the paste coating apparatus of the present invention, the control means may control the vertical movement mechanism based on a difference between the detection value obtained by the distance detecting means and a target value set in advance, and the control means is further provided. There is a correction mechanism that corrects the aforementioned difference based on the aforementioned depth value, and controls the aforementioned vertical movement mechanism based on the corrected difference.
藉由上述構造,即使以噴嘴塗佈糊狀物之面與測定位置之面以段差之下側的面與上側的面之間區分開來,由於可根據段差之深度值修正由距離檢測機構所得之測定位置的檢測值與目標值之差值,並根據經修正之差值來控制垂直移動機構,故可保持噴嘴與塗佈糊狀物之基板表面的距離為一定。According to the above configuration, even if the surface of the nozzle-coated paste and the surface of the measurement position are distinguished from the surface on the lower side of the step and the upper surface, the distance detection mechanism can be corrected according to the depth value of the step difference. The difference between the detected value of the measured position and the target value, and the vertical moving mechanism is controlled according to the corrected difference, so that the distance between the nozzle and the surface of the substrate on which the paste is applied can be kept constant.
根據本發明,即使是在以噴嘴塗佈糊狀物之面與測定位置之面以段差之下側的面與上側的面之間區分開來的狀況下,由於噴嘴與塗佈糊狀物之基板表面的間隔可保持為一定,故可確實地在表面形成有段差之基板的該表面塗佈糊狀物。According to the present invention, even in the case where the surface on which the paste is applied by the nozzle and the surface of the measurement position are distinguished from the surface on the lower side of the step and the upper surface, the nozzle and the coating paste are used. The interval between the surfaces of the substrate can be kept constant, so that the paste can be surely applied to the surface of the substrate on which the step is formed.
第1圖係顯示本發明實施型態之糊狀物塗佈裝置之機械構造的立體圖。Fig. 1 is a perspective view showing a mechanical structure of a paste application device according to an embodiment of the present invention.
第2圖係顯示第1圖所示之糊狀物塗佈裝置中之糊狀物吐出頭與雷射變位感測器的位置關係、與前述糊狀物吐出頭之糊狀物塗佈位置與雷射變位感測器之測定位置的位置關係的圖。Fig. 2 is a view showing the positional relationship between the paste discharge head and the laser displacement sensor in the paste application device shown in Fig. 1, and the paste application position of the paste discharge head. A map of the positional relationship with the measured position of the laser displacement sensor.
第3圖係顯示第1圖所示之糊狀物塗佈裝置中之糊狀物塗佈位置與雷射變位感測器之測定位置在水平面內的位置關係的圖。Fig. 3 is a view showing the positional relationship between the paste application position in the paste application device shown in Fig. 1 and the measurement position of the laser displacement sensor in the horizontal plane.
第4圖係顯示糊狀物塗佈裝置之控制裝置的構成例的方塊圖。Fig. 4 is a block diagram showing a configuration example of a control device of the paste coating device.
第5圖係顯示塗佈糊狀物之基板的詳細構造例的立體圖。Fig. 5 is a perspective view showing a detailed structural example of a substrate on which a paste is applied.
第6圖係顯示第5圖所示之基板的糊狀物塗佈軌跡及測定位置軌跡之例的圖。Fig. 6 is a view showing an example of a paste application trajectory and a measurement position trajectory of the substrate shown in Fig. 5.
第7圖係顯示指定第5圖所示之基板之糊狀物塗佈軌跡的位置情報及測定位置軌跡之例的圖。Fig. 7 is a view showing an example of specifying the positional information of the paste application trajectory of the substrate shown in Fig. 5 and the measurement position trajectory.
第8圖係顯示段差情報表之一例的圖。Fig. 8 is a view showing an example of a step difference information table.
第9圖係顯示放大糊狀物塗佈狀態的圖。Fig. 9 is a view showing a state in which the paste is applied.
第10圖係顯示糊狀物吐出頭之垂直方向位置控制的處理順序的流程圖。Fig. 10 is a flow chart showing the processing procedure of the vertical position control of the paste discharge head.
第11圖係顯示糊狀物吐出頭之垂直方向位置檢測值與目標值的關係、與糊狀物之塗佈位置的圖。Fig. 11 is a view showing the relationship between the detection value of the vertical direction position of the paste discharge head and the target value, and the position at which the paste is applied.
第12圖係顯示塗布糊狀物狀態之基板的立體圖。Fig. 12 is a perspective view showing a substrate in a state in which a paste is applied.
以下,使用圖示說明本發明的實施形態。Hereinafter, embodiments of the present invention will be described using the drawings.
本發明實施形態之糊狀物塗佈裝置構成如第1圖所示。第1圖所示之糊狀物塗佈裝置係例如在有機EL顯示元件之製造過程中,將糊狀之乾燥劑(以下稱為「糊狀物」)塗佈於基板者。The composition of the paste coating device according to the embodiment of the present invention is as shown in Fig. 1. The paste coating apparatus shown in Fig. 1 is a method in which a paste-like desiccant (hereinafter referred to as "batter") is applied to a substrate, for example, in the production process of an organic EL display device.
在第1圖中,該糊狀物塗佈裝置10係設置成Y平台12可在基座11上面移動於XYZ座標系之Y軸方向,此外,在Y平 台12上面更透過旋轉機構14設有平台15。Y平台12及平台15係平行地配置於X-Y平面(水平面)。Y平台12係藉由伺服馬達(以下稱為「Y伺服馬達」)13移動於Y軸方向,而平台15係藉由旋轉機構14在平行於X-Y平面的面內、以平行於Z軸的軸為中心旋轉。在平台15的上面,載置有矩形的玻璃製基板16,並藉由未圖示之真空吸附機構所吸引固定。In Fig. 1, the paste application device 10 is arranged such that the Y stage 12 can move on the susceptor 11 in the Y-axis direction of the XYZ coordinate system, and further, in the Y-flat The platform 12 is further provided with a platform 15 through the rotating mechanism 14. The Y stage 12 and the platform 15 are arranged in parallel on the X-Y plane (horizontal plane). The Y stage 12 is moved in the Y-axis direction by a servo motor (hereinafter referred to as "Y servo motor") 13, and the stage 15 is parallel to the Z-axis by the rotating mechanism 14 in a plane parallel to the XY plane. Rotate for the center. On the upper surface of the stage 15, a rectangular glass substrate 16 is placed and fixed by suction by a vacuum suction mechanism (not shown).
在基座11設有橫跨Y平台12、旋轉機構14及平台15的門型的保持體20。該保持體20係由延伸於垂直(Z軸方向)的足部20a與20b、以及連結該等足部20a與20b之上端部並與該等呈一體而平行延伸於X軸的橫跨部20c所構成。在橫跨部20c設有可平行於X軸的直線狀的導軌21。在導軌21上可自由滑動地設有2個載具22a、22b。並且,第1圖雖未圖示,但如後所述(參照第4圖),各載具22a、22b係藉由伺服馬達(以下稱為X伺服馬達)25a、25b之驅動力而來回移動於導軌21上。在各載具22a、22b上,可升降移動(Z軸方向的移動)地保持有糊狀物吐出頭23a、23b(糊狀物吐出機構)。在各載具22a、22b,設有以伺服馬達(以下稱為Z伺服馬達)24a、24b為動力源的未圖示之升降移動機構(垂直移動機構),藉由該升降移動機構,糊狀物吐出頭23a、23b可在載具22a、22b上於垂直方向(Z軸方向)升降移動。The susceptor 11 is provided with a gate-shaped holding body 20 that straddles the Y stage 12, the rotating mechanism 14, and the stage 15. The holder 20 is composed of a foot portion 20a and 20b extending in a vertical direction (Z-axis direction), and a traverse portion 20c extending in parallel with the upper end portion of the foot portions 20a and 20b and extending in parallel with the X-axis. Composition. A linear guide rail 21 parallel to the X-axis is provided in the traverse portion 20c. Two carriers 22a and 22b are slidably provided on the guide rail 21. Further, although not shown in the first drawing, as will be described later (see FIG. 4), each of the carriers 22a and 22b moves back and forth by the driving force of the servo motors (hereinafter referred to as X servo motors) 25a and 25b. On the guide rail 21. The paste discharge heads 23a and 23b (paste discharge mechanism) are held in the respective carriers 22a and 22b so as to be movable up and down (movement in the Z-axis direction). Each of the carriers 22a and 22b is provided with a lifting and lowering mechanism (vertical movement mechanism) (not shown) using servo motors (hereinafter referred to as Z servomotors) 24a and 24b as power sources, and the lifting and lowering mechanism has a paste shape. The object discharge heads 23a and 23b are movable up and down in the vertical direction (Z-axis direction) on the carriers 22a and 22b.
