TWI389744B - Method of controlling coating apparatus - Google Patents

Description

Method of controlling application equipment

The present invention relates to a method of controlling a coating apparatus, and more particularly to a nozzle and a sensor for controlling a seal dispenser for applying a sealant. The method of distance between.

A cathode ray tube (CRT) has been conventionally used as a display device. However, due to its disadvantages (eg, bulky and heavy), it is intended to include a liquid crystal display (LCD), a plasma display panel (PDP), an organic light emitting device (OLED), and the like. The market for flat panel displays is growing.

The flat panel display described above is typically fabricated by joining a pair of flat substrates. For example, in the case of a liquid crystal display panel, first, a lower substrate on which a plurality of thin film transistors and a pixel electrode are formed and color filters are formed thereon are formed. The upper substrate of the color filter and the common electrode. Next, the liquid crystal is dropped on the lower substrate, and a sealant is applied in the edge region of the lower substrate. Thereafter, the surface on which the pixel electrode is formed on the lower substrate and the surface on which the common electrode is formed on the upper substrate are positioned to face each other, attached together, and sealed to manufacture a liquid crystal display panel.

Application equipment is used to apply the sealant during the manufacturing process, and The device is intended to use a technique that precisely controls the gap between the sealant injection nozzle and the substrate. For example, when the gap between the substrate and the nozzle is very small, the width of the applied sealant pattern becomes wider, and the height of the pattern becomes lower. However, when the gap between the substrate and the nozzle is too large, the width of the pattern of the application material on the substrate becomes narrow, and sometimes the pattern of the application material may have a discontinuous section.

In the case where a sealant is applied on a substrate to form a pattern of an application material, when a surface of the substrate is uneven or an additional film layer is formed in a portion on the surface of the substrate, the gap between the nozzle and the substrate may be unintentionally changed. .

Accordingly, some of the recent applicator devices are configured to include a sensor for measuring the gap between the nozzle and the substrate. During application of the sealant, a sensor is used to periodically measure the gap between the nozzle and the substrate such that the gap between the substrate and the nozzle can be kept constant. Thereby, generation of defects in the pattern of the application material can be suppressed.

However, since the nozzle is combined with the sensor and mounted to the application device, the actual distance between the nozzle and the sensor becomes different from the original predetermined distance. The distance may change during any operation, such as changing a nozzle.

Due to the difference in distance between the nozzle and the gap sensor, the measurement point of the sensor may change. In this case, light emitted from the sensor may reach a non-determined base region, which results in a change in the pattern of the applied material. For example, due to the difference in distance between the nozzle and the sensor, the sensor may measure the gap between the substrate and the nozzle corresponding to the substrate region on which the film layer is applied, instead of measuring the correspondence between the substrate and the nozzle. The gap in the sealant application area of the substrate. Therefore, it is necessary to accurately measure the distance between the nozzle and the sensor.

In order to measure the distance between the nozzle and the sensor, additional devices such as a vision camera have typically been used. However, in this case, a visual camera for measuring the distance between the nozzle and the sensor should be additionally provided, which is accompanied by the disadvantage of an increase in cost for manufacturing the dispenser or an increase in volume of the device.

The present invention provides a method of controlling an applicator apparatus capable of measuring an optical spot and a coating material pattern by using a sensor that measures a distance between a substrate and an applicator member. The distance to enhance the accuracy of measuring the distance.

According to an exemplary embodiment, a control device includes a coating member for applying an application material on a substrate and a dispenser having a sensor for measuring a distance between the substrate and the application member. The method may include: forming an application material pattern on the substrate using the application member; and obtaining a change in the distance between the light spot and the application material pattern relative to the vertical position of the application member by irradiating light to the substrate using a sensor. Rate; based on the rate of change of the distance between the obtained spot and the applied material pattern with respect to the vertical position of the application member, calculating the spot and the coating relative to the vertical position of the application member to be used in the actual process The distance between the material patterns; the distance between the calculated light spot and the applied material pattern is compared with a preset distance value; and based on the comparison result, by controlling the distance between the sensor and the application member Controls the distance between the spot and the applied material pattern.

The light illuminated from the sensor can have a constant tilt angle in the range of 50 degrees to 70 degrees with respect to the substrate.