如第2圖所示,各糊狀物吐出頭23a、23b係由注射器26及連接於此之噴嘴27所構成。於注射器26填充有糊狀物,注射器27內的糊狀物藉由來自於未圖示之加壓氣體源的加壓氣體所加壓,藉此由噴嘴27的前端所吐出。另外,加壓 氣體的壓力係因應來自於噴嘴27之糊狀物吐出量,亦即基板16上的糊狀物塗佈量。As shown in Fig. 2, each of the paste discharge heads 23a and 23b is composed of a syringe 26 and a nozzle 27 connected thereto. The syringe 26 is filled with a paste, and the paste in the syringe 27 is pressurized by a pressurized gas from a pressurized gas source (not shown), thereby being discharged from the tip end of the nozzle 27. In addition, pressurization The pressure of the gas is based on the amount of paste discharge from the nozzle 27, that is, the amount of paste applied on the substrate 16.
該糊狀物塗佈裝置10具有一體地安裝於各糊狀物吐出頭23a、23b的雷射變位感測器28a、28b(距離檢測機構)。如第2圖所示,各雷射變位感測器28a、28b具有發光器(雷射元件)281與受光器282(例如CCD線型感測器)。來自發光器281的雷射光束係以基板16的表面16a反射,該反射光束則入射至受光器282。入射至受光器282之受光面的反射光束位置會因應發光器281之發光面及受光器282之受光面與基板16之表面16a之間的距離而產生變化,由此,可得出來自於受光器282之輸出訊號,以作為各雷射變位感測器28a、28b與基板表面16a之垂直方向上的相對距離。在此,由於雷射變位感測器28a、28b係一體地安裝於糊狀物吐出頭23a、23b,可從設定資料或實測值得知噴嘴27之前端與雷射變位感測器28a、28b在垂直方向上的相對距離,故可從雷射變位感測器28a、28b的輸出值算出噴嘴27前端與基板表面16a之垂直方向的相對距離。在本實施型態中,將該相對距離稱為檢測值hm。另外,該檢測值hm的算出係由後述之控制裝置31進行。The paste application device 10 has laser displacement sensors 28a and 28b (distance detecting means) integrally attached to the respective paste discharge heads 23a and 23b. As shown in Fig. 2, each of the laser displacement sensors 28a, 28b has an illuminator (laser element) 281 and a light receiver 282 (for example, a CCD line sensor). The laser beam from the illuminator 281 is reflected by the surface 16a of the substrate 16, which is incident on the light receiver 282. The position of the reflected beam incident on the light receiving surface of the light receiver 282 varies depending on the light emitting surface of the illuminator 281 and the distance between the light receiving surface of the light receiver 282 and the surface 16a of the substrate 16, thereby obtaining the light receiving light. The output signal of the 282 is used as the relative distance between the respective laser displacement sensors 28a, 28b and the substrate surface 16a in the vertical direction. Here, since the laser displacement sensors 28a and 28b are integrally attached to the paste discharge heads 23a and 23b, the front end of the nozzle 27 and the laser displacement sensor 28a can be known from the setting data or the measured values. Since the relative distance of 28b in the vertical direction, the relative distance between the tip end of the nozzle 27 and the substrate surface 16a in the vertical direction can be calculated from the output values of the laser displacement sensors 28a and 28b. In the present embodiment, the relative distance is referred to as a detected value hm. The calculation of the detected value hm is performed by the control device 31 which will be described later.
由於即使在各糊狀物吐出機構23a、23b之噴嘴27前端吐出糊狀物的狀態下,也可檢測出該糊狀物吐出機構23a、23b之垂直方向(Z方向)的位置,故各雷射變位感測器28a、28b之測定位置Ps(基板16上的測定點位置)可不與對應之糊狀物吐出機構23a、23b之噴嘴27的糊狀物塗佈位置Pp(相對 於噴嘴27之基板16上的位置)為一致、而可設定於其預定附近位置。例如,如第3圖所示,在X-Y面(水平面)上,將測定位置Ps設定於從塗佈位置Pp向X軸方向及Y軸方向分別遠離預定距離d(例如約0.5mm~1.5mm左右)的位置。The position of the paste discharge mechanisms 23a and 23b in the vertical direction (Z direction) can be detected even in a state where the paste is discharged at the tip end of the nozzles 27 of the paste discharge mechanisms 23a and 23b. The measurement position Ps of the radiation displacement sensors 28a and 28b (the measurement point position on the substrate 16) may not be the paste application position Pp of the nozzle 27 of the corresponding paste discharge mechanism 23a, 23b (relative to The position on the substrate 16 of the nozzle 27 is uniform and can be set at a predetermined vicinity thereof. For example, as shown in FIG. 3, the measurement position Ps is set on the XY plane (horizontal plane) from the application position Pp to the X-axis direction and the Y-axis direction by a predetermined distance d (for example, about 0.5 mm to 1.5 mm). )s position.
回到第1圖,鄰接於基座11設置有作為控制機構的控制裝置31。於控制裝置31連接有顯示器用之顯示部32與情報輸入用的操作部33(鍵盤)。如第4圖所示,控制裝置31具有處理單元311,於處理單元311連接有顯示部32及操作部33、並且也連接有記憶部312。處理單元311根據事先記憶於記憶部312的教導數據,進行X伺服馬達25a、25b(第1圖中省略圖示)及Y伺服馬達13的驅動控制,使導軌21上之各載具22a、22b平行移動於X軸方向,並且使Y平台12平行移動於Y軸方向,使搭載於各載具22a、22b之糊狀物吐出頭23a、23b的噴嘴27在X-Y平面(水平面)內對於基板16相對移動以對應糊狀物之塗佈軌跡。又,如後所詳述,處理單元311根據來自於雷射變位感測器28a、28b(受光器282)的檢測訊號,進行作為升降移動機構之動力源的Z伺服馬達24a、24b的驅動控制,使搭載於各載具22a、22b之糊狀物吐出頭23a、23b的噴嘴27前端位置升降移動,以使相對於基板16之表面16a的垂直方向(Z方向)的相對距離(間距)在適當範圍內保持為一定。Returning to Fig. 1, a control device 31 as a control mechanism is provided adjacent to the susceptor 11. A display unit 32 for display and an operation unit 33 (keyboard) for information input are connected to the control device 31. As shown in FIG. 4, the control device 31 has a processing unit 311, and the display unit 32 and the operation unit 33 are connected to the processing unit 311, and the memory unit 312 is also connected. The processing unit 311 performs drive control of the X servo motors 25a and 25b (not shown in the first drawing) and the Y servo motor 13 based on the teaching data previously stored in the memory unit 312, so that the carriers 22a and 22b on the guide rail 21 are provided. The Y-axis direction is moved in parallel, and the Y-platform 12 is moved in parallel in the Y-axis direction, so that the nozzles 27 mounted on the paste discharge heads 23a and 23b of the respective carriers 22a and 22b are in the XY plane (horizontal plane) for the substrate 16. Relative movement to correspond to the coating trajectory of the paste. Further, as will be described in detail later, the processing unit 311 performs driving of the Z servo motors 24a, 24b as a power source of the lifting and lowering mechanism based on the detection signals from the laser displacement sensors 28a, 28b (light receivers 282). Controlling, the position of the tip end of the nozzle 27 mounted on the paste discharge heads 23a and 23b of the respective carriers 22a and 22b is moved up and down so as to have a relative distance (pitch) in the vertical direction (Z direction) with respect to the surface 16a of the substrate 16. Keep it within the appropriate range.
另外,在各糊狀物吐出頭23a、23b安裝有攝影機單元35a、35b,各攝影機單元35a、35b對於所對應之糊狀物吐出頭23a、23b所吐出、塗佈於基板16之表面16a上的糊狀物 進行攝影。各攝影機單元35a、35b所攝影之塗佈有糊狀物之基板16表面16a的映像係由處理裝置31而顯示於顯示部32。Further, camera units 35a and 35b are attached to the respective paste discharge heads 23a and 23b, and each of the camera units 35a and 35b is discharged onto the corresponding paste discharge heads 23a and 23b and applied to the surface 16a of the substrate 16. Paste Take photography. The image of the surface 16a of the substrate 16 on which the paste is applied by each of the camera units 35a and 35b is displayed on the display unit 32 by the processing device 31.
於表面16a塗佈糊狀物之基板16係形成為例如第5圖所示,形成有4個矩形的凹部160(第4圖中詳細顯示1個凹部,對於3個凹部則以虛線表示)。各凹部160係由4個邊緣部162~165包圍而形成底面161。亦即,在各凹部160中,在各邊緣部162~165的表面與底面161之間,形成有以各邊緣部162~165之表面為上側的面、底面161為下側的面的段差。The substrate 16 on which the paste is applied to the surface 16a is formed, for example, as shown in Fig. 5, and four rectangular concave portions 160 are formed (one concave portion is shown in detail in Fig. 4 and indicated by a broken line in three concave portions). Each of the recesses 160 is surrounded by four edge portions 162 to 165 to form a bottom surface 161. In other words, in each of the concave portions 160, between the surface of each of the edge portions 162 to 165 and the bottom surface 161, a step in which the surface of each of the edge portions 162 to 165 is the upper surface and the surface of the bottom surface 161 is the lower surface is formed.
如上所述,在以凹部160形成段差之基板16中,例如以第6圖之粗虛線B所示,在底面161之各邊緣部162~165的邊際塗佈糊狀物。此時,當各糊狀物吐出頭23a、23b沿著邊緣部162、163移動時,在糊狀物塗佈位置附近的雷射變位感測器28之測定位置(參照第2及3圖)係位於沿著作為段差之下側的面的底面161之邊緣部162、163的部份(參照細虛線A)。又,當各糊狀物吐出頭23a、23b沿著邊緣部164、165移動時,在糊狀物塗佈位置附近的雷射變位感測器28之測定位置(參照第2及3圖)係位於沿著作為段差之下側的面的底面161之邊緣部164、165的部份(參照細虛線A)。As described above, in the substrate 16 in which the stepped portion is formed by the concave portion 160, for example, as shown by the thick broken line B in FIG. 6, the paste is applied to the edge of each of the edge portions 162 to 165 of the bottom surface 161. At this time, when each of the paste discharge heads 23a and 23b moves along the edge portions 162 and 163, the measurement position of the laser displacement sensor 28 near the paste application position (see FIGS. 2 and 3). It is located at the edge portion 162, 163 of the bottom surface 161 of the surface on the side below the step (refer to the thin broken line A). Further, when each of the paste discharge heads 23a and 23b moves along the edge portions 164 and 165, the measurement position of the laser displacement sensor 28 in the vicinity of the paste application position (see FIGS. 2 and 3) It is located at the edge portion 164, 165 of the bottom surface 161 of the face on the side below the step (refer to the thin broken line A).
如第6圖之粗虛線B所示,在形成於基板16之凹部160中的底面161之各邊緣部162~165邊際塗佈糊狀物時,各糊狀物吐出頭23a、23的各噴嘴27係例如第7圖所示,在X-Y面內,從沿著邊緣部163的位置(x0,y0)至位置(xi,yi)、沿著邊緣部164之位置(xi,yi)至位置(xj,yj)、沿著邊緣部165 的位置(xj,yj)至位置(xk,yk)、從沿著邊緣部162之位置(xk,yk)回到位置(x0,y0)而移動。前述各糊狀物吐出頭23a、23b之各噴嘴27的移動路徑情報係作為教導資料而記憶於記憶部312。另外,在第7圖中,各位置係以設定於基板16之座標系xyz所指定,但也可考慮基板16之Y方向移動(Y平台12的移動)及搭載各糊狀物吐出頭23a、23b之載具22a、22b的X方向之移動,以設定於糊狀物塗佈裝置10之座標系XYZ所指定。As shown by the thick broken line B in Fig. 6, when the paste is applied to the edge portions 162 to 165 of the bottom surface 161 formed in the concave portion 160 of the substrate 16, the respective nozzles of the paste discharge heads 23a and 23 are formed. 27 is, for example, shown in Fig. 7, in the XY plane, from the position (x0, y0) along the edge portion 163 to the position (xi, yi), the position along the edge portion 164 (xi, yi) to the position ( Xj, yj) along the edge portion 165 The position (xj, yj) to the position (xk, yk) moves from the position (xk, yk) along the edge portion 162 back to the position (x0, y0). The movement path information of each nozzle 27 of each of the paste discharge heads 23a and 23b is stored in the memory unit 312 as teaching material. In addition, in FIG. 7, each position is specified by the coordinate system xyz set on the board|substrate 16, but it is also possible to consider the movement of the board|substrate 16 in the Y direction (movement of the Y stage 12), and mounting each paste discharge head 23a, The movement of the carriers 22a and 22b in the X direction of 23b is specified by the coordinate system XYZ set in the paste coating apparatus 10.
又,依吐出糊狀物而移動之糊狀物吐出頭23a、23b的噴嘴移動軌跡上之位置(x,y),將有對應於上述各位置之測定位置(參照第7圖之虛線)的面,對於有塗佈位置之面(底面161)的垂直方向(Z方向)之相對位置,作為例如第8圖所示之段差情報表而記憶於記憶部312。在該段差情報表中,由於從沿著邊緣部163的位置(x0,y0)至位置(xi,yi)之前為止,測定位置係位於底面161(下側的面),故有測定位置之面對於底面161的垂直方向相對位置(高低差)、亦即段差的深度值為「0」。而由於沿著邊緣部164之位置(xi,yi)至位置(xj,yj)之前為止,測定位置位於邊緣部164側之表面16a(上側的面),因此有測定位置之面對於底面161的垂直方向相對位置、亦即段差的深度值為「△1」。由於從沿著邊緣部165的位置(xj,yj)至位置(xk,yk)之前為止,測定位置位於邊緣部165側之表面16a(上側的面),因此有測定位置之面對於底面161(下側的面)的垂直方向相對位置、亦即段差的深度值為「△2」。又,由於從沿著邊緣部162的位置(xk,yk)至位 置(x0,y0)之前為止,測定位置係位於底面161(下側的面),故有測定位置之面對於底面161的垂直方向相對位置、亦即段差的深度值為「0」。並且,由於從沿著邊緣部163的位置(xn,yn)至位置(x0,y0)為止,測定位置係位於底面161(下側的面),故有測定位置之面對於底面161的垂直方向相對位置、亦即段差的深度值為「0」。另外,在此,△1與△2可為相同值、也可為不同值,在此以相同值進行說明。Further, the position (x, y) on the nozzle movement trajectory of the paste discharge heads 23a and 23b which are moved by the discharge of the paste has a measurement position corresponding to each of the above positions (see the broken line in Fig. 7). The relative position of the surface in the vertical direction (Z direction) of the surface (the bottom surface 161) having the coating position is stored in the memory unit 312 as, for example, the step information table shown in FIG. In the step difference information table, since the measurement position is located on the bottom surface 161 (the lower surface) from the position (x0, y0) along the edge portion 163 to the position (xi, yi), the surface of the measurement position is present. The depth relative position (height difference) of the bottom surface 161, that is, the depth value of the step is "0". On the other hand, since the measurement position is on the surface 16a (upper side) of the edge portion 164 side from the position (xi, yi) of the edge portion 164 to the position (xj, yj), the surface of the measurement position is opposite to the bottom surface 161. The relative position in the vertical direction, that is, the depth value of the step is "Δ1". Since the measurement position is on the surface 16a (upper side) of the edge portion 165 side from the position (xj, yj) along the edge portion 165 to the position (xk, yk), the surface of the measurement position is opposite to the bottom surface 161 ( The vertical relative position of the lower surface), that is, the depth value of the step is "Δ2". Also, since it is in position from the position (xk, yk) along the edge portion 162 Since the measurement position is located on the bottom surface 161 (the lower surface) until (x0, y0), the relative position of the surface of the measurement position to the bottom surface 161, that is, the depth value of the step is "0". Further, since the measurement position is located on the bottom surface 161 (the lower surface) from the position (xn, yn) along the edge portion 163 to the position (x0, y0), the surface of the measurement position is perpendicular to the bottom surface 161. The relative position, that is, the depth value of the step is "0". Here, Δ1 and Δ2 may be the same value or different values, and the same values will be described here.