Forming the pattern of the application material on the substrate using the applicator member can include: controlling the vertical position of the application member to be the same as the vertical position of the application member intended to be used in the actual process; and forming a pattern of the application material.

Obtaining a rate of change of the distance between the spot and the application material pattern relative to the vertical position of the applicator member can include: raising or lowering the applicator member to position the applicator member in two or more relative to the substrate And at different locations; and measuring a distance between the spot relative to the corresponding vertical position of the applicator member and the pattern of the application material to obtain a distance between the spot and the pattern of the applied material relative to the vertical position of the applicator member Rate of change.

Calculating the spot and application relative to the vertical position of the applicator member used in the actual process using the distance between the spot at two or more different vertical positions of the applicator member and the pattern of the applied material The distance between the material patterns.

Assuming that the vertical position of the application member is denoted as H, and the distance between the spot relative to the vertical position of the application member and the pattern of the application material is expressed as X, the vertical position can be expressed as the equation H=AX+ B. The equation is used to calculate the distance between the spot of light and the pattern of applied material relative to the vertical position of the applicator member intended to be used in the actual process.

Measuring the distance between the spot relative to the respective vertical position of the applicator member and the pattern of the application material can include: controlling the vertical position of the applicator member; using a sensor to illuminate the light onto the substrate; illuminating from the sensor The first point on which the light spot formed by the light on the substrate is located is set as a reference coordinate on the virtual coordinate system; the center of the application material pattern is detected by moving the dispenser while continuously irradiating the light and using the light Point and mark on the virtual coordinate system Recording the center point; and calculating a difference between a reference coordinate set on the virtual coordinate system and a coordinate of a center point of the applied material pattern marked on the virtual coordinate system.

Detecting a center point of the application material pattern may include: moving the dispenser horizontally, and continuously illuminating the light using a sensor of the dispenser to detect a position having a maximum thickness of the application material pattern; and a position having a maximum thickness The center is set to the center point.

Alternatively, detecting the center point of the application material pattern may include: measuring a line width of the application material pattern using a sensor; and setting a center of the line width of the measured application material pattern as a center point.

During control of the vertical position of the applicator member, the vertical position of the applicator member is controlled to be higher than the vertical position of the applicator member that is intended to be used in the actual process.

The above described features and advantages of the present invention will be more apparent from the following description.

Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings. However, the invention may be embodied in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein. Rather, the exemplary embodiments are provided so that this disclosure will be thorough and complete, and the concept of the invention will be fully conveyed to those skilled in the art.

FIG. 1 is a schematic conceptual view illustrating an application device according to an exemplary embodiment. 2 is a cross-sectional view illustrating a dispenser in accordance with an exemplary embodiment.

Referring to FIGS. 1 and 2, an applicator apparatus according to an exemplary embodiment includes: a stage 100 on which the substrate 10 is placed; a dispenser 200 for applying the application material to the substrate placed on the stage; a driving unit 500, For raising and lowering the dispenser 200; a transfer unit 300 for horizontally transferring the stage 100 and the dispenser 200; and a control unit 400 for controlling the transfer unit 300, the stage 100 And dispenser 200. Although the sealant is used as the application material in the exemplary embodiment, it is not limited thereto, and various materials may be used as the application material.

The stage 100 is movable in the x and y directions to form a pattern of application material along the perimeter of the edge region of the substrate 10. Alternatively, the dispenser 200 can be moved in the x and y directions to apply the application material to the substrate 10, or both the station 100 and the dispenser 200 can be moved in the x and y directions to apply the application material. Or the table 100 can be moved in one direction while the dispenser 200 is moved in the other direction to apply the application material. The transfer unit 300 uses the motor or track to move the stage 100 and the dispenser 200. Another variety of components can be used to move station 100 and dispenser 200.

The dispenser 200 includes an application member 210, a sensor 220, and a supporting member 230. The application member 210 includes a syringe 212 in which a coating material (for example, a sealant) is stored, a body part 213 in which the syringe 212 is mounted and fixed, and a nozzle 211 disposed in the body portion 213. Below, the application material stored in the syringe 212 is applied to the substrate 10. The sensor 220 detects the distance between the nozzle 211 of the application member 210 and the substrate 10. The support member 230 is disposed between the application member 210 and the sensor 220 such that the sensor 220 can be mounted and secured to support member 230.