段差情報表(參照第8圖)可由基板16之設計圖(例如CAD資料)所做成。又,也可藉由在塗佈糊狀物之前,測定各位置之段差深度值而做成段差情報表。The step information table (see Fig. 8) can be made of a design drawing (for example, CAD data) of the substrate 16. Further, the step difference information table may be formed by measuring the depth value of the step difference at each position before applying the paste.
如前所述之糊狀物塗佈裝置10係如以下,將糊狀物塗佈於基板16之底面161的各邊緣部162~165的邊際。The paste coating apparatus 10 as described above applies a paste to the margin of each of the edge portions 162 to 165 of the bottom surface 161 of the substrate 16 as follows.
處理單元311依照記憶於記憶部312之教導資料(參照第7圖),驅動控制X伺服馬達25a、25b及Y伺服馬達13,藉此,各噴嘴27對於載置於平台15之基板16,沿著位置(x0,y0)→位置(xi,yi)→位置(xj,yj)→位置(xk,yk)→位置(xn,yn)→位置(x0,y0)的矩型軌跡依序移動(X-Y面內的移動)。在該過程中,如第9圖所示,由搭載於各載具22a、22b之糊狀物吐出頭23a、23b的噴嘴27所吐出的糊狀物30塗佈於基板16的表面16a。然後,處理單元311根據來自於雷射變位感測器28(受光器282)的檢測訊號,進行作為升降移動機構動力源之Z伺服馬達24a、24b的驅動控制,使吐出糊狀物30之糊狀物吐出頭23a、23b升降移動(Z方向的移動),以使噴嘴27前端與基板表面16a之間距Gp在適當範圍內保持為一 定。The processing unit 311 drives and controls the X servo motors 25a and 25b and the Y servo motor 13 in accordance with the teaching material (see FIG. 7) stored in the memory unit 312, whereby each nozzle 27 is placed along the substrate 16 placed on the stage 15, The rectangular trajectory of position (x0, y0) → position (xi, yi) → position (xj, yj) → position (xk, yk) → position (xn, yn) → position (x0, y0) is sequentially moved ( Movement in the XY plane). In this process, as shown in Fig. 9, the paste 30 discharged from the nozzles 27 of the paste discharge heads 23a and 23b mounted on the respective carriers 22a and 22b is applied to the surface 16a of the substrate 16. Then, the processing unit 311 performs drive control of the Z servo motors 24a and 24b as the power source of the lifting and lowering mechanism based on the detection signal from the laser displacement sensor 28 (light receiver 282), so that the discharge paste 30 is The paste discharge heads 23a and 23b move up and down (movement in the Z direction) so that the distance Gp between the tip end of the nozzle 27 and the substrate surface 16a is maintained within an appropriate range. set.
處理單元311之各糊狀物吐出頭23a、23b的升降移動控制係依照例如第10圖所示之步驟而進行。The lifting movement control of each of the paste discharge heads 23a and 23b of the processing unit 311 is performed in accordance with, for example, the procedure shown in FIG.
在第10圖中,處理單元311在進行糊狀物塗佈開始位置(例如第7圖中之位置(x0,y0))的設定等、各種參數的初期設定(S11)後,確認搭載於各載具22a、22b之糊狀物吐出頭23a、23b的噴嘴27位於前述開始位置(x0,y0)(S12)。然後,處理單元311判定對於基板16之糊狀物30塗佈是否結束(S13),尚未結束時(在S13為NO),輸入來自於雷射變位感測器28(受光器282)的檢測訊號,取得各糊狀物吐出頭23a、23b的噴嘴27前端與基板16之表面16a的垂直方向上相對距離的檢測值hm(S14)。In the tenth figure, the processing unit 311 confirms the setting of the paste application start position (for example, the position (x0, y0) in FIG. 7) and the initial setting of various parameters (S11), and then confirms that it is mounted on each. The nozzles 27 of the paste discharge heads 23a and 23b of the carriers 22a and 22b are located at the aforementioned start position (x0, y0) (S12). Then, the processing unit 311 determines whether or not the application of the paste 30 to the substrate 16 is finished (S13), and when it is not finished (NO at S13), the detection from the laser displacement sensor 28 (photodetector 282) is input. The signal acquires the detected value hm of the relative distance between the tip end of the nozzle 27 of each of the paste discharge heads 23a and 23b and the surface 16a of the substrate 16 in the vertical direction (S14).
處理單元311參照記憶於記憶部312之段差情報表(參照第8圖),判定現在對應於各噴嘴27位置(X-Y面內的位置)之測定位置是否在表面16a(段差的上側的面),亦即在噴嘴27的位置中,塗佈位置是否位於段差的下側的面(底面161上)、而測定位置位於段差的上側的面(表面16a)(S15)。例如,如第7圖所示,在沿著邊緣部163將糊狀物30塗佈於形成於基板16之凹部160底面161的過程中,由於將以編碼器等位置檢測器所檢測出之對應於噴嘴27現在位置的深度值參照記憶於記憶部312之段差情報表所得的結果為「0」,故判定測定位置位於段差的下側的面(底面161上)(在S15為NO)。此時,處理單元311更判定該測定位置是否在已塗佈糊狀物的部份上(參照第7圖之部分C)(S16),若不是的話(在 S16為NO),從檢測值hm及事先預定之目標值htg演算出控制值S(S17)。控制值S例如依照S=f(htg-hm)進行演算。亦即,依目標值htg與檢測值hm的差(htg-hm)的函數演算控制值S。前述目標值htg如第11圖所示,對應於各糊狀物吐出頭23a、23b之噴嘴27前端相對於應塗佈糊狀物之段差下側的面(底面161)的垂直方向相對位置檢測值hm1而設定。另外,目標值htg與檢測值hm的差(htg-hm)可直接作為控制值S。The processing unit 311 refers to the step information table (see FIG. 8) stored in the storage unit 312, and determines whether or not the measurement position corresponding to the position of each nozzle 27 (the position in the XY plane) is on the front surface 16a (the upper surface of the step). That is, in the position of the nozzle 27, whether or not the application position is located on the lower surface (the bottom surface 161) of the step, and the measurement position is located on the upper surface (surface 16a) of the step (S15). For example, as shown in FIG. 7, in the process of applying the paste 30 along the edge portion 163 to the bottom surface 161 of the recess 160 formed in the substrate 16, the correspondence is detected by a position detector such as an encoder. When the depth value of the current position of the nozzle 27 is "0" with reference to the result of the step information table stored in the memory unit 312, it is determined that the measurement position is located on the lower surface (the bottom surface 161) of the step (NO at S15). At this time, the processing unit 311 further determines whether the measurement position is on the portion where the paste has been applied (refer to part C of FIG. 7) (S16), if not (in S16 is NO), and the control value S is calculated from the detected value hm and the predetermined target value htg (S17). The control value S is calculated, for example, in accordance with S = f (htg - hm). That is, the control value S is calculated as a function of the difference (htg-hm) between the target value htg and the detected value hm. As shown in Fig. 11, the target value htg is detected in the vertical direction relative to the surface (bottom surface 161) of the lower end of the nozzle 27 of each paste discharge head 23a, 23b with respect to the step on which the paste should be applied. Set by the value hm1. In addition, the difference (htg-hm) between the target value htg and the detected value hm can be directly used as the control value S.
得到控制值S,處理單元311根據該控制值S,進行作為升降移動機構動力源之Z伺服馬達24a、24b的驅動控制(S18)。藉由該驅動控制,控制各糊狀物吐出頭23a、23b的升降移動機構,使前述目標值htg與檢測值hm的差為零,亦即使檢測值hm為目標值htg。The control value S is obtained, and the processing unit 311 performs drive control of the Z servo motors 24a and 24b as the power source of the elevation moving mechanism based on the control value S (S18). By the drive control, the lifting and lowering mechanism of each of the paste discharge heads 23a and 23b is controlled so that the difference between the target value htg and the detected value hm is zero, and even if the detected value hm is the target value htg.
如此一來,在從噴嘴27所吐出之糊狀物30塗佈於底面161(段差之下側的面)的邊緣部163邊際的部份時,反覆實行前述處理(S13~S18),進行控制使糊狀物吐出頭23a、23b之噴嘴27前端相對於塗佈面(底面161)的垂直方向相對位置為目標值htg。When the paste 30 discharged from the nozzle 27 is applied to the edge of the edge portion 163 of the bottom surface 161 (the surface on the lower side of the step), the above-described processing (S13 to S18) is repeatedly performed to perform control. The relative position of the tip end of the nozzle 27 of the paste discharge heads 23a and 23b with respect to the application surface (bottom surface 161) in the vertical direction is the target value htg.
即使在接著形成於基板16之凹部160的邊緣部163邊際部分、將糊狀物30塗佈於邊緣部164之邊際部份的過程中,處理單元311也根據來自於雷射變位感測器28(受光器282)的檢測訊號,取得相對於基板16之垂直方向相對位置的檢測值hm(S14)。然後,藉由處理單元311,判定在糊狀物吐 出頭23a、23b之噴嘴27的各位置中、測定位置Ps位於段差的上側的面(表面16a)(在S15為YES)。此時,處理單元311從記憶於記憶部312之段差情報表(參照第8圖),讀取出對應於各噴嘴27現在位置之段差的深度值△1(S19),使用該深度值△1依照htgc=htg-△1來修正目標值htg,得到該修正目標值htgc(S20)。Even in the process of applying the paste 30 to the marginal portion of the edge portion 164 at the margin portion of the edge portion 163 of the concave portion 160 of the substrate 16, the processing unit 311 is also based on the sensor from the laser displacement sensor. The detection signal of 28 (photodetector 282) acquires the detected value hm with respect to the relative position of the substrate 16 in the vertical direction (S14). Then, by the processing unit 311, it is determined that the paste is spit. Among the positions of the nozzles 27 of the heads 23a and 23b, the measurement position Ps is located on the upper surface (surface 16a) of the step (YES in S15). At this time, the processing unit 311 reads the depth value Δ1 corresponding to the step difference between the current positions of the respective nozzles 27 from the step information table (see FIG. 8) stored in the storage unit 312, and uses the depth value Δ1. The target value htg is corrected in accordance with htgc=htg-Δ1, and the correction target value htgc is obtained (S20).
該修正目標值htgc如第11圖所示,係使用段差深度值△1將目標值htg變成以段差之上側的面(表面16a)為基準之值,為各糊狀物吐出頭23a、23b之噴嘴27前端相對於有測定位置之上側的面(邊緣部164之表面)的垂直方向相對位置之檢測值hm2的目標值。As shown in Fig. 11, the correction target value htgc is a value based on the surface (surface 16a) on the upper side of the step difference using the step depth value Δ1, and is the paste discharge head 23a, 23b of each paste. The target value of the detected value hm2 of the relative position of the tip end of the nozzle 27 with respect to the surface on the upper side of the measurement position (the surface of the edge portion 164).
得到修正目標值htgc,則處理單元311從位於作為段差上側的面之表面16a的測定位置上的前述檢測值hm及修正目標值htgc,依照S=f(htgc-tm)演算出控制值S(S17)。然後,處理單元311根據該控制值S,進行作為升降移動機構動力源之Z伺服馬達24a、24b的驅動控制(S18)。藉由該驅動控制,控制各糊狀物吐出頭23a、23b的升降移動機構,使前述修正目標值htgc與檢測值hm2的差為零,亦即使檢測值hm2為修正目標值htgc。結果,可使相對於凹部160之底面161的噴嘴27前端與底面161之間的間距保持在適當範圍(目標值htg)內。When the correction target value htgc is obtained, the processing unit 311 calculates the control value S from the detected value hm and the correction target value htgc at the measurement position of the surface 16a which is the upper side of the step, in accordance with S=f(htgc-tm). S17). Then, the processing unit 311 performs drive control of the Z servo motors 24a and 24b as the power source of the elevation moving mechanism based on the control value S (S18). By the drive control, the lift moving mechanism of each of the paste discharge heads 23a and 23b is controlled such that the difference between the correction target value htgc and the detected value hm2 is zero, and even if the detected value hm2 is the correction target value htgc. As a result, the distance between the tip end of the nozzle 27 and the bottom surface 161 with respect to the bottom surface 161 of the concave portion 160 can be maintained within an appropriate range (target value htg).
如此一來,在從噴嘴27所吐出之糊狀物塗佈於底面 161(段差之下側的面)的邊緣部164邊際的部份時,反覆實行前述處理(S13~S15、S19、S20、S17、S18),進行控制使檢測值hm2為修正目標值htgc。此時,由於測定位置位於在垂直方向上較塗佈位置高段差深度值△1的位置,故進行控制使糊狀物吐出頭23a、23b相對於段差下側的面之塗佈面(底面161)的垂直方向相對位置實質上為前述目標值htg。In this way, the paste discharged from the nozzle 27 is applied to the bottom surface. When the margin of the edge portion 164 of the surface 161 (the surface on the side below the step) is reversed, the above-described processing (S13 to S15, S19, S20, S17, and S18) is repeatedly performed, and the detection value hm2 is controlled so as to be the correction target value htgc. At this time, since the measurement position is located at a position higher than the coating position height step depth value Δ1 in the vertical direction, the coated surface of the paste discharge heads 23a and 23b with respect to the lower side of the step is controlled (bottom surface 161). The vertical relative position of the ) is substantially the aforementioned target value htg.
之後,在形成於基板16之凹部160底面161沿著邊緣部165(參照第7圖)塗佈糊狀物30的過程中,由於測定位置位於段差之上側的面(表面16a),故與沿著邊緣部164塗佈糊狀物30的情況一樣,反覆進行步驟S13~S15、S19、S20、S17、S18的處理。此時,處理單元311參照段差情報表(參照第8圖),讀取出對應於各噴嘴27現在位置之段差的深度值△2(=△1),得到新的修正目標值htgc。藉此,控制噴嘴27前端對於作為段差上側的面之表面16a的垂直方向相對位置(檢測值hm2)為修正目標值htgc。亦即,進行控制使糊狀物吐出頭23a、23b相對於段差下側的面之塗佈面(底面161)的垂直方向相對位置實質上為前述目標值htg。此外,在形成於基板16之凹部160底面161沿著邊緣部162(參照第7圖)塗佈糊狀物30的過程中、以及接著以沿著邊緣部163從位置(xn,yn)至開始位置(x0,y0)的路徑塗佈糊狀物30的過程中,由於測定位置位於段差之下側的面(底面161),故處理單元311與沿著邊緣部163塗佈糊狀物30的情況一樣,反覆實行步驟S13~18的處理。藉此,進行控制使糊狀物吐出頭23a、23b之噴嘴27前端相對於塗佈面(底面161)的垂直方向 相對位置實質上為目標值htg。Thereafter, in the process of applying the paste 30 along the edge portion 165 (see FIG. 7) formed on the bottom surface 161 of the concave portion 160 of the substrate 16, since the measurement position is on the surface (surface 16a) on the upper side of the step, the edge is Similarly to the case where the paste portion 30 is applied to the edge portion 164, the processes of steps S13 to S15, S19, S20, S17, and S18 are repeatedly performed. At this time, the processing unit 311 refers to the step information table (see FIG. 8), and reads the depth value Δ2 (= Δ1) corresponding to the step difference between the current positions of the respective nozzles 27, and obtains a new correction target value htgc. Thereby, the vertical direction relative position (detected value hm2) of the tip end of the nozzle 27 as the upper surface of the step is controlled as the correction target value htgc. In other words, the relative position in the vertical direction of the coated surface (bottom surface 161) of the surface of the paste discharge heads 23a and 23b with respect to the lower side of the step is substantially the target value htg. Further, in the process of applying the paste 30 along the edge portion 162 (refer to FIG. 7) on the bottom surface 161 of the concave portion 160 of the substrate 16, and then starting from the position (xn, yn) along the edge portion 163 In the process of applying the paste 30 to the path of the position (x0, y0), since the measurement position is located on the side (the bottom surface 161) on the side below the step, the processing unit 311 and the paste 30 are applied along the edge portion 163. In the same manner, the processing of steps S13 to S18 is repeatedly executed. Thereby, the vertical direction of the tip end of the nozzle 27 of the paste discharge heads 23a and 23b with respect to the coated surface (bottom surface 161) is controlled. The relative position is essentially the target value htg.