The nozzle 211 and syringe 212 of the applicator member 210 can be attached to and detachable from the body portion 213 to effect replacement of the nozzle 211 and the syringe 212. Additionally, the sensor 220 can be attached to and detachable from the support member 230, and the support member 230 can be attached to and detachable from the body portion 213 of the dispenser 210. The support member 230 to which the sensor is mounted and fixed and the body portion 213 of the dispenser 210 may be connected to each other using a coupling member (not shown) such as a screw. Thereby, the distance between the sensor 220 mounted to the support member 230 and the nozzle 211 can be controlled by controlling a coupling member (not shown).

The dispenser 200 applies the application material in the syringe 212 to the substrate 10 via the nozzle 211 as it moves in the x and y directions. At the same time, the sensor 220 measures the distance between the substrate 10 and the nozzle 211, and based on the measurement result, the dispenser 200 is moved in the upward and downward directions using the driving unit to keep the distance between the substrate 10 and the nozzle 211 constant. In this way, the pattern of the application material formed along the circumference of the edge of the substrate can be maintained in a uniform linear shape.

A sensor according to an exemplary embodiment uses, for example, a distance measuring sensor that utilizes a laser. Although not shown, this type of sensor includes a light emitting part (not shown) for transmitting distance measuring light toward the substrate 10; and a light receiving part (not shown) for receiving light emitted from a light emitting portion (not shown). Illuminate A portion (not shown) and a light receiving portion (not shown) may be integrally formed and spaced apart from each other by a predetermined distance.

As mentioned earlier, when the distance between the light spot irradiated from the sensor 220 to the substrate 10 and the pattern of the application material becomes beyond the preset distance value, a defect in the pattern of the applied material may be generated.

For the reason described, according to an exemplary embodiment, the distance between the light spot 203 irradiated from the sensor 220 and the application material pattern 202 is obtained before the application material pattern is actually formed on the substrate 10.

FIG. 3 is a flow chart illustrating a method of controlling an applicator member of a dispenser and a sensor, in accordance with an exemplary embodiment. 4 is a diagram illustrating the formation of an application material pattern on a test substrate using an applicator member of a dispenser, in accordance with an exemplary embodiment. 5 and 6 are views sequentially illustrating the measurement of the distance between the application material pattern and the light spot in the case where the vertical position of the application member is assumed to be H1. Fig. 7 is a view showing a texture of a material pattern and a light spot when the vertical position of the application member is H1. 8 and 9 are views sequentially illustrating the measurement of the distance between the application material pattern and the light spot in the case where the vertical position of the application member is assumed to be H2. Figure 10 is a diagram showing the coordinates of the applied material pattern and the light spot when the vertical position of the application member is H2.

Hereinafter, the distance between the control application member 210 and the sensor 220 will be explained with reference to FIGS. 3 to 10.

According to an exemplary embodiment, controlling the distance between the applicator member 210 and the sensor 220 includes positioning the test substrate 201 on the stage 100. As the test substrate 201, the same type of substrate as that used in the actual process can be used. Formed on the test substrate 201 as illustrated in FIGS. 3 and 4 The material pattern 202 is applied (step S100). The vertical position of the application member 210 is set to Ht, and the sealant is released from the application member 210 to form an application material pattern 202 for measuring the distance on the test substrate 201. As mentioned previously, according to an exemplary embodiment, the nozzle 211 of the application member 210 for releasing the application material is installed under the body portion 213, and the application material 202 is formed on the substrate 201 using the nozzle 211. Therefore, it may be preferable that the vertical position of the nozzle 211 of the application member 210 with respect to the substrate 201 is Ht. Ht is the same as the vertical position of the nozzle 211 used when forming the application material pattern 202 on the substrate during the actual process as illustrated in FIG. 1, which allows the application material pattern 202 to be formed under the same conditions as the actual process. On the test substrate 201. Ht can range from 20 microns to 70 microns. According to an exemplary embodiment, the application material pattern 202 is formed into a circular shape, and the distance between the application material pattern 202 and the light spot 203 is measured as illustrated in FIG. However, the present invention is not limited thereto, and the application material pattern 202 may be formed on the test substrate 201 in a predetermined rod (or strip) shape.