在處理單元311進行前述處理的過程中,當判定測定位置為塗佈於段差下側的面(底面161)之糊狀物30上(參照第7圖之部份C)時(在S16為YES),則處理單元311將此時之檢測值hm設為不正確者,維持之前所得之控制值S(S21)。然後,處理單元311根據所維持之控制值S,進行噴嘴27前端對於塗佈面(底面161)之垂直方向相對位置的控制(S18)。When the processing unit 311 performs the above-described processing, it is determined that the measurement position is applied to the paste 30 of the surface (bottom surface 161) on the lower side of the step (refer to part C of FIG. 7) (YES at S16) Then, the processing unit 311 sets the detected value hm at this time to be incorrect, and maintains the previously obtained control value S (S21). Then, the processing unit 311 controls the relative position of the tip end of the nozzle 27 to the vertical direction of the coated surface (the bottom surface 161) based on the maintained control value S (S18).
在上述處理過程中,處理單元311藉由載具22a、22b(糊狀物吐出頭23a、23b之各噴嘴27)回到開始位置(x0,y0),判定對於基板16之糊狀物30塗佈結束(在S13為YES),則結束處理。在此時點,糊狀物30如第11及12圖所示,呈沿著形成於基板16之凹部160底面161之各邊緣部162~165的邊際部分塗佈的狀態。In the above processing, the processing unit 311 returns to the start position (x0, y0) by the carriers 22a, 22b (the nozzles 27 of the paste discharge heads 23a, 23b), and determines that the paste 30 is applied to the substrate 16. When the cloth ends (YES at S13), the processing ends. At this time, as shown in FIGS. 11 and 12, the paste 30 is applied along the marginal portion of each of the edge portions 162 to 165 formed on the bottom surface 161 of the concave portion 160 of the substrate 16.
根據如前所述之糊狀物塗佈裝置10,在形成於基板16之凹部160底面161(段差之下側的面)之各邊緣部162~165的邊際部分塗佈糊狀物30的過程中,當測定位置與塗佈位置同樣位於段差下側的面之凹部160的底面161的狀況(邊緣部163、162之邊際的糊狀物30塗佈)下,進行控制使各糊狀物吐出頭23a、23b對於糊狀物30塗佈面之垂直方向相對位置的檢測值hm(第11圖中為hm1)成為目標值htg。藉此,可使糊狀物吐出頭23a、23b之噴嘴27前端部與塗佈糊狀物30之底面161(段差之下側的面)之間的間距值Gp(參照第11圖)保持為一定(目標值htg)。The process of applying the paste 30 to the marginal portion of each of the edge portions 162 to 165 formed on the bottom surface 161 (the surface on the lower side of the step) of the concave portion 160 of the substrate 16 according to the paste coating device 10 as described above In the case where the measurement position and the application position are also located on the bottom surface 161 of the concave portion 160 on the lower surface of the step (the paste 30 on the edge of the edge portions 163 and 162 is applied), the paste is discharged. The detected value hm (h1 in Fig. 11) of the heads 23a and 23b with respect to the relative position in the vertical direction of the coated surface of the paste 30 becomes the target value htg. Thereby, the pitch value Gp (refer to FIG. 11) between the tip end portion of the nozzle 27 of the paste discharge heads 23a and 23b and the bottom surface 161 of the application paste 30 (the surface on the lower side of the step) can be maintained as Certain (target value htg).
又,在測定位置位於與塗佈位置不同的段差上側的 面、亦即表面16a的狀況下,目標值htg為對於以段差下側的面為基準之檢測值hm1的目標值,即使檢測值hm係以表面16a為基準之值,前述目標值htg也可使用段差之深度值△1(△2)而變成與前述檢測值hm一樣以段差上側的面為基準之值的修正目標值htgc,故控制糊狀物吐出頭23a、23b之噴嘴27的垂直方向位置以使前述檢測值tm成為修正目標值htgc,藉此進行控制使噴嘴前端對於底面161之垂直方向相對位置實質上成為前述目標值htg。藉此,可將糊狀物吐出頭23a、23b之噴嘴27前端部與塗佈糊狀物30之底面161(段差之下側的面)之間的間距值Gp(參照第11圖)為一定(目標值htg)。Moreover, the measurement position is located on the upper side of the step different from the coating position. In the case of the surface, that is, the surface 16a, the target value htg is a target value of the detection value hm1 based on the surface on the lower side of the step, and even if the detected value hm is based on the surface 16a, the target value htg may be used. The depth value Δ1 (Δ2) of the step is used to change the vertical direction of the nozzle 27 of the paste discharge heads 23a and 23b, which is the correction target value htgc which is the value based on the upper side of the step difference. The position is such that the detected value tm is the correction target value htgc, and the relative position of the nozzle tip end in the vertical direction with respect to the bottom surface 161 is substantially the target value htg. Thereby, the pitch value Gp (refer to FIG. 11) between the tip end portion of the nozzle 27 of the paste discharge heads 23a and 23b and the bottom surface 161 of the application paste 30 (the surface on the side below the step) can be made constant. (target value htg).
如此一來,根據前述之糊狀物塗佈裝置10,即使在測定位置及塗佈位置雙方皆位於段差下側的面(底面161)的狀況下、或是在測定位置與塗佈位置不同而位於上側的面(表面16a)的狀況下,噴嘴27的前端與塗佈糊狀物30之基板16上的面(形成於表面16a之段差的底面161)的間隔保持為一定,因此可確實地將糊狀物30塗佈於於表面16a形成有斷差(凹部)的基板16之該表面16a。According to the above-described paste application device 10, even when both the measurement position and the application position are located on the lower surface (the bottom surface 161) of the step, or the measurement position and the application position are different, In the case of the upper surface (surface 16a), the distance between the tip end of the nozzle 27 and the surface on the substrate 16 on which the paste 30 is applied (the bottom surface 161 formed on the surface 16a) is kept constant, so that it is surely The paste 30 is applied to the surface 16a of the substrate 16 on which the step (concave portion) is formed on the surface 16a.
另外,在前述糊狀物塗佈裝置10中,當測定位置位於段差上側的面之表面16a時,將目標值htg根據段差深度值△1(△2)進行修正而得到修正目標值htgc,但也可將位於段差上側的面(表面16a)之測定位置的檢測值hm,根據段差深度值△1(△2),修正為以糊狀物30塗佈面之段差下側的面(底面161)為基準的值(hmc=hm+△1(△2)),而得出該修正檢測值 hmc。此時,控制各糊狀物吐出頭23a、23b之噴嘴27的垂直方向位置,使修正檢測值hmc為目標值htg。結果,可使糊狀物吐出頭23a、23b之噴嘴27前端部與塗佈糊狀物30之底面161(段差下側的面)之間的間距值Gp(參照第11圖)為一定(目標值htg)。Further, in the paste application device 10, when the measurement position is on the surface 16a of the surface on the upper side of the step, the target value htg is corrected based on the step depth value Δ1 (Δ2) to obtain the correction target value htgc, but The detected value hm of the measurement position of the surface (surface 16a) on the upper side of the step can be corrected to the lower side of the step of the coated surface of the paste 30 (the bottom surface 161) based on the step depth value Δ1 (Δ2). ) is the reference value (hmc=hm+△1(△2)), and the corrected detection value is obtained. Hmc. At this time, the position in the vertical direction of the nozzles 27 of the respective paste discharge heads 23a and 23b is controlled so that the correction detection value hmc is the target value htg. As a result, the pitch value Gp (see Fig. 11) between the tip end portion of the nozzle 27 of the paste discharge heads 23a and 23b and the bottom surface 161 of the application paste 30 (the surface on the lower side of the step) can be made constant (target) Value htg).