Thereafter, the rate of change of the distance between the light spot 203 and the application material pattern 202 with respect to the vertical position of the nozzle 211 is obtained using the sensor 220 (step S110). To this end, as illustrated in FIGS. 5 and 8, the vertical position of the nozzle 211 is set at two different positions H1 and H2, and the light spot 203 and the application material pattern with respect to the vertical positions H1 and H2 of the nozzle 211 are calculated. The distance between 202 is X1 and X2. The rate of change of the distance between the spot 203 and the spread material pattern 202 with respect to the vertical position of the nozzle 211 is obtained by the equation H = AX + B. H represents the vertical position of the nozzle 211, and X represents the distance between the spot 203 and the application material pattern 202. A and B are characterizations A coefficient of the rate of change of the distance between the application material pattern 202 and the light spot 203 with respect to the vertical position of the nozzle 211. In order to obtain the values of A and B, distances X1 and X2 between the light spot 203 and the application material pattern 202 with respect to the vertical positions H1 and H2 of the nozzle 211 are measured according to an exemplary embodiment. The measured values are applied to the equation H = AX + B to express the equation as H1 = AX1 + B and H2 = AX2 + B. The coefficients A and B can be obtained by solving the above simultaneous equations. In this way, the rate of change of the distance between the light spot 203 and the application material pattern 202 with respect to the vertical position of the nozzle 211 can be obtained.

A more detailed explanation will be given below.

As illustrated in FIG. 5, the drive unit 500 is used to raise and lower the dispenser 200 to position the nozzle 211 at a vertical position H1 relative to the test substrate 201. In other words, the distance between the test substrate 201 and the nozzle 211 is set to H1. It may be preferred that H1 is greater than Ht as described above. When the vertical position of the nozzle 211 is equal to or lower than Ht, it may be difficult to measure the distance between the light spot 203 and the application material pattern 202. That is, the nozzle 211 may scratch the test substrate 201 during the process of measuring the distance between the light spot 203 and the application material pattern, or the application material pattern 202 applied on the test substrate 201 may contaminate the end of the nozzle 211. .

Thereafter, light (eg, a laser) is irradiated onto the test substrate 201 using the sensor 220. The angle of inclination of the light irradiated from the sensor 220 with respect to the test substrate 201 may be in the range of 50 degrees to 70 degrees, and is preferably 60 degrees. According to an exemplary embodiment, as illustrated in FIG. 7, the point at which the light irradiated from the sensor 220 is initially incident to the substrate 201 is set to the origin (0, 0). It may be preferable to set the center point of the light spot 203 that is initially irradiated to the test substrate 201. Set to the origin (0,0).

Thereafter, the center point of the application material pattern 202 is searched. To this end, as illustrated in FIG. 6, the transfer unit 300 and the control unit 400 are used to horizontally transport the dispenser 200 while the sensor 220 is used to continuously illuminate the light to the test substrate 201. The center point of the application material pattern 202 can be searched by measuring the thickness of the application material pattern 202 to find the highest point. To this end, the dispenser 200 is transported as previously mentioned to find the region in which the sensor 220 displays the lowest output. The region where the sensor 220 displays the lowest output is set as the center point of the application material pattern 202.

Although not shown in the drawings, the center point of the application material pattern 202 can be found by measuring the line width of the application material pattern 202. Since the application material pattern 202 applied on the test substrate 201 is formed to have a substantially constant width, the line width of the application material pattern 202 can be measured by using the sensor 220 and the measured application material pattern can be measured. The center of the line width of 202 is set as the center point to find the center point of the application material pattern 202.

Next, as illustrated in FIG. 7, the center point (Xx, Yy) of the application material pattern 202 found using the sensor 220 is marked on the virtual coordinate system. On the virtual coordinate system, the center point of the spot 203 originally irradiated to the test substrate 201, that is, the origin (0, 0) is also marked. Therefore, the distance value between the light spot 203 and the application material pattern 202 can be calculated by detecting the origin (0, 0) where the center of the light spot 203 is located and the center point (Xx, Yy) of the application material pattern 202. X1. The distance value X1 between the light spot 203 and the application material pattern 202 corresponds to the vertical position H1 of the nozzle 211.

Next, the vertical position of the nozzle 211 is changed to H1 as described above. Different positions are calculated, and the distance value between the light spot 203 and the application material pattern 202 with respect to the changed vertical position is calculated.

Specifically, the transfer unit 500 is used to raise or lower the dispenser 200 until the vertical position of the nozzle 211 becomes H2, as illustrated in FIG. H2 may be greater than Ht described above and is different from H1. In an exemplary embodiment, H2 is set to be greater than H1. Next, the sensor 220 is used to illuminate the light onto the test substrate 201. As illustrated in FIG. 10, the point at which the light irradiated from the sensor 220 is initially incident on the test substrate 201 is set to the origin (0, 0). It may be preferable to set the center point of the light spot 203 originally irradiated to the test substrate 201 to the origin (0, 0).

Thereafter, the center point of the application material pattern 202 is searched. To this end, as illustrated in FIG. 9, the transfer unit 300 and the control unit 400 are used to horizontally transport the dispenser 200 while the sensor 220 is used to continuously illuminate the light to the test substrate 201. The center point of the application material pattern 202 can be searched by measuring the thickness of the application material pattern 202 to find the highest point. To this end, the dispenser 200 is transported as previously mentioned to find the region in which the sensor 220 displays the lowest output. The region where the sensor 220 displays the lowest output is set as the center point of the application material pattern 202.

Next, as illustrated in FIG. 10, the center point (Xx, Yy) of the application material pattern 202 found using the sensor 220 is marked on the virtual coordinate system. On the virtual coordinate system, the center of the spot 203 initially irradiated to the test substrate 201, that is, the origin (0, 0), is also marked. Therefore, the light spot 203 and the application material pattern 202 can be calculated by detecting the origin (0, 0) where the center of the light spot 203 is located and the center point (Xx, Yy) of the application material pattern 202. The distance value is X2. The distance value X2 between the light spot 203 and the application material pattern 202 corresponds to the vertical position H2 of the nozzle 211.

According to an exemplary embodiment, the vertical position of the nozzle 211 is set at different positions H1 and H2 to measure distance values X1 and X2 between the light spot 203 and the application material pattern 202 with respect to the respective positions H1 and H2. However, the present invention is not limited thereto, and the nozzle 211 may be controlled to be at two or more different vertical positions in order to calculate a distance value between the light spot 203 and the application material pattern 202 with respect to the vertical position of the nozzle 211. .

Once the distance value between the light spot 203 and the application material pattern 202 is measured with respect to the vertical positions H1 and H2 of the nozzle 211, the distance value between the light spot 203 and the application material pattern 202 can be obtained based on the measured value. The rate of change with respect to the vertical position of the nozzle 211. This can be expressed as the equation H = AX + B, where H represents the vertical position of the nozzle and X is the distance between the spot 203 and the application material pattern 202. A and B are coefficients that characterize the rate of change of the distance between the application material pattern 202 and the spot 203 with respect to the vertical position of the nozzle 211. In order to obtain the values of A and B, as described above, the distances X1 and X2 between the spot 203 and the application material pattern 202 with respect to the vertical positions H1 and H2 of the nozzle 211 are measured. The measured values are applied to the equation H = AX + B to express the equation as H1 = AX1 + B and H2 = AX2 + B. The coefficients A and B can be obtained by solving the above simultaneous equations. In this way, the rate of change of the distance between the light spot 203 and the application material pattern 202 with respect to the vertical position of the nozzle 211 can be obtained.

For example, when H1 is 500 um, X1 is 1.5 mm, H2 is 700 um, and X2 is 1.7 mm, the equation can be expressed as 500 um = 1.5 A. Mm+B and 700um=1.7A mm+B. By solving the simultaneous equation, A is calculated to be 1000, and B is calculated to be -1000. Therefore, the distance X between the light spot 203 with respect to H and the application material pattern 202 can be expressed as the equation H=1000X-1000. The values of A and B may vary depending on the distance between the nozzle 211 and the sensor 220.