又,也可將檢測值與目標值之差值(htg-hm),根據段差深度值△1(△2),修正為以段差上側的面及下側的面中任一面為基準之值的檢測值與目標值的差,再從該修正差{(htg-△1)-hm}或{htg-(hm+△1)}而得到控制值S。此時,控制各糊狀物吐出頭23a、23b之噴嘴27的垂直方向位置,使修正差為零。結果,可使糊狀物吐出頭23a、23b之噴嘴27前端部與塗佈糊狀物30之底面161(段差下側的面)之間的間距值Gp(參照第11圖)為一定(目標值htg)。Further, the difference (htg-hm) between the detected value and the target value may be corrected to a value based on any one of the upper surface and the lower surface of the step difference based on the step depth value Δ1 (Δ2). The difference between the detected value and the target value is obtained from the corrected difference {(htg - Δ1) - hm} or {htg - (hm + Δ1)}. At this time, the position in the vertical direction of the nozzles 27 of the respective paste discharge heads 23a and 23b is controlled so that the correction difference is zero. As a result, the pitch value Gp (see Fig. 11) between the tip end portion of the nozzle 27 of the paste discharge heads 23a and 23b and the bottom surface 161 of the application paste 30 (the surface on the lower side of the step) can be made constant (target) Value htg).
另外,在上述實施型態中,係依邊緣部162~165的單位切換段差深度值而進行說明,但實際上,由於測定位置係對於塗佈位置(噴嘴27的中心位置)分別依X方向與Y方向位移距離d而配置,故測定位置為從沿著邊緣部163描畫之途中位置(xi,yi)的距離d前方、從底面161上變成表面16a上,並從沿著邊緣部162描畫之途中位置(xk,yk)移動距離d後、從表面16a上變成底面161上。因此,也可事先在段差情報表(參照第8圖)上設定包含上述之位置(x,y)與段差(深度值)的資料。Further, in the above-described embodiment, the step depth value is switched in accordance with the unit of the edge portions 162 to 165. Actually, the measurement position is based on the X position with respect to the application position (the center position of the nozzle 27). Since the Y direction is displaced by the distance d, the measurement position is forward from the bottom surface 161 to the front surface 16a from the position d (xi, yi) along the edge portion 163, and is drawn from the edge portion 162. When the intermediate position (xk, yk) is moved by the distance d, it becomes the bottom surface 161 from the surface 16a. Therefore, the data including the above position (x, y) and the step (depth value) may be set in advance in the step information table (see Fig. 8).
又,事先將段差深度值作為段差情報表(參照第8圖)記憶於記憶部312,以對應於各糊狀物吐出頭23a、23b之噴嘴 27之各位值,但段差深度值若本來就為一定之值、亦即若可得出凹部160加工精度無損於間距控制之精度的程度,則無須對應於各位置而事先記憶。此時,糊狀物塗佈裝置10之處理單元311可將該一定值之段差深度值保持為用以演算修正目標值htgc之定數。Further, the step depth value is previously stored in the memory unit 312 as a step difference information table (see Fig. 8) so as to correspond to the nozzles of the paste discharge heads 23a and 23b. The value of each of the values of 27, but the depth value of the step is a certain value, that is, if the processing accuracy of the concave portion 160 is not degraded to the accuracy of the pitch control, it is not necessary to memorize the position corresponding to each position. At this time, the processing unit 311 of the paste coating device 10 can maintain the step depth value of the certain value as a fixed number for calculating the correction target value htgc.
另外,此時,當比較使用雷射變位感測器28a、28b之檢測值hm的前次測定時之值與本次測定時之值,該差(差的絕對值)與保持為段差深度值之值(定數)一致、或在可容許範圍內為一致時,可判斷雷射變位感測器28a、28b之測定位置從段差下側的面切換至上側的面、或從段差上側的面切換至下側的面。而且,在判斷該切換之前,若未使用上述定數,在判斷為切換後,可使用上述定數;而在判斷該切換前,若使用上述定數,則在切換判斷後可停止使用上述定數。Further, at this time, when the value of the previous measurement using the detected value hm of the laser displacement sensors 28a, 28b is compared with the value at the time of the current measurement, the difference (absolute value of the difference) is kept at the depth of the step. When the values (fixed numbers) are identical or coincident within the allowable range, it can be determined that the measurement position of the laser displacement sensors 28a, 28b is switched from the lower side of the step to the upper side or from the upper side of the step. The face is switched to the lower face. Further, before determining the switching, if the predetermined number is not used, the predetermined number may be used after determining that the switching is performed; and if the predetermined number is used before determining the switching, the use of the above setting may be stopped after the switching determination. number.
又,已說明由雷射變位感測器28a、28b之輸出值算出噴嘴27前端與基板表面16a之間的垂直方向相對距離而作為檢測值hm,並控制噴嘴27之垂直方向位置以使該檢測值hm為目標值htg,但並不限定於此,也可對於雷射變位感測器28a、28b的輸出值設定目標值,控制噴嘴27之垂直方向位置以使雷射變位感測器28a、28b的輸出值為目標值。此時,將對於雷射變位感測器28a、28b之輸出值所設定的目標值因應塗佈位置與測定位置之間的深度值而進行修正。Further, it has been explained that the relative distance between the tip end of the nozzle 27 and the substrate surface 16a is calculated as the detected value hm from the output values of the laser displacement sensors 28a and 28b, and the vertical direction position of the nozzle 27 is controlled so that the The detected value hm is the target value htg, but is not limited thereto, and the target value may be set for the output values of the laser displacement sensors 28a and 28b, and the vertical position of the nozzle 27 may be controlled to cause the laser displacement sensing. The output values of the devices 28a, 28b are target values. At this time, the target value set for the output values of the laser displacement sensors 28a and 28b is corrected in accordance with the depth value between the application position and the measurement position.
另外,在前述本發明的實施型態中,係有噴嘴27之糊狀物塗佈位置的面(糊狀物之塗佈面)為段差之下側的面,雷 射變位感測器28a、28b之測定位置切換於前述段差之下側的面與上側的面者,但本發明並不限定於此,也可為糊狀物之塗佈面為前述段差之上側的面,而測定位置為切換於前述段差之上側的面與下側的面者。Further, in the above-described embodiment of the present invention, the surface of the nozzle 27 where the paste is applied (the coated surface of the paste) is the surface on the lower side of the step, and the The measurement position of the radiation displacement sensors 28a and 28b is switched to the surface on the lower side of the step and the upper surface. However, the present invention is not limited thereto, and the coated surface of the paste may be the aforementioned step. The upper surface is measured, and the measurement position is the surface that is switched to the upper side of the step and the lower side.
此外,在前述之本發明的實施型態中,係段差之深度值為1種者,但本發明非限定於此者,也可為當對於塗佈面塗佈糊狀物時,測定位置移動於具有不同的2種以上之深度值的段差面上者。例如,在從糊狀物塗佈開始的預定區間內,測定位置位於與塗佈面同一面上,而在該預定區間的下一個區間內,測定位置位於較塗佈面高預定深度值的段差面上,而在更下一個區間內,則測定位置位於較塗佈面低預定深度值之段差面上,即使在上述情況下,藉由在如第8圖所示之段差情報表設定與塗佈位置對應之段差的深度值,即可正確地在塗佈面塗佈糊狀物。Further, in the above-described embodiment of the present invention, the depth value of the step difference is one type, but the present invention is not limited thereto, and the positional movement may be measured when the paste is applied to the coated surface. For segments with different depth values of more than 2 types. For example, in a predetermined interval from the application of the paste, the measurement position is on the same side as the coated surface, and in the next interval of the predetermined interval, the measurement position is located at a step height higher than the coated surface by a predetermined depth value. On the surface, and in the next interval, the measurement position is on the step surface of the predetermined depth value lower than the coated surface, even in the above case, by setting and coating the difference information table as shown in FIG. The depth value of the step corresponding to the position of the cloth can correctly apply the paste on the coated surface.