Further, H in the equation (H = 1000X - 1000) is replaced with the vertical position Ht of the nozzle 211 which is intended to be used in the actual process to calculate the relationship between the light spot 203 irradiated onto the substrate 10 and the application material pattern 202. The distance Xt (step S120). For example, when the vertical position Ht of the nozzle 211 is 30 um in the actual process, according to the above equation, the distance Xt between the light spot 203 and the application material pattern 202 is calculated to be 1.03 mm.

After calculating the distance between the light spot 203 and the application material pattern 202 with respect to the vertical position of the nozzle 211 which is intended to be used in the actual process, the calculated value is compared with the preset distance value (step S130). If the two values are the same, then the adjustment of the distance between the spot 203 and the application material pattern 202 is completed. If the two values are different, the distance between the sensor and the application member is controlled to adjust the distance between the light spot 203 and the application material pattern 202 (step S140).

The distance between the light spot 203 and the application material pattern 202 can be adjusted by finely controlling the coupling member (not shown) of the support member 230 to which the connection sensor 220 is attached and the application member 210. A coupling member (not shown) connecting the support member 230 and the application member 210 may include an x-axis and a y-axis body in a thread shape, the body being combined with the support member 230 and the application member 210 to finely control the distance . That is, by rotating The main body, the support member 230 to which the sensor is mounted is movable. The member for finely controlling the distance is not limited thereto, and various members may be used. The distance between the nozzle 211 and the sensor 220 can be controlled by moving only the nozzle 211. Alternatively, both the nozzle 211 and the sensor 220 can be moved.

When the distance between the nozzle 211 and the sensor 220 is adjusted, the foregoing processes illustrated in FIGS. 4 to 10 are repeated. That is, the distance between the application material pattern 202 and the light spot 203 is measured by the adjusted distance between the nozzle 211 and the sensor 220.

As previously mentioned in the exemplary embodiment, the sensor 220 is used to obtain the distance between the light spot 203 and the application material pattern 202, and the sensor 220 and the application member 210 are controlled according to the measured values. The distance between them. Therefore, the distance between the light spot 203 and the application material pattern 202 can be measured without additional instruments, and the accuracy of measuring the distance can be improved.

An exemplary embodiment is illustrated for a method of controlling an application device for applying a sealant. However, the method is not limited thereto and can be applied to various types of application equipment.

As stated above, according to the previous embodiment, a sensor for measuring the distance between the substrate and the application member is used to measure the distance between the light spot and the pattern of the application material. The distance between the sensor and the applicator member can be controlled based on the measured value. In this way, the distance between the spot and the pattern of the applied material can be measured without additional instrumentation, and the accuracy of measuring the distance can be improved. Therefore, the distance between the substrate and the application member can be kept constant during the application of the application material, and defects in the pattern of the application material can be avoided.

In addition, the use of a sensor to measure the distance between the spot of light impinging on the substrate from the sensor and the nozzle without additional instrumentation can reduce the cost of manufacturing the dispenser.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10, 201‧‧‧ base

100‧‧‧

200‧‧‧Distributor

202‧‧‧Material material pattern

203‧‧‧ light spots

210‧‧‧Applying components

211‧‧‧ nozzle

212‧‧‧Syringe

213‧‧‧ body part

220‧‧‧ sensor

230‧‧‧Support parts

300‧‧‧Transfer unit

400‧‧‧Control unit

500‧‧‧ drive unit

S100~S140‧‧‧Steps

The exemplary embodiments may be understood in more detail in the following description in conjunction with the accompanying drawings in which: FIG. 1 is a schematic conceptual diagram illustrating an applicator apparatus in accordance with an exemplary embodiment.

2 is a cross-sectional view illustrating a dispenser in accordance with an exemplary embodiment.

FIG. 3 is a flow chart illustrating a method of controlling an applicator member of a dispenser and a sensor, in accordance with an exemplary embodiment.

4 is a diagram illustrating the formation of an application material pattern on a test substrate using an applicator member of a dispenser, in accordance with an exemplary embodiment.