前述糊狀物塗佈裝置10係於有機EL顯示元件之基板16塗佈糊狀物30以作為乾燥劑者,但本發明並不限定於此,若為在表面形成有段差之基板塗佈糊狀物者,即無須特別限定。The paste application device 10 is a method in which the paste 30 is applied to the substrate 16 of the organic EL display device as a desiccant. However, the present invention is not limited thereto, and is a substrate coating paste having a step formed on the surface. The object is not particularly limited.
如以上所說明,本發明之糊狀物塗佈裝置具有可在表面形成有段差之基板的該表面確實地塗佈糊狀物的效果,可使用於作為一種糊狀物塗佈裝置,係具有相對於載置於基板而配置、且可將糊狀物向前述基板表面吐出糊狀物之糊狀物吐出機構,並且可將來自於該糊狀物吐出機構之糊 狀物塗佈於前述基板表面的預定部位者。As described above, the paste coating apparatus of the present invention has an effect of reliably applying a paste to the surface of the substrate having a step formed on the surface thereof, and can be used as a paste coating apparatus having a paste discharge mechanism that is disposed on the substrate and that can discharge the paste to the surface of the substrate, and can be used to paste the paste from the paste discharge mechanism The object is applied to a predetermined portion of the surface of the substrate.
10‧‧‧糊狀物塗佈裝置10‧‧‧Battery coating device
11‧‧‧基座11‧‧‧Base
12‧‧‧Y平台12‧‧‧Y platform
13‧‧‧Y伺服馬達13‧‧‧Y servo motor
14‧‧‧旋轉機構14‧‧‧Rotating mechanism
15‧‧‧平台15‧‧‧ platform
16‧‧‧基板16‧‧‧Substrate
16a‧‧‧基板表面16a‧‧‧Substrate surface
20‧‧‧保持體20‧‧‧ Keeping body
20a、20b‧‧‧足部20a, 20b‧‧‧foot
20c‧‧‧橫跨部20c‧‧‧cross section
21‧‧‧導軌21‧‧‧ rails
22a、22b‧‧‧載具22a, 22b‧‧‧ Vehicles
23a、23b‧‧‧糊狀物吐出頭(糊狀 物吐出機構)23a, 23b‧‧ ‧ mash spit out (mush Object spitting agency)
24a、24b‧‧‧Z伺服馬達24a, 24b‧‧‧Z servo motor
25a、25b‧‧‧X伺服馬達25a, 25b‧‧‧X servo motor
26‧‧‧注射器26‧‧‧Syringe
27‧‧‧噴嘴27‧‧‧Nozzles
28a、28b‧‧‧雷射變位感測器28a, 28b‧‧‧ laser displacement sensor
30‧‧‧糊狀物30‧‧‧Batter
31‧‧‧控制裝置31‧‧‧Control device
32‧‧‧顯示部32‧‧‧Display Department
33‧‧‧操作部33‧‧‧Operation Department
35a、35b‧‧‧攝影機單元35a, 35b‧‧‧ camera unit
160‧‧‧凹部160‧‧‧ recess
161‧‧‧底面161‧‧‧ bottom
162~165‧‧‧邊緣部162~165‧‧‧Edge
281‧‧‧發光器281‧‧‧ illuminator
282‧‧‧受光器282‧‧‧receiver
311‧‧‧處理單元311‧‧‧Processing unit
312‧‧‧記憶部312‧‧‧ Memory Department
A‧‧‧細虛線A‧‧‧fine dotted line
B‧‧‧粗虛線B‧‧‧Dough dotted line
C‧‧‧部分C‧‧‧ Section
d‧‧‧距離D‧‧‧distance
Gp‧‧‧間距Gp‧‧‧ spacing
Pp‧‧‧塗佈位置Pp‧‧‧ Coating location
Ps‧‧‧測定位置Ps‧‧‧Measurement position
第1圖係顯示本發明實施型態之糊狀物塗佈裝置之機械構造的立體圖。Fig. 1 is a perspective view showing a mechanical structure of a paste application device according to an embodiment of the present invention.
第2圖係顯示第1圖所示之糊狀物塗佈裝置中之糊狀物吐出頭與雷射變位感測器的位置關係、與前述糊狀物吐出頭之糊狀物塗佈位置與雷射變位感測器之測定位置的位置關係的圖。Fig. 2 is a view showing the positional relationship between the paste discharge head and the laser displacement sensor in the paste application device shown in Fig. 1, and the paste application position of the paste discharge head. A map of the positional relationship with the measured position of the laser displacement sensor.
第3圖係顯示第1圖所示之糊狀物塗佈裝置中之糊狀物塗佈位置與雷射變位感測器之測定位置在水平面內的位置關係的圖。Fig. 3 is a view showing the positional relationship between the paste application position in the paste application device shown in Fig. 1 and the measurement position of the laser displacement sensor in the horizontal plane.
第4圖係顯示糊狀物塗佈裝置之控制裝置的構成例的方塊圖。Fig. 4 is a block diagram showing a configuration example of a control device of the paste coating device.
第5圖係顯示塗佈糊狀物之基板的詳細構造例的立體圖。Fig. 5 is a perspective view showing a detailed structural example of a substrate on which a paste is applied.
第6圖係顯示第5圖所示之基板的糊狀物塗佈軌跡及測定位置軌跡之例的圖。Fig. 6 is a view showing an example of a paste application trajectory and a measurement position trajectory of the substrate shown in Fig. 5.
第7圖係顯示指定第5圖所示之基板之糊狀物塗佈軌跡的位置情報及測定位置軌跡之例的圖。Fig. 7 is a view showing an example of specifying the positional information of the paste application trajectory of the substrate shown in Fig. 5 and the measurement position trajectory.
第8圖係顯示段差情報表之一例的圖。Fig. 8 is a view showing an example of a step difference information table.
第9圖係顯示放大糊狀物塗佈狀態的圖。Fig. 9 is a view showing a state in which the paste is applied.
第10圖係顯示糊狀物吐出頭之垂直方向位置控制的處理順序的流程圖。Fig. 10 is a flow chart showing the processing procedure of the vertical position control of the paste discharge head.
第11圖係顯示糊狀物吐出頭之垂直方向位置檢測值與 目標值的關係、與糊狀物之塗佈位置的圖。Figure 11 shows the vertical position detection value of the paste spit head and The relationship between the target value and the position of the paste application.
第12圖係顯示塗布糊狀物狀態之基板的立體圖。Fig. 12 is a perspective view showing a substrate in a state in which a paste is applied.
S11~S21‧‧‧步驟S11~S21‧‧‧Steps
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JP2009168404A JP5459833B2 (en) | 2009-07-17 | 2009-07-17 | Paste applicator |
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JP2002316082A (en) * | 2001-04-20 | 2002-10-29 | Shibaura Mechatronics Corp | Paste applying apparatus |
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JP2007152261A (en) | 2005-12-06 | 2007-06-21 | Shibaura Mechatronics Corp | Paste application apparatus, paste application method, and manufacturing method of display panel using it |
JP2007222762A (en) * | 2006-02-22 | 2007-09-06 | Shibaura Mechatronics Corp | Paste coating device |
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JP4758326B2 (en) * | 2006-11-21 | 2011-08-24 | 株式会社アルバック | Coating device |
JP2008146992A (en) * | 2006-12-08 | 2008-06-26 | Toshiba Matsushita Display Technology Co Ltd | Manufacturing method of display device |
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JP2009066576A (en) | 2007-09-18 | 2009-04-02 | Toshiba Corp | Coating apparatus and method of manufacturing display device |
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