5 and 6 are views sequentially illustrating the measurement of the distance between the application material pattern and the light spot in the case where the vertical position of the application member is assumed to be H1.

Fig. 7 is a view showing a texture of a material pattern and a light spot when the vertical position of the application member is H1.

8 and 9 are views sequentially illustrating the measurement of the distance between the application material pattern and the light spot in the case where the vertical position of the application member is assumed to be H2.

Figure 10 is a view showing the application material when the vertical position of the application member is H2 A diagram of the coordinates of the pattern and the light spot.

S100~S140‧‧‧Steps

Claims (10)

A method of controlling an applicator apparatus, the applicator apparatus comprising an applicator member for applying an applicator material to a substrate and sensing for measuring a distance between the substrate and the applicator member a dispenser comprising: forming an application material pattern on the substrate using the application member; obtaining a light spot and the application by irradiating light onto the substrate using the sensor a rate of change of the distance between the material patterns relative to the vertical position of the applicator member; based on the obtained distance between the spot and the applicator material pattern relative to the applicator member a rate of change of the vertical position, calculating a distance value between the spot and the applied material pattern relative to a vertical position of the applicator member intended to be used in an actual process; The distance value between the light spot and the application material pattern is compared with a preset distance value; and based on the comparison result, the distance is controlled by controlling the distance between the sensor and the application member Light spot and the coating The distance between the pattern material. The method of controlling an applicator device of claim 1, wherein the light illuminated from the sensor has a constant tilt angle in a range of 50 degrees to 70 degrees with respect to the substrate. The party that controls the application equipment as described in item 1 of the patent application scope The method of forming the application material pattern on the substrate using the application member includes: controlling the vertical position of the application member to be applied to the application member that is intended to be used in an actual process The vertical positions are the same; and the application material pattern is formed on the substrate. The method of controlling an application device according to claim 1, wherein the distance between the light spot and the application material pattern relative to the vertical position of the application member is obtained. The rate of change includes: raising or lowering the applicator member to position the applicator member at two or more different positions relative to the substrate; and measuring a corresponding position relative to the applicator member The distance between the spot of the vertical position and the pattern of applied material to obtain the distance between the spot and the pattern of applied material relative to the applicator member The rate of change of the vertical position. The method of controlling an applicator device according to claim 4, wherein the spot of the two or more different vertical positions of the applicator member and the pattern of the application material are used. The distance value between the distances is calculated relative to the distance between the spot of the vertical position of the applicator member used in the actual process and the pattern of applied material. A method of controlling an applicator apparatus according to claim 5, wherein the vertical position of the applicator member is assumed to be H, and the vertical position relative to the applicator member is The distance value between the light spot and the application material pattern is expressed as X, then the The vertical position is expressed as the equation H=AX+B, and the equation is used to calculate the spot and the coating material relative to the vertical position of the applicator member that is intended to be used in an actual process. The distance value between the patterns. The method of controlling an applicator device of claim 4, wherein the distance between the spot of the corresponding vertical position relative to the applicator member and the pattern of application material is measured Included: controlling the vertical position of the applicator member; using the sensor to illuminate light onto the substrate; forming the light from the sensor onto the substrate a point at which the light spot is initially located on the substrate is set as a reference coordinate on the virtual coordinate system; the center of the coating material pattern is detected by moving the dispenser while continuously illuminating the light and using the light a point, and marking the center point on the virtual coordinate system; and calculating the reference coordinate set on the virtual coordinate system and the coating material pattern marked on the virtual coordinate system The difference between the coordinates of the center point. The method of controlling an applicator device of claim 7, wherein detecting the center point of the application material pattern comprises: moving the dispenser horizontally, and using the sense of the dispenser The detector continuously irradiates light to detect a position of the application material pattern having a maximum thickness; and sets a center of the position having the maximum thickness as the center point. The method of controlling an application device according to claim 7, wherein detecting the center point of the application material pattern comprises: measuring a line width of the application material pattern using the sensor; And setting the center of the line width of the measured coating material pattern to the center point. The method of controlling an applicator device according to claim 7, wherein the controlling the vertical position of the applicator member is controlled to be higher than a predetermined one during control of the vertical position of the applicator member The vertical position of the applicator member used in the process.